Nonvolatile variable resistance memory element writing method, and nonvolatile variable resistance memory device
    1.
    发明授权
    Nonvolatile variable resistance memory element writing method, and nonvolatile variable resistance memory device 有权
    非易失性可变电阻存储元件写入方法和非易失性可变电阻存储器件

    公开(公告)号:US08305795B2

    公开(公告)日:2012-11-06

    申请号:US12999019

    申请日:2010-04-27

    IPC分类号: G11C11/00

    摘要: To provide a variable resistance element writing method that, even when a variable resistance element has a possibility of becoming a half LR state, can ensure a maximum resistance change window by correcting the variable resistance element to a normal low resistance state. In a method of writing data to a variable resistance element (10a) that reversibly changes between a high resistance state and a low resistance state according to a polarity of an applied voltage, as a voltage applied to an upper electrode (11) with respect to a lower electrode (14t): a positive voltage is applied in a high resistance writing step (405) to set the variable resistance element (10a) to a high resistance state (401); a negative voltage is applied in a low resistance writing step (406, 408) to set the variable resistance element (10a) to a low resistance state (403, 402); and a positive voltage is applied in a low resistance stabilization writing step (404) after the negative voltage is applied in the low resistance writing step (408), thereby setting the variable resistance element (10a) through the low resistance state to the high resistance state (401).

    摘要翻译: 为了提供可变电阻元件写入方法,即使当可变电阻元件具有成为半LR状态的可能性时,通过将可变电阻元件校正为正常的低电阻状态来确保最大电阻变化窗口。 在根据施加电压的极性将数据写入到可变电阻元件(10a)的方法中,可变电阻元件(10a)根据施加电压的极性在高电阻状态和低电阻状态之间可逆地变化,作为施加到上电极(11)的电压相对于 下电极(14t):在高电阻写入步骤(405)中施加正电压以将可变电阻元件(10a)设置为高电阻状态(401); 在低电阻写入步骤(406,408)中施加负电压以将可变电阻元件(10a)设置为低电阻状态(403,402); 并且在低电阻写入步骤(408)中施加负电压之后,在低电阻稳定写入步骤(404)中施加正电压,从而将可变电阻元件(10a)设置为低电阻状态为高电阻 州(401)。

    Writing method for variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device
    2.
    发明授权
    Writing method for variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device 有权
    可变电阻非易失性存储元件和可变电阻非易失性存储器件的写入方法

    公开(公告)号:US08325508B2

    公开(公告)日:2012-12-04

    申请号:US13001905

    申请日:2010-06-08

    IPC分类号: G11C11/00

    摘要: A writing method optimum for a variable resistance element which can maximize an operation window of the variable resistance element is provided. The writing method is performed for a variable resistance element that reversibly changes between a high resistance state and a low resistance state depending on a polarity of an applied voltage pulse. The writing method includes a preparation step (S50) and a writing step (S51, S51a, S51b). At the preparation step (S50), resistance values of the variable resistance element are measured by applying voltage pulses of voltages that are gradually increased to the variable resistance element, thereby determining the first voltage V1 for starting high resistance writing and the second voltage V2 having a maximum resistance value. At the HR writing step (S51a), a voltage pulse having a voltage Vp that is equal to or higher than the first voltage V1 and equal to or lower than the second voltage V2 is applied to the variable resistance element, thereby changing the variable resistance element from the low resistance state (S52) to the high resistance state (S53).

    摘要翻译: 提供了一种最佳可变电阻元件的写入方法,其可以使可变电阻元件的操作窗口最大化。 对于根据施加的电压脉冲的极性在高电阻状态和低电阻状态之间可逆地变化的可变电阻元件执行写入方法。 写入方法包括准备步骤(S50)和写入步骤(S51,S51a,S51b)。 在准备步骤(S50)中,通过向可变电阻元件施加逐渐增加的电压的电压脉冲来测量可变电阻元件的电阻值,从而确定用于开始高电阻写入的第一电压V1和具有 最大电阻值。 在HR写入步骤(S51a)中,将具有等于或高于第一电压V1并且等于或低于第二电压V2的电压Vp的电压脉冲施加到可变电阻元件,从而改变可变电阻 元件从低电阻状态(S52)到高电阻状态(S53)。

