公开(公告)号：US06492199B2

公开(公告)日：2002-12-10

申请号：US09773653

申请日：2001-01-31

申请人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

发明人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

IPC分类号： H01L2148

CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.

摘要翻译： 一种制造半导体芯片的方法，该半导体芯片在芯片前表面上具有设置在导电外圈内部的电极焊盘。 薄片电路设置在芯片正面侧。 在薄膜电路上形成外部连接热量，从而在其上突出。 第一引线将电极焊盘的一部分电连接到外部连接端子的一部分。 第二引线将接地或电源电极焊盘电连接到外环，而第三引线将接地或电源外部连接端子电连接到外环。

公开(公告)号：US06319749B1

公开(公告)日：2001-11-20

申请号：US09562750

申请日：2000-05-02

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US6077727A

公开(公告)日：2000-06-20

申请号：US786285

申请日：1997-01-22

申请人： Kenji Osawa ,  Makoto Ito

发明人： Kenji Osawa ,  Makoto Ito

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L21/4828 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082

摘要： There is provided a method for manufacturing a lead frame which can easily manufacture a high quality lead frame.A pattern layer is selectively formed on a copper plate and the surface of the substrate having formed this pattern layer is then plated with gold to form a gold layer using the pattern layer as the mask. Next, the gold layer is then plated with copper to form a copper layer, thereby forming a fine lead consisting of two layers of gold layer and copper layer. Thereafter, the pattern layer is selectively removed, an insulated resist film is formed and the copper plate is etched. In this case, the gold layer is used as the etching stop layer. Thereby, the lead frame having the fine lead of double-layer structure can be formed.

摘要翻译： 提供一种可以容易地制造高品质引线框的引线框的制造方法。 在铜板上选择性地形成图案层，并且使用图案层作为掩模，将形成该图案层的基板的表面镀金以形成金层。 接着，用铜镀金层形成铜层，由此形成由两层金层和铜层构成的细小导线。 此后，选择性地去除图案层，形成绝缘抗蚀剂膜，并蚀刻铜板。 在这种情况下，金层用作蚀刻停止层。 由此，可以形成具有双层结构的细导线的引线框架。

公开(公告)号：US6107678A

公开(公告)日：2000-08-22

申请号：US909814

申请日：1997-08-12

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US09402407B2

公开(公告)日：2016-08-02

申请号：US12999896

申请日：2009-06-17

申请人： Yuuichi Maeda ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

发明人： Yuuichi Maeda ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

IPC分类号： A61K36/61 ,  B01D3/00 ,  C02F1/02 ,  A23G3/48 ,  A23G3/34 ,  A23L1/30 ,  A61K36/14

CPC分类号： A23G3/48 ,  A23G3/34 ,  A23L33/105 ,  A61K36/14 ,  A61K36/61

摘要： A method for preparing a Eucalyptus extract which decreases the Eucalyptus-specific odor and obtains the effective ingredient in high purity and high yield as a physiologically-active ingredient. An essential oil constituent is removed from the Eucalyptus plant and the residue is extracted with water or an organic solvent aqueous solution. Next, the obtained extraction residue is further extracted with an organic solvent aqueous solution or an organic solvent, whereby Macrocarpal A, Macrocarpal B, and Macrocarpal C contained in the Eucalyptus as a physiological active substance are prepared in higher content than using conventional methods. Further, the extract has improved good taste, appearance, and other desirable properties.

摘要翻译： 一种制备桉树提取物的方法，其降低桉树特异性气味，并获得作为生理活性成分的高纯度和高产率的有效成分。 从桉树植物中除去精油成分，残留物用水或有机溶剂水溶液萃取。 接下来，用有机溶剂水溶液或有机溶剂进一步提取所得提取残渣，由此制备作为生理活性物质的桉树中的Macrocarpal A，Macrocarpal B和Macrocarpal C的含量高于使用常规方法。 此外，提取物具有改善的良好味道，外观和其它期望的性质。

公开(公告)号：US20120253014A1

公开(公告)日：2012-10-04

申请号：US13514975

申请日：2010-12-07

申请人： Hiroaki Higuchi ,  Atsushi Narise ,  Kenji Osawa ,  Katsumasa Shimizu ,  Masanori Ito

发明人： Hiroaki Higuchi ,  Atsushi Narise ,  Kenji Osawa ,  Katsumasa Shimizu ,  Masanori Ito

IPC分类号： C07K14/78

CPC分类号： A61K38/39 ,  A23L2/66 ,  A23L29/284 ,  A23L33/17 ,  A23V2002/00 ,  A23V2200/318 ,  A23V2250/5422

摘要： An object of the present invention is to provide a preventive agent for atopic dermatitis and food products containing the agent. The present inventors conducted extensive studies and, as the result, found that atopic dermatitis can be prevented by orally ingesting collagen. The present invention provides a preventive agent for atopic dermatitis comprising collagen and food products containing the preventive agent for atopic dermatitis.

