公开(公告)号：US08461674B2

公开(公告)日：2013-06-11

申请号：US13238396

申请日：2011-09-21

申请人： Keith William Gaff ,  Keith Comendant ,  Anthony Ricci

发明人： Keith William Gaff ,  Keith Comendant ,  Anthony Ricci

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： F25B21/04 ,  H01L21/0201 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L35/34 ,  Y10T29/49083 ,  Y10T29/49165

摘要： A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.

摘要翻译： 一种用于半导体等离子体处理装置中的衬底支撑组件的热板，包括以可伸缩复用布局布置的多个可独立控制的平面热区，以及用于独立地控制和供电平面加热器区的电子装置。 每个平面热区使用至少一个珀耳帖装置作为热电元件。 其中结合热板的基板支撑组件包括静电夹持电极层和温度控制的基板。 用于制造热板的方法包括将具有平面热区域，正，负和公共线路和通孔的陶瓷或聚合物片材结合在一起。

公开(公告)号：US20130072035A1

公开(公告)日：2013-03-21

申请号：US13238396

申请日：2011-09-21

申请人： Keith William Gaff ,  Keith Comendant ,  Anthony Ricci

发明人： Keith William Gaff ,  Keith Comendant ,  Anthony Ricci

IPC分类号： H01L21/30 ,  H01C17/02 ,  H05B3/68

CPC分类号： F25B21/04 ,  H01L21/0201 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L35/34 ,  Y10T29/49083 ,  Y10T29/49165

摘要： A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.

摘要翻译： 一种用于半导体等离子体处理装置中的衬底支撑组件的热板，包括以可伸缩复用布局布置的多个可独立控制的平面热区，以及用于独立地控制和供电平面加热器区的电子装置。 每个平面热区使用至少一个珀耳帖装置作为热电元件。 其中结合热板的基板支撑组件包括静电夹持电极层和温度控制的基板。 用于制造热板的方法包括将具有平面热区域，正，负和公共线路和通孔的陶瓷或聚合物片材结合在一起。

公开(公告)号：US07431788B2

公开(公告)日：2008-10-07

申请号：US11183849

申请日：2005-07-19

申请人： Anthony Ricci ,  Jim Tappan ,  Keith Comendant

发明人： Anthony Ricci ,  Jim Tappan ,  Keith Comendant

IPC分类号： B32B37/00

CPC分类号： H01L21/76251 ,  H01L21/68757 ,  H01L21/68785

摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.

摘要翻译： 一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。 该方法包括以下步骤：用基板材料将基板支撑件的上部构件附接到基板支撑件的下部构件。 粘合剂被施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。 保护环最初由具有提供机械稳定性和可加工性的尺寸制成。 然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

公开(公告)号：US20070131350A1

公开(公告)日：2007-06-14

申请号：US11183849

申请日：2005-07-19

申请人： Anthony Ricci ,  Jim Tappan ,  Keith Comendant

发明人： Anthony Ricci ,  Jim Tappan ,  Keith Comendant

IPC分类号： B32B37/00

CPC分类号： H01L21/76251 ,  H01L21/68757 ,  H01L21/68785

摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.

摘要翻译： 一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。 该方法包括以下步骤：用基板材料将基板支撑件的上部构件附接到基板支撑件的下部构件。 粘合剂被施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。 保护环最初由具有提供机械稳定性和可加工性的尺寸制成。 然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

公开(公告)号：US20060144516A1

公开(公告)日：2006-07-06

申请号：US11027481

申请日：2004-12-30

申请人： Anthony Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： C23F1/00 ,  C23C16/00

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：US06408845B1

公开(公告)日：2002-06-25

申请号：US09081144

申请日：1998-05-19

申请人： Michael Pereira ,  Anthony Ricci ,  Pierre Legare

发明人： Michael Pereira ,  Anthony Ricci ,  Pierre Legare

IPC分类号： A61M1600

CPC分类号： A62B23/02 ,  A62B27/00 ,  Y10S55/33 ,  Y10S55/35 ,  Y10S137/908

摘要： An improved respirator filter assembly includes an integral fit seal check mechanism easily controlled by the user. Upon release, the seal check mechanism permits free airflow through the filter assembly. The seal check mechanism includes an air passageway having a sealing rim and a blocking member which is selectively movable between engaged and disengaged positions relative to the sealing rim. A spring element is disposed to releasably maintain the blocking member in the disengaged position during filter assembly operation, wherein a user may actuate the blocking member against the bias of the spring element to move the blocking member into the engaged position to substantially prevent entry of air into the air passageway during seal checking.

