摘要:
Gray level data of boundary pixels that are adjacent to a block boundary in a photoelectric conversion section is stored. Then, a cumulative histogram regarding the number of pixels for different gray levels is produced based on the stored gray level data separately for each block, and a data table representing the correspondence between each gray level before correction and that after correction for the block to be corrected is produced so as to reduce the difference between the cumulative histograms. The data table is stored in a correction data RAM. By using the data table, the outputs of the block to be corrected are non-linearly corrected for different gray levels.
摘要:
A color filter arrangement (11) is used, in which a plurality of filter units are each made of 2×2 arrangements of red (R), green (G), green (G) and blue (B) color elements. First, signal charges are added up for all pixels belonging to each of a plurality of pixel blocks made of quadratic arrangements of 3×3 of pixels, which are larger than the filter units (2×2 arrangement). Then, compressed color information for each of the pixel blocks is obtained from a result of the addition for each pixel block, taking the 2×2 arrangements of pixel blocks as large filter units.
摘要:
In a solid-state imaging device, a plurality of vertical charge transfer paths is arranged at a horizontal pitch A within a photoelectric conversion region, and at a pitch B that is smaller than the pitch A in a portion where the signals are input into the horizontal charger transfer path. A read-out amplifier and a horizontal charge transfer path for receiving signals from vertical charge transfer paths are provided for each photoelectric conversion block into which the photoelectric conversion region has been partitioned. The read-out amplifiers have the same shape and their positional relation is one of parallel displacement in regions that are obtained by changing the pitch of the vertical charge transfer portions. Thus, a solid-state imaging device is achieved that is not so easily influenced by mask misalignments or skewed ion implantation angles, and in which signal read-out at high speeds is possible.
摘要:
A solid-state imaging apparatus includes a solid-state imaging device and a signal processing circuit. The solid-state imaging device includes: a plurality of photoelectric converting sections provided with color filters having different spectroscopic characteristics, and each converting light incident thereon into a charge and accumulating the charge, and a plurality of vertical charge transfer sections for vertically transferring the charge read from each of the photoelectric converting sections. A plurality of reading operations to read the charges accumulated in the photoelectric converting sections to the plurality of the vertical charge transfer sections are performed within a time duration for scanning an image for one image plane, and the charges read from the photoelectric converting sections are transferred through the vertical charge transfer section separately for each of the reading operations. The signal processing circuit includes: a plurality of color separation circuits each for performing color separation of signals based on the charges read by the plurality of reading operations and transferred separately; and a synthesis circuit for synthesizing the signals sent by the color separation circuits and outputting the resultant signal.
摘要:
A solid-state imaging apparatus includes a solid-state imaging device and a signal processing circuit. The solid-state imaging device includes: a plurality of photoelectric converting sections provided with color filters having different spectroscopic characteristics, and each converting light incident thereon into a charge and accumulating the charge, and a plurality of vertical charge transfer sections for vertically transferring the charge read from each of the photoelectric converting sections. A plurality of reading operations to read the charges accumulated in the photoelectric converting sections to the plurality of the vertical charge transfer sections are performed within a time duration for scanning an image for one image plane, and the charges read from the photoelectric converting sections are transferred through the vertical charge transfer section separately for each of the reading operations. The signal processing circuit includes: a plurality of color separation circuits each for performing color separation of signals based on the charges read by the plurality of reading operations and transferred separately; and a synthesis circuit for synthesizing the signals sent by the color separation circuits and outputting the resultant signal.
摘要:
An imaging and processing device includes: an optical element; a single imager with a color filter array of a plurality of colors attached thereto for outputting a value according to an amount of light which has been guided by the optical element and transmitted through the color filter array, thereby enabling to obtain separate images of the plurality of colors for every frame time point; a first adder section for adding together values, associated with a first color of the plurality of colors, of different images obtained over a plurality of frame time points; a second adder section for adding together a plurality of values, associated with a second color of the plurality of colors other than the first color, of an image captured at a single frame time point; and an image restoring section for restoring an image including a plurality of colors at each frame time point from an image based on the first color which has been subjected to the addition by the first adder section, and an image based on the second color which has been subjected to the addition by the second adder section.
摘要:
An image feature analyzing section performs an image feature analysis with respect to an input image to output an image feature vector. A parameter output section stores a plurality of image feature vectors and a plurality of parameters corresponding to the respective image feature vectors and outputs an original parameter value corresponding to an image feature vector. A parameter operation setting section determines contents of an operation of an illumination equation parameter, depending on a prescribed image conversion. A parameter operating section operates the original parameter value in accordance with a prescription of the parameter operation setting section, to obtain a new parameter value. An image generating section generates an output image based on the new parameter value.
摘要:
In a learning process, first, images having different resolutions are obtained from a target region of the subject (S101). Further, the subject characteristic of the target region is obtained (S102). Then, the resolution conversion rules are learned from the images having different resolutions, and those are recorded to a storage device along with the subject characteristics (S103). When converting the resolutions, the resolution conversion rules learned for the corresponding subject characteristics are applied to each region of the original image so as to convert the resolutions of the original image.
摘要:
An image feature analyzing section performs an image feature analysis with respect to an input image to output an image feature vector. A parameter output section stores a plurality of image feature vectors and a plurality of parameters corresponding to the respective image feature vectors and outputs an original parameter value corresponding to an image feature vector. A parameter operation setting section determines contents of an operation of an illumination equation parameter, depending on a prescribed image conversion. A parameter operating section operates the original parameter value in accordance with a prescription of the parameter operation setting section, to obtain a new parameter value. An image generating section generates an output image based on the new parameter value.
摘要:
An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess portion to provide a vacuum dome. After forming a depth of cut into the substrate portion of the cap wafer, the cap wafer is placed on a main body wafer having an infrared area sensor formed thereon. Then, the ring-shaped film of the cap wafer and the ring-shaped film of the main body wafer are joined to each other by pressure bonding to form a ring-shaped joining portion.