公开(公告)号：US20100110751A1

公开(公告)日：2010-05-06

申请号：US12603623

申请日：2009-10-22

申请人： Kentaro Miyajima ,  Takeo Yamashita ,  Tomoo Murata

发明人： Kentaro Miyajima ,  Takeo Yamashita ,  Tomoo Murata

IPC分类号： G11C11/00 ,  G11C7/00 ,  G11C8/08 ,  G11C17/18

CPC分类号： G11C7/02 ,  G11C7/20 ,  G11C17/16 ,  G11C17/165 ,  G11C17/18

摘要： In a configuration having a nonvolatile memory and a volatile memory, when storage information of the nonvolatile memory is changed and an abnormal operation occurs due to temporary blackout, α-ray or others, the abnormal operation is recovered to a normal operation regardless of the presence of the detection of the abnormal operation. A reset to be inputted to the nonvolatile memory is collectively transmitted for each 1 bit, each 1 word or each predetermined arbitrary bit, and the collectively transmitted reset serving as one unit is periodically transmitted, so that the abnormal operation is recovered to a normal operation without input signals from outside even if the storage information of the nonvolatile memory is changed due to temporary blackout, α-ray or others.

摘要翻译： 在具有非易失性存储器和易失性存储器的配置中，当非易失性存储器的存储信息改变并且由于暂时中断，α射线等而发生异常操作时，异常操作恢复到正常操作，而不管存在 的异常操作的检测。 对于每1位，每1个字或每个预定的任意位，共同地发送要输入到非易失性存储器的复位，并且周期性地发送作为一个单元的共同发送的复位，使得异常操作恢复到正常操作 即使非易失性存储器的存储信息由于暂时中断，α射线等而改变，也没有来自外部的输入信号。

公开(公告)号：US20150020601A1

公开(公告)日：2015-01-22

申请号：US14379683

申请日：2012-03-02

申请人： Kentaro Miyajima ,  Kisho Ashida ,  Hiroyuki Oota

发明人： Kentaro Miyajima ,  Kisho Ashida ,  Hiroyuki Oota

IPC分类号： G01L1/22 ,  G01N19/00

CPC分类号： G01L1/2293 ,  G01B7/16 ,  G01B7/18 ,  G01L1/044 ,  G01L1/18 ,  G01L1/2262 ,  G01L1/2281 ,  G01N19/00

摘要： A device for measuring mechanical quantity is provided which reduces the influence of a difference in thermal expansion coefficient between an object to be measured and a base plate metal body, and precisely measures a mechanical quantity such as deformation quantity or strain quantity caused in the object to be measured. The device includes a semiconductor strain sensor module for measuring deformation quantity of the object to be measured, and the module includes a metal body, and a semiconductor strain sensor mounted on the metal body to detect strain of the metal body. The object to be measured is made of a material having a thermal expansion coefficient larger than that of the metal body. Further, the metal body mounted with the semiconductor strain sensor has a structure configured to be fixed to the object to be measured.

摘要翻译： 提供了一种用于测量机械量的装置，其减少了被测量物体与基板金属体之间的热膨胀系数的差异的影响，并且精确地测量在物体中产生的变形量或应变量的机械量 被测量。 该装置包括用于测量被测量物体的变形量的半导体应变传感器模块，并且该模块包括金属体，以及安装在金属体上的半导体应变传感器，用于检测金属体的应变。 待测量的物体由热膨胀系数大于金属体的材料制成。 此外，安装有半导体应变传感器的金属体具有被配置为固定到待测量对象的结构。

公开(公告)号：US08528414B2

公开(公告)日：2013-09-10

申请号：US13180603

申请日：2011-07-12

申请人： Kentaro Miyajima ,  Mitsugu Kusunoki

发明人： Kentaro Miyajima ,  Mitsugu Kusunoki

IPC分类号： G01B7/16 ,  G01L1/00

CPC分类号： G01L1/2281 ,  G01L1/2293

摘要： Because of stress occurring due to a change in temperature, and presence of heat distribution on a semiconductor substrate, and a dopant dosage gradient, an offset output occurs to a Wheatstone bridge circuit intended for detection of strain, posing a problem. To solve the problem, diffusion resistors are disposed in the form of a matrix, and bridge resistors Rv1, Rv2 each are formed by selectively connecting diffusion resistors disposed in each odd column, in series with each other, while Rh1, Rh2 each are formed by selectively connecting diffusion resistors disposed in each even column, in series with each other.

摘要翻译： 由于温度变化引起的应力和半导体衬底上的热分布的存在以及掺杂剂剂量梯度，偏移输出发生在用于检测应变的惠斯通电桥电路中，造成问题。 为了解决这个问题，扩散电阻器以矩阵的形式设置，桥式电阻器Rv1，Rv2分别通过选择性地连接设置在每个奇数列中的扩散电阻器彼此串联而形成，而Rh1，Rh2分别由 选择性地连接设置在每个偶数列中的扩散电阻器彼此串联。

