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65 条记录 (耗时 0.028 秒)

    Flexible glove-like heat sink
    3.
    发明授权
    Flexible glove-like heat sink 有权

    公开(公告)号：US06547001B2

    公开(公告)日：2003-04-15

    申请号：US10064069

    申请日：2002-06-06

    申请人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    发明人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    IPC分类号： F28F700

    CPC分类号： H01L23/3675 ,  B21D53/02 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat sink assembly for removing heat from an object having an outer surface includes a main body with an object receiving seat. A pair of flexible securing tabs are connected to the free edge of the open end of the main body which emanate into the open end of the main body. A heat dissipation members emanate from the outer surface of the main body to assist in dissipating the heat received by the main body from the heat generating object. The main body, the pair of flexible securing tabs and heat dissipating members are integrally formed with one another of a thermally conductive elastic or elastomeric material. An object to be cooled is inserted into the object receiving seat of the main body and retained in the seat and in communication with the inner surfaces of the main body by the pair of flexible securing tabs.

    Overplated thermally conductive part with EMI shielding
    4.
    发明授权
    Overplated thermally conductive part with EMI shielding 有权

    公开(公告)号：US06543524B2

    公开(公告)日：2003-04-08

    申请号：US09886629

    申请日：2001-06-21

    申请人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    发明人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    IPC分类号： F28F1318

    CPC分类号： F28F21/06 ,  F28F13/18 ,  H01L23/36 ,  H01L23/552 ,  H01L2924/0002 ,  Y10S165/905 ,  H01L2924/00

    摘要： A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.

    Molded electronic connector formed from a thermally conductive polymer composition and method of making the same
    6.
    发明授权
    Molded electronic connector formed from a thermally conductive polymer composition and method of making the same 有权
    由导热聚合物组合物形成的模制电子连接器及其制造方法

    公开(公告)号：US06981805B2

    公开(公告)日：2006-01-03

    申请号：US11011996

    申请日：2004-12-14

    申请人： James D. Miller ,  E. Mikhail Sagal ,  Kevin A. McCullough

    发明人： James D. Miller ,  E. Mikhail Sagal ,  Kevin A. McCullough

    IPC分类号： G02B6/36 ,  H01R13/00

    CPC分类号： H05K9/0083 ,  G02B6/3814 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4272 ,  G02B6/4277 ,  G02B6/4284 ,  H05K7/20

    摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

    摘要翻译： 提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。 外壳在电路板和发热部件上模制。 壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。 可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。 在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。 模制外壳能够散发来自发热部件的热量。 还提供了制造电子连接器的方法。

    Method of forming a highly thermally conductive and high strength article
    7.
    发明授权
    Method of forming a highly thermally conductive and high strength article 有权
    形成高导热和高强度制品的方法

    公开(公告)号：US06835347B2

    公开(公告)日：2004-12-28

    申请号：US10605059

    申请日：2003-09-05

    申请人： Kevin A. McCullough ,  James D. Miller ,  E. Mikhail Sagal

    发明人： Kevin A. McCullough ,  James D. Miller ,  E. Mikhail Sagal

    IPC分类号： H05B600

    CPC分类号： C08K3/04 ,  C08K7/00 ,  C08K2201/014 ,  C08K2201/016

    摘要： A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

    摘要翻译： 具有高于4W / m°K的热导率和至少15ksi的强度的高导热和高强度网状可模制成型组合物包括体积在30％至70％之间的聚合物基质基质。 在具有至少10:1的相对高的纵横比的组合物中提供了高模量PITCH基碳的第一高度导热填料，体积为15％至47％。 在组合物混合物中也是第二种具有10至35％体积的PAN基碳的高强度填料，其具有10:1或更高的相对高的纵横比。 任选地，具有5:1或更小的纵横比的相对低的导热材料的第三填料可以以体积小于10％包含在组合物中，以提高组合物的热导率和强度。

    Thermally conductive and high strength injection moldable composition
    8.
    发明授权
    Thermally conductive and high strength injection moldable composition 失效
    导热和高强度注塑成型组合物

    公开(公告)号：US06710109B2

    公开(公告)日：2004-03-23

    申请号：US09903347

    申请日：2001-07-11

    申请人： Kevin A. McCullough ,  James D. Miller ,  E. Mikhail Sagal

    发明人： Kevin A. McCullough ,  James D. Miller ,  E. Mikhail Sagal

    IPC分类号： C08K338

    CPC分类号： C08K3/04 ,  C08K7/00 ,  C08K2201/014 ,  C08K2201/016

    摘要： A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

    摘要翻译： 具有高于4W / m°K的热导率和至少15ksi的强度的高导热和高强度网状可模制成型组合物包括体积在30％至70％之间的聚合物基质基质。 在具有至少10:1的相对高的纵横比的组合物中提供了高模量PITCH基碳的第一高度导热填料，体积为15％至47％。 在组合物混合物中也是第二种具有10至35％体积的PAN基碳的高强度填料，其具有10:1或更高的相对高的纵横比。 任选地，具有5:1或更小的纵横比的相对低的导热材料的第三填料可以以体积小于10％包含在组合物中，以提高组合物的热导率和强度。