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22 条记录 (耗时 0.013 秒)

    RESISTIVE OVERLAY-TYPE TOUCH SENSOR FOR TOUCH SCREEN PANEL AND METHOD FOR FABRICATING THE SAME
    2.
    发明申请
    RESISTIVE OVERLAY-TYPE TOUCH SENSOR FOR TOUCH SCREEN PANEL AND METHOD FOR FABRICATING THE SAME 审中-公开
    用于触摸屏的电阻式覆盖式触摸传感器及其制造方法

    公开(公告)号：US20130063391A1

    公开(公告)日：2013-03-14

    申请号：US13333244

    申请日：2011-12-21

    申请人： Seok-Myong KANG ,  Shi-Yun CHO ,  Ho-Seong SEO

    发明人： Seok-Myong KANG ,  Shi-Yun CHO ,  Ho-Seong SEO

    IPC分类号： G06F3/045 ,  H01H11/00

    CPC分类号： G06F3/045 ,  G06F2203/04102 ,  G06F2203/04103 ,  Y10T29/49105

    摘要： A resistive overlay-type touch sensor for a touch screen panel and a method for fabricating the same are provided, in which a plurality of first substrates are extended in parallel along a first direction, a plurality of second substrates are extended in parallel along a second direction perpendicular to the first direction, and a plurality of transparent electrodes are formed on the first and second substrates. The second substrates intersect with the first substrates, each second substrate facing alternately one and the other surfaces of the first substrates along the second direction, and each of the transparent electrodes on the first substrates faces one of the transparent electrodes on the second substrates.

    摘要翻译： 提供了一种用于触摸屏面板的电阻覆盖式触摸传感器及其制造方法，其中多个第一基板沿着第一方向平行地延伸，多个第二基板沿第二方向平行延伸 垂直于第一方向的方向，并且在第一和第二基板上形成多个透明电极。 第二基板与第一基板相交，第二基板沿着第二方向交替地与第一基板的一个表面和另一个表面交替，并且第一基板上的每个透明电极面对第二基板上的一个透明电极。

    Semiconductor package and method for manufacturing same
    4.
    发明申请
    Semiconductor package and method for manufacturing same 失效
    半导体封装及其制造方法

    公开(公告)号：US20070139900A1

    公开(公告)日：2007-06-21

    申请号：US11471385

    申请日：2006-06-20

    申请人： Hong-Kweun Kim ,  Ho-Seong Seo ,  Seok-Myong Kang ,  Youn-Kyoung Gil

    发明人： Hong-Kweun Kim ,  Ho-Seong Seo ,  Seok-Myong Kang ,  Youn-Kyoung Gil

    IPC分类号： H05K7/00

    CPC分类号： H05K1/141 ,  H01L23/24 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2924/19105 ,  H05K1/182 ,  H05K2201/09909 ,  H05K2201/10515 ,  H05K2201/2036 ,  H05K2203/049 ,  H01L2924/00014

    摘要： Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.

    摘要翻译： 本发明公开了一种半导体封装，其适用于轻，薄，紧凑，适用于高密度安装及其制造方法。 半导体封装包括半导体芯片; 多个主动/被动装置; 用作主板的第一PCB，所述半导体芯片和从所述多个主动/被动装置中选择的装置安装在所述第一PCB上，所述装置包括最高装置; 以及至少一个子PCB，所述多个有源/无源器件的剩余器件安装在所述子PCB上，所述子PCB具有通孔，所述第一PCB上的至少最高器件延伸穿过所述通孔， 使得子PCB连接到第一PCB并且定位在第一PCB上方的空间中，同时与第一PCB重叠。

    Method for fabricating printed circuit board
    6.
    发明授权
    Method for fabricating printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08474135B2

    公开(公告)日：2013-07-02

    申请号：US12504339

    申请日：2009-07-16

    申请人： Ki-Hyun Kim ,  Se Ho Park ,  Seok-Myong Kang ,  Young-Min Lee

    发明人： Ki-Hyun Kim ,  Se Ho Park ,  Seok-Myong Kang ,  Young-Min Lee

    IPC分类号： H01K3/10

    CPC分类号： H05K3/4069 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09981 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.

    摘要翻译： 提供一种制造印刷电路板的方法。 该方法包括制造包括第一侧和与第一侧相对的第二侧的基膜; 用粘度为5000至300,000厘泊（CPS）的高粘度导电材料在第一侧印刷第一布线; 形成穿过基膜的两侧的通孔，并通过第一布线; 以及使用粘度为100-5,000CPS的低粘度导电材料在第二侧上印刷第二布线。 将低粘度导电材料施加到通孔的内壁，以将第一布线导电连接到第二布线。

    FLEXIBLE DISPLAY DEVICE
    7.
    发明申请
    FLEXIBLE DISPLAY DEVICE 有权
    柔性显示装置

    公开(公告)号：US20130100053A1

    公开(公告)日：2013-04-25

    申请号：US13618086

    申请日：2012-09-14

    申请人： Seok-Myong KANG ,  Shi-Yun Cho ,  Ho-Seong Seo ,  In-Kuk Yun ,  Youn-Ho Choi

    发明人： Seok-Myong KANG ,  Shi-Yun Cho ,  Ho-Seong Seo ,  In-Kuk Yun ,  Youn-Ho Choi

    IPC分类号： G06F3/041 ,  B82Y15/00

    CPC分类号： G06F3/041 ,  G06F3/03 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04106

    摘要： Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.

    摘要翻译： 公开了一种灵活的显示装置，其适用于当柔性显示装置弯曲，弯曲或折叠时精确地检测弯曲信息，并且能够基于检测到的弯曲信息来各种控制显示在屏幕上的图像。 柔性显示装置包括柔性触摸屏部分和设置在触摸屏部分上的弯曲检测部分，弯曲检测部分具有根据触摸屏部分的弯曲而变化的静电电容或电阻，以便检测 弯曲信息。

    Printed circuit board reinforcement structure and integrated circuit package using the same
    9.
    发明授权
    Printed circuit board reinforcement structure and integrated circuit package using the same 有权
    印刷电路板加固结构和集成电路封装采用相同

    公开(公告)号：US08059384B2

    公开(公告)日：2011-11-15

    申请号：US12183463

    申请日：2008-07-31

    申请人： Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    发明人： Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    IPC分类号： H05K1/03 ,  H05K1/16

    CPC分类号： H05K1/0271 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/0133 ,  H05K2203/063

    摘要： A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

    摘要翻译： 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。