公开(公告)号：US20050278596A1

公开(公告)日：2005-12-15

申请号：US11136454

申请日：2005-05-25

申请人： Kentaro Miyajima ,  Atsushi Okumura ,  Masaki Kohno

发明人： Kentaro Miyajima ,  Atsushi Okumura ,  Masaki Kohno

IPC分类号： G01R31/28 ,  G01R31/317 ,  G06F11/00 ,  G11C11/401 ,  G11C29/00 ,  G11C29/12 ,  G11C29/38

CPC分类号： G11C29/38 ,  G01R31/31715 ,  G11C2029/0405

摘要： Components are provided including: an expected-value generating circuit that generates, upon reception of an output signal directed from the interface unit to the internal processing circuit; an expected-value signal for detecting an error in the output signal, a comparing and determining circuit that compares the output signal and the expected-value signal to determine whether these signals match with each other; and an output processing circuit that retains the determination result of the comparing and determining circuit and performs a process for externally outputting the determination result. In the case where a test pattern, which is an M-series pseudo-random-number signal, is input from a pulse generator or the like to the I/F unit for testing, a circuit based on a logic of generation of such an M-series pseudo-random-number signal is provided in the expected-value generating circuit.

摘要翻译： 提供的部件包括：预期值产生电路，其在接收到从所述接口单元指向所述内部处理电路的输出信号时产生; 用于检测输出信号中的误差的预期值信号;比较和确定电路，比较输出信号和预期值信号，以确定这些信号是否彼此匹配; 以及输出处理电路，其保持比较和确定电路的确定结果，并执行用于从外部输出确定结果的处理。 在从脉冲发生器等输入作为M系列伪随机数信号的测试图案到用于测试的I / F单元的情况下，基于生成这种 在期望值发生电路中提供M系列伪随机数信号。

公开(公告)号：US09459162B2

公开(公告)日：2016-10-04

申请号：US14379683

申请日：2012-03-02

申请人： Kentaro Miyajima ,  Kisho Ashida ,  Hiroyuki Oota

发明人： Kentaro Miyajima ,  Kisho Ashida ,  Hiroyuki Oota

IPC分类号： G01L1/22 ,  G01B7/16 ,  G01L1/04 ,  G01L1/18 ,  G01N19/00

CPC分类号： G01L1/2293 ,  G01B7/16 ,  G01B7/18 ,  G01L1/044 ,  G01L1/18 ,  G01L1/2262 ,  G01L1/2281 ,  G01N19/00

摘要： A device for measuring mechanical quantity is provided which reduces the influence of a difference in thermal expansion coefficient between an object to be measured and a base plate metal body, and precisely measures a mechanical quantity such as deformation quantity or strain quantity caused in the object to be measured. The device includes a semiconductor strain sensor module for measuring deformation quantity of the object to be measured, and the module includes a metal body, and a semiconductor strain sensor mounted on the metal body to detect strain of the metal body. The object to be measured is made of a material having a thermal expansion coefficient larger than that of the metal body. Further, the metal body mounted with the semiconductor strain sensor has a structure configured to be fixed to the object to be measured.

摘要翻译： 提供了一种用于测量机械量的装置，其减少被测量物体与基板金属体之间的热膨胀系数的差异的影响，并且精确地测量在物体中产生的变形量或应变量的机械量 被测量。 该装置包括用于测量被测量物体的变形量的半导体应变传感器模块，并且该模块包括金属体，以及安装在金属体上的半导体应变传感器，用于检测金属体的应变。 待测量的物体由热膨胀系数大于金属体的材料制成。 此外，安装有半导体应变传感器的金属体具有被配置为固定到待测量对象的结构。

公开(公告)号：US20140042566A1

公开(公告)日：2014-02-13

申请号：US14112626

申请日：2011-04-21

申请人： Hiroyuki Ota ,  Kisho Ashida ,  Kentaro Miyajima

发明人： Hiroyuki Ota ,  Kisho Ashida ,  Kentaro Miyajima

IPC分类号： H01L41/04

CPC分类号： H01L41/04 ,  G01B7/18 ,  G01L1/2206 ,  G01L1/2293 ,  G01M5/0033 ,  G01M5/0083

摘要： A mechanical quantity measuring device (100) includes a semiconductor substrate (1) attached to a measured object so as to indirectly measure the mechanical quantity acting on the measured object; a measuring portion (7) capable of measuring a mechanical quantity acting on the semiconductor substrate (1) at a central part (1c) of the semiconductor substrate (1); and plural impurity diffused resistors (3a, 3b, 4a, 4b) forming a group (5) gathering closely to each other in at least one place, on an outer peripheral part (1e) outside the central part (1c) of the semiconductor substrate (1). The plural impurity diffused resistors (3a, 3b, 4a, 4b) forming one of the group (5) are connected to each other to form a Wheatstone bridge (2a, 2b). Thus, the mechanical quantity measuring device (100) can securely detect its own exfoliation.

摘要翻译： 机械量测量装置（100）包括安装在测量对象上的半导体衬底（1），以间接地测量作用在测量对象上的机械量; 能够测量在半导体衬底（1）的中心部分（1c）处作用在半导体衬底（1）上的机械量的测量部分（7）; 以及在半导体基板的中心部分（1c）的外侧的外周部（1e）上形成形成在至少一个位置上彼此紧密聚集的组（5）的多个杂质扩散电阻器（3a，3b，4a，4b） （1）。 形成组（5）中的一个的多个杂质扩散电阻器（3a，3b，4a，4b）彼此连接以形成惠斯通电桥（2a，2b）。 因此，机械量测量装置（100）可以安全地检测其自身的剥离。