利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.021 秒)

    Method and apparatus for vacuum deposition plating
    3.
    发明授权
    Method and apparatus for vacuum deposition plating 失效
    真空沉积电镀方法和装置

    公开(公告)号：US4674443A

    公开(公告)日：1987-06-23

    申请号：US855793

    申请日：1986-04-24

    申请人： Heizaburo Furukawa ,  Kanji Wake ,  Yoshio Shimozato ,  Kenichi Yanagi ,  Mitsuo Katoh ,  Tetsuyoshi Wada ,  Norio Tsukiji ,  Takuya Aiko ,  Toshiharu Kittaka ,  Yasuji Nakanishi

    发明人： Heizaburo Furukawa ,  Kanji Wake ,  Yoshio Shimozato ,  Kenichi Yanagi ,  Mitsuo Katoh ,  Tetsuyoshi Wada ,  Norio Tsukiji ,  Takuya Aiko ,  Toshiharu Kittaka ,  Yasuji Nakanishi

    IPC分类号： C21D9/56 ,  C23C14/56 ,  C23C13/08

    CPC分类号： C21D9/561 ,  C21D9/565 ,  C23C14/562

    摘要： A vacuum deposition plating apparatus having an inlet-side vacuum sealing device provided in front of a vacuum deposition plating chamber, an inlet-side inactive gas replacement chamber provided between the inlet-side vacuum sealing device and an annealing furnace, an outlet-side vacuum sealing device provided in the rear of the vacuum deposition plating chamber, an outlet-side inactive gas replacement chamber provided between the outlet-side vacuum sealing device and the atmosphere, and an inactive gas circulating/purifying device for circulating an inactive gas from vacuum chambers of both the vacuum sealing devices to atmospheric pressure chambers of both the vacuum sealing devices and for removing water, oil and oxygen from the inactive gas; a pressure gauge provided on the annealing furnace; a pressure gauge, a control valve, an automatic valve, a hydrogen concentration detector and a discharge valve provided on the inlet-side inactive gas replacement chamber; a pressure gauge and an automatic valve provided on the outlet-side inactive gas replacement chamber; and an automatic valve connecting to an inactive gas tank for emergency provided on the atmospheric pressure chambers of both the vacuum sealing devices.

    摘要翻译： 一种真空沉积电镀装置，其具有设置在真空沉积电镀室前面的入口侧真空密封装置，设置在入口侧真空密封装置和退火炉之间的入口侧非活性气体置换室，出口侧真空 密封装置，设置在真空沉积电镀室的后部，设置在出口侧真空密封装置和大气之间的出口侧非活性气体置换室，以及用于使来自真空室的惰性气体循环的惰性气体循环/净化装置 两个真空密封装置与两个真空密封装置的大气压室和从惰性气体中除去水，油和氧的两个; 设置在退火炉上的压力计; 压力计，控制阀，自动阀，氢浓度检测器和设置在入口侧非活性气体置换室上的排出阀; 设置在出口侧非活性气体置换室上的压力计和自动阀; 以及连接到两个真空密封装置的大气压室上的用于紧急的惰性气体罐的自动阀。

    Sputtering apparatus and an ion source
    8.
    发明授权
    Sputtering apparatus and an ion source 失效
    溅射装置和离子源

    公开(公告)号：US5288386A

    公开(公告)日：1994-02-22

    申请号：US913927

    申请日：1992-07-17

    申请人： Kenichi Yanagi ,  Mitsuo Kato ,  Kazuya Tsurusaki ,  Toshio Taguchi ,  Kenji Atarashiya ,  Tadashi Rokkaku ,  Ichiro Yamashita

    发明人： Kenichi Yanagi ,  Mitsuo Kato ,  Kazuya Tsurusaki ,  Toshio Taguchi ,  Kenji Atarashiya ,  Tadashi Rokkaku ,  Ichiro Yamashita

    IPC分类号： H01J27/08 ,  H01J27/18 ,  H01J37/08 ,  H01J37/317 ,  C23C14/35

    CPC分类号： H01J27/08 ,  H01J27/18 ,  H01J37/08 ,  H01J37/3178 ,  H01J2237/0822

    摘要： A sputtering apparatus including two electrodes, a sputtering target disposed on one of the electrodes, and a gas supply for supplying a discharge gas in a vacuum to produce an electric discharge between the two electrodes and whereby particles sputtered from the target due to impact thereon of ions produced by the discharge, are deposited on a substrate. The target disposed on one electrode is formed into an elongated band and the other electrode is disposed so as to enclose the target. The other electrode is also provided with a magnet for producing a magnetic field thereon, and further includes a narrow elongated slot which defines a narrow sputter particle outlet. The narrow sputter particle outlet permits a pressure to exist near the electrical discharge which is higher than the pressure near the substrate. According to a preferred embodiment, the sputtering apparatus has an ion source combined integrally therewith.

