-
1.发明授权Printed circuit board reinforcement structure and integrated circuit package using the same 有权印刷电路板加固结构和集成电路封装采用相同公开(公告)号：US08059384B2
公开(公告)日：2011-11-15
申请号：US12183463
申请日：2008-07-31
申请人： Se Ho Park , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
发明人： Se Ho Park , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
CPC分类号： H05K1/0271 , H05K1/181 , H05K3/0061 , H05K3/0064 , H05K2201/0133 , H05K2203/063
摘要： A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.
摘要翻译： 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。
-
公开(公告)号：US20100011573A1
公开(公告)日：2010-01-21
申请号：US12504339
申请日：2009-07-16
申请人： Ki-Hyun KIM , Se-Ho Park , Seok-Myong Kang , Young-Min Lee
发明人： Ki-Hyun KIM , Se-Ho Park , Seok-Myong Kang , Young-Min Lee
IPC分类号： H05K3/10
CPC分类号： H05K3/4069 , H05K1/0393 , H05K1/095 , H05K3/12 , H05K3/246 , H05K2201/0347 , H05K2201/0352 , H05K2201/09981 , Y10T29/49155 , Y10T29/49165
摘要： A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.
摘要翻译： 提供一种制造印刷电路板的方法。 该方法包括制造包括第一侧和与第一侧相对的第二侧的基膜; 用粘度为5000至300,000厘泊（CPS）的高粘度导电材料在第一侧印刷第一布线; 形成穿过基膜的两侧的通孔，并通过第一布线; 以及使用粘度为100-5,000CPS的低粘度导电材料在第二侧上印刷第二布线。 将低粘度导电材料施加到通孔的内壁，以将第一布线导电连接到第二布线。
-
3.发明申请PRINTED CIRCUIT BOARD REINFORCEMENT STRUCTURE AND INTEGRATED CIRCUIT PACKAGE USING THE SAME 有权印刷电路板加固结构和使用其的集成电路封装公开(公告)号：US20090032292A1
公开(公告)日：2009-02-05
申请号：US12183463
申请日：2008-07-31
申请人： Se Ho PARK , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
发明人： Se Ho PARK , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
IPC分类号： H05K1/03
CPC分类号： H05K1/0271 , H05K1/181 , H05K3/0061 , H05K3/0064 , H05K2201/0133 , H05K2203/063
摘要： A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.
摘要翻译： 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。
-
公开(公告)号：US20100259453A1
公开(公告)日：2010-10-14
申请号：US12757360
申请日：2010-04-09
申请人： Joon-Il KIM , Se-Ho Park , Woo-Ram Lee , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
发明人： Joon-Il KIM , Se-Ho Park , Woo-Ram Lee , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
摘要： An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.
摘要翻译： 提供内部天线，其包括具有形成在第一介电层上的第一天线图案的第一天线和形成在第二介电层上的第二天线图案的第二天线。 第二电介质层具有比第一介电层更高的介电常数。 第一和第二天线图彼此电连接。
-
公开(公告)号：US08487818B2
公开(公告)日：2013-07-16
申请号：US12757360
申请日：2010-04-09
申请人： Joon-II Kim , Se-Ho Park , Woo-Ram Lee , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
发明人： Joon-II Kim , Se-Ho Park , Woo-Ram Lee , Young-Min Lee , Ki-Hyun Kim , Seok-Myong Kang
IPC分类号： H01Q1/38
摘要： An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.
摘要翻译： 提供内部天线，其包括具有形成在第一介电层上的第一天线图案的第一天线和形成在第二介电层上的第二天线图案的第二天线。 第二电介质层具有比第一介电层更高的介电常数。 第一和第二天线图彼此电连接。
-
公开(公告)号：US08474135B2
公开(公告)日：2013-07-02
申请号：US12504339
申请日：2009-07-16
申请人： Ki-Hyun Kim , Se Ho Park , Seok-Myong Kang , Young-Min Lee
发明人： Ki-Hyun Kim , Se Ho Park , Seok-Myong Kang , Young-Min Lee
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , H05K1/0393 , H05K1/095 , H05K3/12 , H05K3/246 , H05K2201/0347 , H05K2201/0352 , H05K2201/09981 , Y10T29/49155 , Y10T29/49165
摘要： A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.
摘要翻译： 提供一种制造印刷电路板的方法。 该方法包括制造包括第一侧和与第一侧相对的第二侧的基膜; 用粘度为5000至300,000厘泊（CPS）的高粘度导电材料在第一侧印刷第一布线; 形成穿过基膜的两侧的通孔，并通过第一布线; 以及使用粘度为100-5,000CPS的低粘度导电材料在第二侧上印刷第二布线。 将低粘度导电材料施加到通孔的内壁，以将第一布线导电连接到第二布线。
-
7.发明授权Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same 有权具有导电油墨/糊剂的印刷电路板，具有镀层及其制造方法公开(公告)号：US08138422B2
公开(公告)日：2012-03-20
申请号：US12512588
申请日：2009-07-30
申请人： Se-Ho Park , Ki-Hyun Kim , Seok-Myong Kang , Young-Min Lee
发明人： Se-Ho Park , Ki-Hyun Kim , Seok-Myong Kang , Young-Min Lee
CPC分类号： H05K3/246 , H05K1/092 , H05K1/095 , H05K2201/0347 , H05K2203/1131 , Y10T29/49155
摘要： A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.