    Nonvolatile variable resistance memory element writing method, and nonvolatile variable resistance memory device
    3.
    发明授权
    Nonvolatile variable resistance memory element writing method, and nonvolatile variable resistance memory device 有权
    非易失性可变电阻存储元件写入方法和非易失性可变电阻存储器件

    公开(公告)号:US08665633B2

    公开(公告)日:2014-03-04

    申请号:US13599406

    申请日:2012-08-30

    IPC分类号: G11C11/00

    摘要: A method of writing data to a variable resistance element (10a) that reversibly changes between a high resistance state and a low resistance state according to a polarity of an applied voltage, as a voltage applied to an upper electrode (11) with respect to a lower electrode (14t): a positive voltage is applied in a high resistance writing step (405) to set the variable resistance element to a high resistance state (401); a negative voltage is applied in a low resistance writing step (406, 408) to set the variable resistance element to a low resistance state (403, 402); and a positive voltage is applied in a low resistance stabilization writing step (404) after the negative voltage is applied in the low resistance writing step, thereby setting the variable resistance element through the low resistance state to the high resistance state.

    摘要翻译: 根据施加电压的极性将数据写入可变电阻元件(10a)的方法,该可变电阻元件(10a)根据施加的电压的极性在高电阻状态和低电阻状态之间可逆地变化,作为对上电极(11)相对于 下电极(14t):在高电阻写入步骤(405)中施加正电压以将可变电阻元件设置为高电阻状态(401); 在低电阻写入步骤(406,408)中施加负电压以将可变电阻元件设置为低电阻状态(403,402); 并且在低电阻写入步骤中施加负电压之后,在低电阻稳定写入步骤(404)中施加正电压,从而将可变电阻元件通过低电阻状态设置为高电阻状态。

    NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE
    4.
    发明申请
    NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE 有权
    非易失性可变电阻记忆元件写入方法和非易失性可变电阻存储器件

    公开(公告)号:US20130003439A1

    公开(公告)日:2013-01-03

    申请号:US13599406

    申请日:2012-08-30

    IPC分类号: G11C11/00

    摘要: A method of writing data to a variable resistance element (10a) that reversibly changes between a high resistance state and a low resistance state according to a polarity of an applied voltage, as a voltage applied to an upper electrode (11) with respect to a lower electrode (14t): a positive voltage is applied in a high resistance writing step (405) to set the variable resistance element to a high resistance state (401); a negative voltage is applied in a low resistance writing step (406, 408) to set the variable resistance element to a low resistance state (403, 402); and a positive voltage is applied in a low resistance stabilization writing step (404) after the negative voltage is applied in the low resistance writing step, thereby setting the variable resistance element through the low resistance state to the high resistance state.

    摘要翻译: 根据施加电压的极性将数据写入可变电阻元件(10a)的方法,该可变电阻元件(10a)根据施加的电压的极性在高电阻状态和低电阻状态之间可逆地变化,作为对上电极(11)相对于 下电极(14t):在高电阻写入步骤(405)中施加正电压以将可变电阻元件设置为高电阻状态(401); 在低电阻写入步骤(406,408)中施加负电压以将可变电阻元件设置为低电阻状态(403,402); 并且在低电阻写入步骤中施加负电压之后,在低电阻稳定写入步骤(404)中施加正电压,从而将可变电阻元件通过低电阻状态设置为高电阻状态。

    NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE
    5.
    发明申请
    NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE 有权
    非易失性可变电阻记忆元件写入方法和非易失性可变电阻存储器件

    公开(公告)号:US20110128773A1

    公开(公告)日:2011-06-02

    申请号:US12999019

    申请日:2010-04-27

    IPC分类号: G11C11/00 G11C7/00

    摘要: To provide a variable resistance element writing method that, even when a variable resistance element has a possibility of becoming a half LR state, can ensure a maximum resistance change window by correcting the variable resistance element to a normal low resistance state. In a method of writing data to a variable resistance element (10a) that reversibly changes between a high resistance state and a low resistance state according to a polarity of an applied voltage, as a voltage applied to an upper electrode (11) with respect to a lower electrode (14t): a positive voltage is applied in a high resistance writing step (405) to set the variable resistance element (10a) to a high resistance state (401); a negative voltage is applied in a low resistance writing step (406, 408) to set the variable resistance element (10a) to a low resistance state (403, 402); and a positive voltage is applied in a low resistance stabilization writing step (404) after the negative voltage is applied in the low resistance writing step (408), thereby setting the variable resistance element (10a) through the low resistance state to the high resistance state (401).