摘要翻译： 本发明的目的是提供特应性皮炎预防剂和含有该药剂的食品。 本发明人进行了广泛的研究，结果发现可以通过口服摄取胶原来防止特应性皮炎。 本发明提供特应性皮炎预防剂，其包含含有特应性皮炎预防剂的胶原蛋白和食品。

公开(公告)号：US20120015063A1

公开(公告)日：2012-01-19

申请号：US13258579

申请日：2010-03-30

申请人： Hiroaki Higuchi ,  Reiko Kuroda ,  Atsushi Narise ,  Katsumasa Shimizu ,  Kenji Osawa ,  Yoshihiro Nomura

发明人： Hiroaki Higuchi ,  Reiko Kuroda ,  Atsushi Narise ,  Katsumasa Shimizu ,  Kenji Osawa ,  Yoshihiro Nomura

IPC分类号： A61K36/38 ,  A61P39/06 ,  A61P17/02 ,  A61P17/00

CPC分类号： A61K36/38 ,  A23L33/105 ,  A23V2002/00 ,  A61K8/97 ,  A61K2800/92 ,  A61Q19/004 ,  A61Q19/007 ,  A61Q19/08 ,  A23V2200/318 ,  A23V2250/21

摘要： To provide a composition for treatment and/or prevention of skin disorder, intensive research has been conducted. As a result, a mangosteen (Garcinia mangostana L.) pericarp extract has been found to have a reducing effect on the skin disorder. The present invention provides a composition for treatment and/or prevention of skin disorder, the composition including a mangosteen pericarp extract.

摘要翻译： 为了提供治疗和/或预防皮肤病症的组合物，已经进行了深入研究。 结果，已经发现山竹（Garcinia mangostana L.）果皮提取物对皮肤病症具有减少的作用。 本发明提供了一种治疗和/或预防皮肤病症的组合物，该组合物包括山竹果皮提取物。

公开(公告)号：US20110076348A1

公开(公告)日：2011-03-31

申请号：US12993836

申请日：2009-05-19

申请人： Reiko Kuroda ,  Higuchi Hiroaki ,  Narise Atsushi ,  Katsumasa Shimizu ,  Kenji Osawa

发明人： Reiko Kuroda ,  Higuchi Hiroaki ,  Narise Atsushi ,  Katsumasa Shimizu ,  Kenji Osawa

IPC分类号： A61K36/38 ,  A61P37/06 ,  A61P17/02

CPC分类号： A61K36/38 ,  A23K20/111 ,  A23K20/121 ,  A23K50/30 ,  A23K50/40 ,  A23L33/105 ,  A23V2002/00 ,  A23V2250/21 ,  A23V2200/304

摘要： To provide a prophylactic and/or therapeutic agent for atopic dermatitis with minimal concerns of adverse drug reactions and high safety, various researches were conducted. As a result, it was found that an extract extracted from a mangosteen (Garcinia mangostana L.) peel with a polar solvent prevented or healed atopic dermatitis. That is, the present invention provides a prophylactic and/or therapeutic agent for atopic dermatitis comprising an extract extracted from a mangosteen peel with a polar solvent. Furthermore, the present invention provides a food containing the above-mentioned prophylactic and/or therapeutic agent for atopic dermatitis.

摘要翻译： 为了提供特应性皮炎的预防和/或治疗药物，药物反应不良和安全性高的问题，进行了各种研究。 结果发现，从山竹果（Garcinia mangostana L.）剥离的极性溶剂提取物提取物防止或治愈特应性皮炎。 也就是说，本发明提供了特应性皮炎的预防和/或治疗剂，其包括用极性溶剂从山竹果皮提取的提取物。 此外，本发明提供含有上述用于特应性皮炎的预防和/或治疗剂的食品。

公开(公告)号：US07669773B2

公开(公告)日：2010-03-02

申请号：US11907911

申请日：2007-10-18

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06 ,  G06K7/06 ,  G06K5/00

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US07341198B2

公开(公告)日：2008-03-11

申请号：US10588301

申请日：2004-02-20

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06

CPC分类号： G06K19/07745 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.

摘要翻译： IC卡1CD包括框架部件CB1和IC卡主体15，该IC卡主体15以其框架中的连接部分CB 2挂起的状态保持。 IC卡主体15构成具有高功能性的卡式信息介质，具有作为即插即用IC卡的功能，以及作为具有容量较大的说话存储卡的功能 并且具有比能够执行安全处理的IC卡的功能更高的功能。 IC卡主体15的外形形状符合RS-MMC外形标准。 IC卡主体15的盖部分1 CB 3的表面通过用于制造通用IC卡的步骤中使用的打印方法打印所需的字符，图案，图表和照片等，并且IC卡15 具有更高的确认性能，安全性能和前景。