    摘要翻译： 一种溅射装置，包括两个电极，设置在一个电极上的溅射靶，以及用于在真空中供应放电气体以在两个电极之间产生放电的气体源，由此由于其上的冲击而从靶溅射的颗粒 通过放电产生的离子沉积在基底上。 设置在一个电极上的靶被形成为细长带，并且另一个电极被设置成包围靶。 另一个电极还设置有用于在其上产生磁场的磁体，并且还包括限定窄的溅射颗粒出口的窄的细长槽。 窄的溅射粒子出口允许在高于衬底附近的压力的放电附近存在压力。 根据优选实施例，溅射装置具有与其一体地组合的离子源。

    Vacuum vapor deposition system
    9.
    发明授权
    Vacuum vapor deposition system 失效
    真空蒸镀系统

    公开(公告)号：US4552092A

    公开(公告)日：1985-11-12

    申请号：US652676

    申请日：1984-09-19

    申请人： Kenichi Yanagi ,  Toshio Taguchi ,  Tetsuyoshi Wada ,  Heisaburo Furukawa ,  Kanji Wake

    发明人： Kenichi Yanagi ,  Toshio Taguchi ,  Tetsuyoshi Wada ,  Heisaburo Furukawa ,  Kanji Wake

    IPC分类号： C23C14/56 ,  C23C14/24

    CPC分类号： C23C14/562

    摘要： A vacuum vapor deposition system including a high-vacuum vapor deposition chamber provided with a rotary cell around which band steel is wound as it is passed through the chamber. A crucible for molten metal has a hood for guiding vapor of said metal to a vapor deposition port opposed to the rotary cell, and arcuate covers connected to the hood at the entrance and exit positions of the band steel. The vapor deposition port is spaced slightly from the rotary cell so that the covers will not come into contact with the band steel. A heater is provided for heating the surface of the rotary cell up to a temperature equal to or higher than a reevaporation temperature of the metal under a vapor pressure of the vapor of the metal in the proximity of the rotary cell so that the metal will not be deposited onto the opposite end portions of the rotary cell which are not covered by the band steel. A heater is also provided for heating the surfaces of the hood and the covers up to a temperature equal to or higher than such reevaporation temperature of the metal so that metal will not be deposited onto the hood and the covers.

    摘要翻译： 一种真空蒸镀系统，其特征在于，具有高真空蒸镀室，该真空蒸镀室设置有旋转槽，当所述旋转槽通过所述室时，带钢被卷绕。 用于熔融金属的坩埚具有用于将所述金属的蒸气引导到与旋转单元相对的气相沉积端口的罩，以及在带钢的入口和出口位置连接到罩的弓形盖。 气相沉积端口与旋转单元稍微间隔开，使得盖不会与带钢接触。 提供一种加热器，用于在旋转电池附近的金属蒸汽的蒸汽压力下，将旋转电池的表面加热至等于或高于金属的蒸发温度的温度，使金属不会 沉积在不被带钢覆盖的旋转电池的相对端部上。 还提供加热器，用于将罩和盖的表面加热到等于或高于金属的这种再蒸发温度的温度，使得金属不会沉积到罩和盖上。

    Vacuum vapor deposition apparatus
    10.
    发明授权
    Vacuum vapor deposition apparatus 失效
    真空蒸发器沉积装置

    公开(公告)号：US5169451A

    公开(公告)日：1992-12-08

    申请号：US766766

    申请日：1991-09-27

    申请人： Kenichi Yanagi ,  Toshio Taguchi ,  Yoshiteru Moriyama ,  Mitsuhiko Sako ,  Takuya Akio ,  Shinji Kamura ,  Heisaburo Furukawa ,  Kenji Atarashiya ,  Seiji Yokoro

    发明人： Kenichi Yanagi ,  Toshio Taguchi ,  Yoshiteru Moriyama ,  Mitsuhiko Sako ,  Takuya Akio ,  Shinji Kamura ,  Heisaburo Furukawa ,  Kenji Atarashiya ,  Seiji Yokoro

    IPC分类号： C23C14/24 ,  C23C14/56

    CPC分类号： C23C14/562 ,  C23C14/243

    摘要： An improved vacuum vapor-deposition apparatus comprises an evaporation tank for holding and evaporating vapor deposition material, a hood covering the top of the evporation tank and extended up to its outside in the horizontal direction, inlet and outlet ports of a band to be vapor-deposited, which are opened in the hood so as to penetrate a central portion of the extension on the outside of the evaporation tank, and a vacuum tank covering the evaporation tank and the hood entirely and having sealing devices for carrying in and carrying out the band to be vapor-deposited at the positions corresponding to the inlet and outlet ports in the hood. Vapor deposition is effected within the hood simultaneously onto the both front and rear surfaces of the band to be vapor-deposited. Preferably, the vacuum vapor-deposition apparatus further comprises a vapor amount control device for controlling a vapor amount of the evaporated material led to the both front and rear sides of the band to be vapor-deposited within the hood, and a vapor-deposited surface area control device provided at least on one side of the front and rear sides of the band to be vapor-deposited within the hood for controlling a vapor-deposited surface area of the band to be vapor-deposited. Then, vapor-deposition of different thickness is effected within the hood onto the front and rear surfaces of the band to be vapor-deposited.