    摘要翻译: 为了提供可变电阻元件写入方法,即使当可变电阻元件具有成为半LR状态的可能性时,通过将可变电阻元件校正为正常的低电阻状态来确保最大电阻变化窗口。 在根据施加电压的极性将数据写入到可变电阻元件(10a)的方法中,可变电阻元件(10a)根据施加电压的极性在高电阻状态和低电阻状态之间可逆地变化,作为施加到上电极(11)的电压相对于 下电极(14t):在高电阻写入步骤(405)中施加正电压以将可变电阻元件(10a)设置为高电阻状态(401); 在低电阻写入步骤(406,408)中施加负电压以将可变电阻元件(10a)设置为低电阻状态(403,402); 并且在低电阻写入步骤(408)中施加负电压之后,在低电阻稳定写入步骤(404)中施加正电压,从而将可变电阻元件(10a)设置为低电阻状态为高电阻 州(401)。

    FORMING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE
    6.
    发明申请
    FORMING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE 有权
    可变电阻非易失性存储器元件的形成方法和可变电阻非易失性存储器件

    公开(公告)号:US20120120712A1

    公开(公告)日:2012-05-17

    申请号:US13001943

    申请日:2010-06-04

    IPC分类号: G11C11/00 H01L21/8239

    摘要: An optimum forming method of performing a forming for a variable resistance element to maximize an operation window of the variable resistance element is provided. The forming method is used to initialize a variable resistance element (100). The forming method includes: a determination step (S35) of determining whether or not a current resistance value of the variable resistance element (100) is lower than a resistance value in a high resistance state; and a voltage application step (S36) of applying a voltage pulse having a voltage not exceeding a sum of a forming voltage and a forming margin when the determination is made that the current resistance value is not lower than the resistance value in the high resistance state (No at S35). The determination step (S35) and the voltage application step (S36) are repeated to process all memory cells in a memory array (202) (S34 to S37).

    摘要翻译: 提供了一种用于对可变电阻元件进行成形以最大化可变电阻元件的操作窗口的最佳形成方法。 成形方法用于初始化可变电阻元件(100)。 形成方法包括:确定可变电阻元件(100)的当前电阻值是否低于高电阻状态下的电阻值的确定步骤(S35) 以及当确定当前电阻值不低于高电阻状态下的电阻值时,施加具有不超过形成电压和形成余量之和的电压的电压脉冲的电压施加步骤(S36) (S35否)。 重复确定步骤(S35)和电压施加步骤(S36)以处理存储器阵列(202)中的所有存储器单元(S34至S37)。

    Forming method for variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device
    7.
    发明授权
    Forming method for variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device 有权
    可变电阻非易失性存储元件的形成方法和可变电阻非易失性存储器件

    公开(公告)号:US08395925B2

    公开(公告)日:2013-03-12

    申请号:US13001943

    申请日:2010-06-04

    IPC分类号: G11C11/00

    摘要: An optimum forming method of performing a forming for a variable resistance element to maximize an operation window of the variable resistance element is provided. The forming method is used to initialize a variable resistance element (100). The forming method includes: a determination step (S35) of determining whether or not a current resistance value of the variable resistance element (100) is lower than a resistance value in a high resistance state; and a voltage application step (S36) of applying a voltage pulse having a voltage not exceeding a sum of a forming voltage and a forming margin when the determination is made that the current resistance value is not lower than the resistance value in the high resistance state (No at S35). The determination step (S35) and the voltage application step (S36) are repeated to process all memory cells in a memory array (202) (S34 to S37).

