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公开(公告)号：US5258426A
公开(公告)日：1993-11-02
申请号：US484676
申请日：1990-02-20
CPC分类号： H01L23/293 , H01L23/295 , H01L2924/0002 , Y10T428/31511 , Y10T428/31721
摘要： A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190.degree. C., (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.
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2.发明授权Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 失效使用该组合物制造的马来酰亚胺树脂组合物和树脂封装的半导体器件
公开(公告)号：US5272377A
公开(公告)日：1993-12-21
申请号：US785812
申请日：1991-10-31
IPC分类号： C08L61/06 , C08K5/14 , C08K5/5313 , C08L35/00 , C08L61/04 , C08L79/08 , H01B3/30 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L23/293 , C08K5/14 , C08K5/5313 , C08L79/085 , H01B3/306 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1433
摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.
摘要翻译： 该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。 此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。 马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物 并将预分散器与其它组分混合。 马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。 此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。
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公开(公告)号：US5637667A
公开(公告)日：1997-06-10
申请号：US451065
申请日：1995-05-25
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.
摘要翻译： 一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。
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公开(公告)号：US5438113A
公开(公告)日：1995-08-01
申请号：US40267
申请日：1993-03-30
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).
摘要翻译： 含有具有至少一个酚羟基的硅烷化合物a）和具有至少两个能够与硅烷化合物的酚羟基反应的官能团的有机化合物b）的热固性树脂组合物，其中硅烷化合物a）为 相对于100重量份的有机化合物b），加入量大于10重量份。
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公开(公告)号：US5068267A
公开(公告)日：1991-11-26
申请号：US405533
申请日：1989-09-12
IPC分类号： C08L61/06 , C08G59/00 , C08G59/32 , C08G59/62 , C08L61/04 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01L2924/0002
摘要： An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains(a) an epoxy resin,(b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin,(c) a curing accelerator, and(d) a silica powder.
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公开(公告)号：US5223739A
公开(公告)日：1993-06-29
申请号：US581700
申请日：1990-09-13
CPC分类号： H01L23/564 , H01L21/565 , H01L23/16 , H01L2224/48091 , H01L2224/48247
摘要： A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.
摘要翻译： 一种塑料模制半导体器件，其具有安装在由悬挂销支撑的裸片上的半导体芯片。 半导体芯片由模具塑料封装，其中半导体芯片具有向一侧突出的引线部分，并且实际上半导体芯片的整个周边被铝或其它防止水分进入的其它防潮材料覆盖。
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公开(公告)号：US5789359A
公开(公告)日：1998-08-04
申请号：US553270
申请日：1996-04-02
申请人： Hiroshi Shimozawa , Masaru Kumagai , Fumihiko Tsuchitani , Mayumi Koga , Tadayuki Nakamura , Nobuhiro Saitoh , Shigeo Yamafuji
发明人： Hiroshi Shimozawa , Masaru Kumagai , Fumihiko Tsuchitani , Mayumi Koga , Tadayuki Nakamura , Nobuhiro Saitoh , Shigeo Yamafuji
CPC分类号： C11D7/5004 , C11D11/0011 , C11D11/0047 , C11D7/5009 , H01L21/4835 , H05K3/26 , H05K2203/0783
摘要： The detergent of this invention, directed to the cleaning of an object having a gap portion at least in part thereof, contains at least one of components of the detergent having a solubility parameter difference of not more than 3 from and a contact angle within 15.degree. with at least one of components of a smear on the object. The detergent provides an ideal cleaning for the object because it easily permeates into and dissolves the machining oil filling the gaps between closely cohering thin metallic strips. The method of cleaning according to the invention has first cleaning the object with a polar detergent and then rinsing and drying the cleaned object with a detergent having low polarity or no polarity. In the precision cleaning of such objects as electronic parts, therefore, it manifests satisfactory cleaning and drying properties. The detergent and the method of cleaning mentioned above are both safe in the environment because they have no use for such detergents as the Flon type and the chlorine type solvents which induce the destruction and the pollution of the environment.
摘要翻译： PCT No.PCT / JP94 / 00796 Sec。 371日期：1996年4月2日 102（e）日期1996年4月2日PCT提交1994年5月17日PCT公布。 出版物WO94 / 26864 日期1994年11月24日本发明的洗涤剂涉及至少部分地具有间隙部分的物体的清洁，其含有至少一种洗涤剂的组分，其中溶解度参数差为不大于3， 15°以内的接触角与物体上的涂片的至少一种成分。 洗涤剂为物体提供理想的清洁，因为它容易渗透并溶解填充紧密结合的细金属条之间的间隙的机械油。 根据本发明的清洁方法首先用极性洗涤剂清洁物体，然后用具有低极性或无极性的洗涤剂冲洗和干燥被清洁物体。 因此，在电子部件等的精密清洗中，表现出令人满意的清洗和干燥性能。 上述的洗涤剂和清洁方法在环境中都是安全的，因为它们不能用于引起破坏和环境污染的Flon型和氯类溶剂等洗涤剂。
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