摘要翻译： 改进的呼吸器过滤器组件包括易于由使用者控制的一体式配合密封检查机构。 释放后，密封检查机构允许通过过滤器组件的自由气流。 密封检查机构包括具有密封边缘和阻挡构件的空气通道，该阻挡构件可相对于密封边缘在接合位置和脱离位置之间选择性地移动。 弹簧元件设置成在过滤器组装操作期间将阻挡构件可释放地保持在脱离位置，其中用户可以抵抗弹簧元件的偏压来致动阻挡构件，以将阻挡构件移动到接合位置以基本上防止空气进入 在密封检查期间进入空气通道。

公开(公告)号：US20110284505A1

公开(公告)日：2011-11-24

申请号：US12785774

申请日：2010-05-24

申请人： Anthony Ricci ,  Saurabh Ullal ,  Michael Kang ,  Matthew Busche

发明人： Anthony Ricci ,  Saurabh Ullal ,  Michael Kang ,  Matthew Busche

IPC分类号： B23K37/00

CPC分类号： H01L21/67248 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

摘要： A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T2 in fluid communication with the supply line and the return line, temperature T2 being at least 10° C. above temperature T1; a pre-cooling unit providing liquid at temperature Tpc connected to the inlet and the outlet, temperature Tpc being at least 10° C. below T1; a pre-heating unit providing liquid at temperature Tph connected to the inlet and the outlet, temperature Tph being at least 10° C. above T2; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.

摘要翻译： 一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口 与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与供应管线和回流管线流体连通的温度T1下提供液体; 第二再循环器在温度T2下提供与供应管线和返回管线流体连通的液体，温度T2在温度T1以上至少10℃; 预冷单元，其在连接到入口和出口的温度Tpc处提供液体，温度Tpc在T1以下至少10℃; 预热单元，其在连接到入口和出口的温度Tph下提供液体，温度Tph在T2以上至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

公开(公告)号：US08410393B2

公开(公告)日：2013-04-02

申请号：US12785774

申请日：2010-05-24

申请人： Anthony Ricci ,  Saurabh Ullal ,  Michael Kang ,  Matthew Busche

发明人： Anthony Ricci ,  Saurabh Ullal ,  Michael Kang ,  Matthew Busche

IPC分类号： B23K37/00

CPC分类号： H01L21/67248 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

摘要： A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T2 in fluid communication with the supply line and the return line, temperature T2 being at least 10° C. above temperature T1; a pre-cooling unit providing liquid at temperature Tpc connected to the inlet and the outlet, temperature Tpc being at least 10° C. below T1; a pre-heating unit providing liquid at temperature Tph connected to the inlet and the outlet, temperature Tph being at least 10° C. above T2; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.

摘要翻译： 一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口 与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与供应管线和回流管线流体连通的温度T1下提供液体; 第二再循环器在温度T2下提供与供应管线和返回管线流体连通的液体，温度T2在温度T1以上至少10℃; 预冷单元，其在连接到入口和出口的温度Tpc处提供液体，温度Tpc在T1以下至少10℃; 预热单元，其在连接到入口和出口的温度Tph下提供液体，温度Tph在T2以上至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

公开(公告)号：US20120024449A1

公开(公告)日：2012-02-02

申请号：US12844527

申请日：2010-07-27

申请人： Anthony Ricci ,  Saurabh Ullal ,  Larry Martinez

发明人： Anthony Ricci ,  Saurabh Ullal ,  Larry Martinez

IPC分类号： B32B37/02 ,  H01L21/306 ,  C23F1/00 ,  C23C14/34 ,  C23C16/00

CPC分类号： H01L21/67069 ,  C23C16/4404 ,  H01J37/32477 ,  H01J37/32798 ,  H01L21/6833 ,  Y10T156/10

摘要： Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

摘要翻译： 可以通过用套筒覆盖空隙内部的导电表面来消除等离子体处理室的部件中空隙中的寄生等离子体。 空隙可以是诸如上电极和基板支撑件的室部件中的气孔，提升销孔，氦通道，导管和/或增压室。

公开(公告)号：US20190024970A1

公开(公告)日：2019-01-24

申请号：US15656120

申请日：2017-07-21

申请人： Franco Sapia ,  Anthony Ricci

发明人： Franco Sapia ,  Anthony Ricci

IPC分类号： F25D31/00 ,  F25D3/08 ,  A47G23/02 ,  A47G23/06

摘要： A beverage cooling apparatus for imparting coldness to beverage containers includes a base having a planar configuration and having a pair of side walls extending upwardly from ends of the base. The apparatus includes a guide member that includes first and second end portions and defining a plurality of apertures spaced apart from one another between the first and second end portions thereof that are configured to selectively receive and suspend the plurality of beverage containers, respectively. The first and second end portions of the guide member are coupled to upper ends of the side walls of the cooling member, respectively. The cooling member includes a temperature transfer material that transfers hot or cold heat energy to beverage containers suspended in apertures, respectively, such that they touch or are in proximity to the cooling member. The cooling member is separable from the guide member and re-frozen for later use.