    摘要翻译: 提供了一种用于对可变电阻元件进行成形以最大化可变电阻元件的操作窗口的最佳形成方法。 成形方法用于初始化可变电阻元件(100)。 形成方法包括:确定可变电阻元件(100)的当前电阻值是否低于高电阻状态下的电阻值的确定步骤(S35) 以及当确定当前电阻值不低于高电阻状态下的电阻值时,施加具有不超过形成电压和形成余量之和的电压的电压脉冲的电压施加步骤(S36) (S35否)。 重复确定步骤(S35)和电压施加步骤(S36)以处理存储器阵列(202)中的所有存储器单元(S34至S37)。

    WRITING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE
    8.
    发明申请
    WRITING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE 有权
    可变电阻非易失性存储器元件的写入方法和可变电阻非易失性存储器件

    公开(公告)号:US20110110144A1

    公开(公告)日:2011-05-12

    申请号:US13001905

    申请日:2010-06-08

    IPC分类号: G11C11/21

    摘要: A writing method optimum for a variable resistance element which can maximize an operation window of the variable resistance element is provided. The writing method is performed for a variable resistance element that reversibly changes between a high resistance state and a low resistance state depending on a polarity of an applied voltage pulse. The writing method includes a preparation step (S50) and a writing step (S51, S51a, S51b). At the preparation step (S50), resistance values of the variable resistance element are measured by applying voltage pulses of voltages that are gradually increased to the variable resistance element, thereby determining the first voltage V1 for starting high resistance writing and the second voltage V2 having a maximum resistance value. At the HR writing step (S51a), a voltage pulse having a voltage Vp that is equal to or higher than the first voltage V1 and equal to or lower than the second voltage V2 is applied to the variable resistance element, thereby changing the variable resistance element from the low resistance state (S52) to the high resistance state (S53).

    摘要翻译: 提供了一种最佳可变电阻元件的写入方法,其可以使可变电阻元件的操作窗口最大化。 对于根据施加的电压脉冲的极性在高电阻状态和低电阻状态之间可逆地变化的可变电阻元件执行写入方法。 写入方法包括准备步骤(S50)和写入步骤(S51,S51a,S51b)。 在准备步骤(S50)中,通过向可变电阻元件施加逐渐增加的电压的电压脉冲来测量可变电阻元件的电阻值,从而确定用于开始高电阻写入的第一电压V1和具有 最大电阻值。 在HR写入步骤(S51a)中,将具有等于或高于第一电压V1并且等于或低于第二电压V2的电压Vp的电压脉冲施加到可变电阻元件,从而改变可变电阻 元件从低电阻状态(S52)到高电阻状态(S53)。

    Nonvolatile storage device and method for writing into memory cell of the same
    9.
    发明授权
    Nonvolatile storage device and method for writing into memory cell of the same 有权
    非易失性存储装置和写入其中的存储单元的方法

    公开(公告)号:US08179714B2

    公开(公告)日:2012-05-15

    申请号:US12865193

    申请日:2009-10-16

    IPC分类号: G11C11/00

    摘要: Provided is a nonvolatile storage device (200) capable of stably operating without increasing a size of a selection transistor included in each of memory cells. The nonvolatile storage device (200) includes: a semiconductor substrate (301) which has a P-type well (301a) of a first conductivity type; a memory cell array (202) which includes memory cells (M11) or the like each of which includes a variable resistance element (R11) and a transistor (N11) that are formed above the semiconductor substrate (301) and connected in series; and a substrate bias circuit (220) which applies, to the P-type well (301a), a bias voltage in a forward direction with respect to a source and a drain of the transistor (N11), when a voltage pulse for writing is applied to the variable resistance element (R11) included in the selected memory cell (M11) or the like.

    摘要翻译: 提供一种能够在不增加包含在每个存储单元中的选择晶体管的尺寸的情况下稳定地工作的非易失性存储装置(200)。 非易失性存储装置(200)包括:具有第一导电型的P型阱(301a)的半导体基板(301) 存储单元阵列(202),其包括存储单元(M11)等,每个存储单元包括形成在半导体衬底(301)上并串联连接的可变电阻元件(R11)和晶体管(N11); 以及衬底偏置电路(220),当用于写入的电压脉冲为写入电压脉冲时,向P型阱(301a)施加相对于晶体管(N11)的源极和漏极的正向偏置电压 应用于所选择的存储单元(M11)等中包含的可变电阻元件(R11)。