公开(公告)号：US20080156518A1

公开(公告)日：2008-07-03

申请号：US11649354

申请日：2007-01-03

申请人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

发明人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

IPC分类号： H05K13/00 ,  H01S4/00 ,  H05K1/00

CPC分类号： H05K3/0052 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10156 ,  H01L2924/10158 ,  H01L2924/19107 ,  H05K2203/0165 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.

摘要翻译： 包括多个微电子器件载体的衬底具有金属对准元件。 对准元件期望地与载体上的端子以预定的位置关系设置。 对准元件与载体框架接合，并且切割装置与载体框架对准。 切割装置切割载体，使得载体的边界与端子具有精确的关系。

公开(公告)号：US07763983B2

公开(公告)日：2010-07-27

申请号：US11825121

申请日：2007-07-02

申请人： Kenneth Allen Honer ,  Jae M. Park

发明人： Kenneth Allen Honer ,  Jae M. Park

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3121 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15313 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.

摘要翻译： 一种制造微电子封装的方法。 该方法包括以下步骤：将至少一个微电子元件附接到具有从电介质层的上表面向上突出的上端子的带，使得端子的顶表面设置为与微电子元件的顶表面共面或上方，在 所述附接步骤将所述微电子元件电连接到所述上端子中的至少一些; 并且还包括施加密封剂以覆盖电介质层的上表面的至少一部分的步骤，使端子的上端子表面露出。

公开(公告)号：US20090023249A1

公开(公告)日：2009-01-22

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US08387531B2

公开(公告)日：2013-03-05

申请号：US12072687

申请日：2008-02-27

申请人： Kenneth Allen Honer ,  Rolfe Tyson Gustus ,  Ilyas Mohammed

发明人： Kenneth Allen Honer ,  Rolfe Tyson Gustus ,  Ilyas Mohammed

IPC分类号： F42C19/06

CPC分类号： F42C1/00 ,  F42C11/00 ,  F42C19/06 ,  H01H29/002 ,  H01H35/146

摘要： An impact switch includes a housing having a wall including at least two electrically conductive contact elements spaced apart from one another. The switch includes an inertial body having a conductive surface disposed in a tapered aperture and electrically connecting the contact elements to one another in a switch closed condition. An impact switch for rapidly firing an explosive device is provided.

摘要翻译： 冲击开关包括具有包括彼此间隔开的至少两个导电接触元件的壁的壳体。 开关包括具有设置在锥形孔中的导电表面并且在开关闭合状态下将接触元件彼此电连接的惯性体。 提供了用于快速点燃爆炸装置的冲击开关。

公开(公告)号：US07566853B2

公开(公告)日：2009-07-28

申请号：US11317207

申请日：2005-12-23

申请人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

发明人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

IPC分类号： H01L27/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L2924/0002 ,  H04N5/3415 ,  H04N9/045 ,  H04N9/09 ,  H01L2924/00

摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

摘要翻译： 提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。 光电检测器可以被布置成三个或更多个阵列。 通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。 此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。 还提供了图像传感器封装。

公开(公告)号：US20080277775A1

公开(公告)日：2008-11-13

申请号：US11803006

申请日：2007-05-11

申请人： Kenneth Allen Honer ,  Philip Damberg

发明人： Kenneth Allen Honer ,  Philip Damberg

IPC分类号： H01L23/02 ,  H01L21/52 ,  H05K7/00 ,  H05K3/00

CPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/055 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

摘要翻译： 一种微电子封装，包括具有顶表面和底表面的电介质层，所述电介质层具有在底表面处露出的端子; 金属壁结合到电介质层并从电介质层的顶表面向上突出并围绕顶表面的区域; 金属盖结合到壁上并在顶表面的区域上延伸，使得盖，壁和介电层协作地限定封闭空间; 以及设置在所述空间内并电连接到所述端子的微电子元件。

公开(公告)号：US20080246136A1

公开(公告)日：2008-10-09

申请号：US12072508

申请日：2008-02-26

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。

公开(公告)号：US08310036B2

公开(公告)日：2012-11-13

申请号：US12784841

申请日：2010-05-21

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。

公开(公告)号：US07858445B2

公开(公告)日：2010-12-28

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US20100225006A1

公开(公告)日：2010-09-09

申请号：US12784841

申请日：2010-05-21

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。