摘要翻译： 提供印刷电路板（PCB）及其制造方法。 通过在基板上印刷导电油墨/糊料，并且通过加热来烧结导电油墨层或固化导电浆料层而形成电路图案。 通过电路图案上的高熔点金属的化学镀或电解电镀形成初级镀层。 通过在主镀层上的贵金属的化学镀或电解电镀形成二次镀层，以改善用焊料的润湿。
-
8.发明授权Wireless power transmission and reception apparatus having resonance frequency stabilization circuit and method thereof 有权具有谐振频率稳定电路的无线电力传送和接收装置及其方法公开(公告)号：US08823215B2
公开(公告)日：2014-09-02
申请号：US13029807
申请日：2011-02-17
申请人： Se-Ho Park , Sung-Kweon Park , Young-Min Lee , Ki-Hyun Kim , Hong-Kweun Kim , Woo-Ram Lee
发明人： Se-Ho Park , Sung-Kweon Park , Young-Min Lee , Ki-Hyun Kim , Hong-Kweun Kim , Woo-Ram Lee
IPC分类号： H01F27/42
摘要： A wireless power transmission apparatus and method for wirelessly transmitting power to a wireless power reception apparatus electromagnetically coupled to the wireless power reception apparatus and supplying power for loads of the wireless power reception apparatus is provided. The apparatus includes a power generator for generating power having a fixed oscillation frequency; a power transmission resonator, which has a resonance frequency identical to the oscillation frequency, for wirelessly transmitting the power generated by the power generator to the wireless power reception apparatus; and a power transmission resonance frequency controller for controlling the resonance frequency of the power transmission resonator in response to a change of the resonance frequency of the power transmission resonator.
摘要翻译： 提供一种无线电力传输装置和方法，用于向与无线电力接收装置电磁耦合并为无线电力接收装置的负载供电的无线电力接收装置无线地发送电力。 该装置包括用于产生具有固定振荡频率的功率的发电机; 具有与振荡频率相同的谐振频率的功率传输谐振器，用于将由发电机产生的电力无线发送到无线电力接收装置; 以及功率传输谐振频率控制器，用于响应于功率传输谐振器的谐振频率的变化来控制功率传输谐振器的谐振频率。
-
公开(公告)号：US20110074344A1
公开(公告)日：2011-03-31
申请号：US12893619
申请日：2010-09-29
申请人： Se-Ho PARK , Young-Min Lee , Sung-Kweon Park , Ki-Hyun Kim , Hong-Kweun Kim , Woo-Ram Lee
发明人： Se-Ho PARK , Young-Min Lee , Sung-Kweon Park , Ki-Hyun Kim , Hong-Kweun Kim , Woo-Ram Lee
IPC分类号： H02J7/00
摘要： A wireless charger of an inductive coupling type for charging a portable device provided with a rechargeable built-in battery having a second coil, includes a housing provided with a touch pad on one surface; a first coil retained within the housing; and a driving means for horizontally moving the first coil in a plane parallel to the one surface on which the touch pad is installed, wherein when the portable device is placed on the touch pad, the touch pad senses the position of the portable device to activate the driving means and displaces the first coil to a position facing the second coil.
摘要翻译： 一种用于对设置有具有第二线圈的可再充电内置电池的便携式设备进行充电的感应耦合型无线充电器，包括在一个表面上设置有触摸板的外壳; 保持在壳体内的第一线圈; 以及用于在平行于安装有触摸板的一个表面的平面中水平移动第一线圈的驱动装置，其中当便携式装置放置在触摸板上时，触摸板感测便携式装置的位置激活 所述驱动装置将所述第一线圈移位到面向所述第二线圈的位置。
-
公开(公告)号：US08541975B2
公开(公告)日：2013-09-24
申请号：US12884065
申请日：2010-09-16
申请人： Sung-Kweon Park , Young-Min Lee , Ki-Hyun Kim , Hong-Kweun Kim , Se-Ho Park , Woo-Ram Lee
发明人： Sung-Kweon Park , Young-Min Lee , Ki-Hyun Kim , Hong-Kweun Kim , Se-Ho Park , Woo-Ram Lee
IPC分类号： H02J7/00
摘要： Disclosed is a method and apparatus for efficient wireless charging of a mobile terminal. The method includes detecting the mobile terminal by a charging apparatus, receiving a unique identifier of the mobile terminal from the mobile terminal and determining if the mobile terminal is a rechargeable device, when the mobile terminal is a rechargeable device, applying a direct voltage to a first coil of the charging apparatus and arranging the charging apparatus and the mobile terminal, and terminating an application of the direct voltage and then applying an alternating voltage, to supply charging power required for the mobile terminal.
摘要翻译： 公开了一种用于移动终端的有效无线充电的方法和装置。 该方法包括：通过计费装置检测移动终端，从移动终端接收移动终端的唯一标识符，并确定移动终端是否是可再充电设备，当移动终端是可再充电设备时，将直接电压施加到 充电装置的第一线圈，并且布置充电装置和移动终端，并终止直流电压的施加，然后施加交流电压，以提供移动终端所需的充电功率。
-
-
-
-
-
-
-
-
-
搜索结果
98 条记录 (耗时 0.026 秒)
