公开(公告)号：US20080156518A1

公开(公告)日：2008-07-03

申请号：US11649354

申请日：2007-01-03

申请人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

发明人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

IPC分类号： H05K13/00 ,  H01S4/00 ,  H05K1/00

CPC分类号： H05K3/0052 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10156 ,  H01L2924/10158 ,  H01L2924/19107 ,  H05K2203/0165 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.

摘要翻译： 包括多个微电子器件载体的衬底具有金属对准元件。 对准元件期望地与载体上的端子以预定的位置关系设置。 对准元件与载体框架接合，并且切割装置与载体框架对准。 切割装置切割载体，使得载体的边界与端子具有精确的关系。

公开(公告)号：US4562301A

公开(公告)日：1985-12-31

申请号：US577773

申请日：1984-02-07

申请人： Eiichi Kameda ,  Seiichi Tobe

发明人： Eiichi Kameda ,  Seiichi Tobe

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K1/14 ,  H05K3/00

CPC分类号： H05K3/4046 ,  H01R12/523 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K3/3447 ,  Y10T29/49124 ,  Y10T29/49153

摘要： A through-hole pin connection for laminated circuit elements and method of connection are presented. The laminated circuit element consists of a plurality of individual circuit elements, each element having a land area about the periphery of the through-hole. The through-hole pin has at least one ridged region located along the direction of insertion into the through-hole. Upon insertion, the pin guides a solder into the land areas and the ridged region effects electrical and mechanical contact between the through-hole pin and each of the land areas of the laminated circuit element.

摘要翻译： 提出了一种用于层叠电路元件的通孔引脚连接和连接方法。 层压电路元件由多个单独的电路元件组成，每个元件具有围绕通孔周边的平台区域。 通孔销具有沿着插入通孔的方向定位的至少一个脊状区域。 在插入时，引脚将焊料引导到焊盘区域中，并且脊状区域在通孔引脚与层叠电路元件的每个焊盘区域之间实现电和机械接触。