公开(公告)号：US5774334A

公开(公告)日：1998-06-30

申请号：US520338

申请日：1995-08-28

申请人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

发明人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

摘要翻译： 半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

公开(公告)号：US5270572A

公开(公告)日：1993-12-14

申请号：US903458

申请日：1992-06-24

申请人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

公开(公告)号：US5705850A

公开(公告)日：1998-01-06

申请号：US290155

申请日：1994-08-15

申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H01L21/10 ,  H01L23/34 ,  H02B1/00 ,  H02B1/01

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

摘要翻译： 所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。 为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。 散热器一体地形成在壳体上。 利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

公开(公告)号：US5406807A

公开(公告)日：1995-04-18

申请号：US77109

申请日：1993-06-16

申请人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

发明人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

IPC分类号： H01L23/427 ,  F25D17/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10S165/908

摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

摘要翻译： 一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。 由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

公开(公告)号：US5959351A

公开(公告)日：1999-09-28

申请号：US103227

申请日：1993-08-09

申请人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

发明人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  F15D1/08 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34

CPC分类号： F15D1/08 ,  H01L23/473 ,  F28F13/02 ,  H01L2924/0002

摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

摘要翻译： 公开了一种液冷电子装置。 半导体器件安装在浸没在冷却液中的半导体模块的衬底上。 在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。 通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在 开始半导体器件通电的时间，从而稳定半导体器件的温度。

公开(公告)号：US5592363A

公开(公告)日：1997-01-07

申请号：US128227

申请日：1993-09-29

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

摘要翻译： 在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。 喷嘴与散热器相关联，以将冷却流体供应到散热器中。 散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。 在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。 在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。 相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

公开(公告)号：US5504651A

公开(公告)日：1996-04-02

申请号：US220256

申请日：1994-03-30

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.

摘要翻译： 电子设备具有冷却结构，其中可以在没有泄漏的情况下回收从散热器排出的空气，并且在狭窄的空间中设置紧凑的吹气管道和排放管道。 用于冷却空气的供给开口和排出口独立地形成在散热器中。 多个供应分支管道和排出分支管道沿着管道的轴线组合成梳状形状。 在每个供应分支管道上，在对应于每个散热器的位置中形成用于冷却空气的喷射开口。 这样的喷射开口紧密地连接到用于冷却散热器的空气的供应开口。 另一方面，冷却空气的回收开口形成在与各散热器对应的位置上的每个制冷剂排出管上。 这种回收开口与散热器的气体制冷剂的排出口紧密连接。

公开(公告)号：US5488255A

公开(公告)日：1996-01-30

申请号：US162265

申请日：1993-12-07

申请人： Kazuo Sato ,  Mitsuhiro Shikida ,  Shigeo Ohashi ,  Toshio Hatada ,  Noriyuki Ashiwake ,  Shinji Tanaka ,  Takeshi Harada ,  Yukio Honda

发明人： Kazuo Sato ,  Mitsuhiro Shikida ,  Shigeo Ohashi ,  Toshio Hatada ,  Noriyuki Ashiwake ,  Shinji Tanaka ,  Takeshi Harada ,  Yukio Honda

IPC分类号： F04B43/04 ,  F04B45/047 ,  H01L23/467 ,  H02N1/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  F04B43/043 ,  F04B45/047 ,  H02K99/20 ,  H02N1/006 ,  H01L2924/0002 ,  H01L2924/15192

摘要： A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.

摘要翻译： 根据本发明的冷却装置，其中通过平面电极和设置在平坦电极的端部上的侧板形成空间，并且固定在该空间中的具有字母S的形状的柔性膜被固定 到半导体封装，使得一个平板电极安装在半导体封装上。 各个扁平电极交替供电以移动柔性膜的S形部分。

公开(公告)号：US5558493A

公开(公告)日：1996-09-24

申请号：US477653

申请日：1995-06-07

申请人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

发明人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

IPC分类号： F25D1/00 ,  C04B28/18 ,  F04D29/42 ,  H05K7/20 ,  F04D29/66

CPC分类号： F04D29/4213

摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.

摘要翻译： 一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中， 装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。 通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面 的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

公开(公告)号：US5077601A

公开(公告)日：1991-12-31

申请号：US404350

申请日：1989-09-07

申请人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

发明人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

IPC分类号： H01L23/467

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

摘要翻译： 一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。 冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。 当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。 流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道 冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。