公开(公告)号：US08487818B2

公开(公告)日：2013-07-16

申请号：US12757360

申请日：2010-04-09

申请人： Joon-II Kim ,  Se-Ho Park ,  Woo-Ram Lee ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

发明人： Joon-II Kim ,  Se-Ho Park ,  Woo-Ram Lee ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

IPC分类号： H01Q1/38

CPC分类号： H01Q1/52 ,  H01Q1/243

摘要： An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.

摘要翻译： 提供内部天线，其包括具有形成在第一介电层上的第一天线图案的第一天线和形成在第二介电层上的第二天线图案的第二天线。 第二电介质层具有比第一介电层更高的介电常数。 第一和第二天线图彼此电连接。

公开(公告)号：US20130057079A1

公开(公告)日：2013-03-07

申请号：US13605381

申请日：2012-09-06

申请人： Se-Ho PARK ,  Ki-Hyun Kim ,  Joon-II Kim ,  Jin-Hyoung Park ,  Kyung-Woo Lee ,  Woo-Ram Lee

发明人： Se-Ho PARK ,  Ki-Hyun Kim ,  Joon-II Kim ,  Jin-Hyoung Park ,  Kyung-Woo Lee ,  Woo-Ram Lee

IPC分类号： H02J17/00

CPC分类号： H02J7/00 ,  H02J7/025 ,  H02J50/12 ,  H02J50/40 ,  H02J2007/0096 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0081

摘要： An apparatus for controlling wireless power transmission includes a near-field wireless communication antenna for receiving wireless power transmission control signals from a power transmitting device at a communication frequency, a near-field wireless communication Integrated Circuit (IC) for delivering wireless power transmission control messages based on the wireless power transmission control signals received through the near-field wireless communication antenna to a power IC, a Wireless Power Transmission (WPT) coil for resonating at a frequency band corresponding to a resonant frequency of the power transmitting device, to receive power supplied from the power transmitting device, and the power IC for controlling output of a constant voltage, using the supply power received by the WPT coil, based on the wireless power transmission control messages from the near-field wireless communication IC.

摘要翻译： 用于控制无线电力传输的装置包括用于从通信频率的功率发送装置接收无线电力传输控制信号的近场无线通信天线，用于传送无线电力传输控制消息的近场无线通信集成电路（IC） 基于通过近场无线通信天线向电力IC接收的无线电力传输控制信号，用于在对应于电力发送装置的谐振频率的频带谐振的无线电力传输（WPT）线圈，以接收电力 基于来自近场无线通信IC的无线功率传输控制消息，使用由WPT线圈接收的供电功率，从电力发送装置供给的电力IC和用于控制恒定电压的电力IC。

公开(公告)号：US20110165734A1

公开(公告)日：2011-07-07

申请号：US12985900

申请日：2011-01-06

申请人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

发明人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.

摘要翻译： 半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后， 去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

公开(公告)号：US06818473B2

公开(公告)日：2004-11-16

申请号：US10394228

申请日：2003-03-24

申请人： Joon II Kim ,  Chul Ho Kim ,  Ik Seo Choi

发明人： Joon II Kim ,  Chul Ho Kim ,  Ik Seo Choi

IPC分类号： H01L2144

CPC分类号： H01L23/3121 ,  H01L23/24 ,  H01L2924/0002 ,  H01L2924/00

摘要： Described is a method for fabricating ceramic chip packages in which an epoxy resin containing fine ceramic particles is applied on a ceramic substrate provided with chip packages respectively having a plurality of chips mounted thereon, thereby improving reliability and endurance of the package and miniaturizing the size of the package. The epoxy resin is applied on the ceramic substrate provided with a plurality of the chips mounted thereon except a designated region, thereby minimizing the deformation of the substrate. The epoxy resin layer is formed on the substrate by two steps including a first step for forming a first epoxy resin layer serving as a dam and a second step for forming a second epoxy resin layer, thereby reducing the amount of the used epoxy resin and improving reliability and endurance of the package against temperature and humidity.

摘要翻译： 描述了一种用于制造陶瓷芯片封装的方法，其中将含有细陶瓷颗粒的环氧树脂施加在具有分别具有安装在其上的多个芯片的芯片封装的陶瓷基板上，从而提高封装的可靠性和耐用性并使尺寸小型化 包装。 将环氧树脂施加在除了指定区域之外安装有多个芯片的陶瓷基板上，从而使基板的变形最小化。 环氧树脂层通过两个步骤形成在基板上，该步骤包括用于形成用作坝的第一环氧树脂层的第一步骤和用于形成第二环氧树脂层的第二步骤，从而减少使用的环氧树脂的量并改善 包装的温度和湿度的可靠性和耐久性。

公开(公告)号：US20120293010A1

公开(公告)日：2012-11-22

申请号：US13474330

申请日：2012-05-17

申请人： Woo-Ram LEE ,  Joon-II KIM ,  Sung-Bum PARK ,  Young-Min LEE ,  Hong-Kweun KIM ,  Se-Ho PARK ,  Seung-Woo HAN

发明人： Woo-Ram LEE ,  Joon-II KIM ,  Sung-Bum PARK ,  Young-Min LEE ,  Hong-Kweun KIM ,  Se-Ho PARK ,  Seung-Woo HAN

IPC分类号： H02J17/00

CPC分类号： H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02J50/80 ,  H02J50/90

摘要： A wireless power transmission controlling apparatus and method are provided. The apparatus includes a power amplifier that receives a source power, amplifies the received source power, and outputs a wireless power transmission signal from the amplified received source power, a band pass filter that filters the wireless power transmission signal, and passes a harmonic wave corresponding to a communication frequency band, and a communication unit that transmits a wireless power transmission control signal using the harmonic wave corresponding to the communication frequency band.

摘要翻译： 提供一种无线电力传输控制装置和方法。 该装置包括：功率放大器，接收源功率，放大接收的源功率，并从放大的接收源功率输出无线功率传输信号;滤波器，对通过无线功率传输信号进行滤波，并传递相应的谐波; 通信单元，其使用与通信频带对应的谐波发送无线电力传输控制信号。