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    Antenna device and method of manufacturing the same
    2.
    发明授权
    Antenna device and method of manufacturing the same 有权
    天线装置及其制造方法

    公开(公告)号：US08284117B2

    公开(公告)日：2012-10-09

    申请号：US12644753

    申请日：2009-12-22

    申请人： Ki-Hyun Kim ,  Seok-Myong Kang ,  Se-Ho Park ,  Woo-Ram Lee

    发明人： Ki-Hyun Kim ,  Seok-Myong Kang ,  Se-Ho Park ,  Woo-Ram Lee

    IPC分类号： H01Q7/00

    CPC分类号： H01Q1/38 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/246 ,  H05K3/4069 ,  H05K2201/0715 ,  Y10T29/49016

    摘要： A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

    摘要翻译： 一种执行非接触式数据通信的射频识别（RFID）的信号发射/接收天线装置及其制造方法。 天线装置包括：天线模块，包括电介质膜基板，天线图案，其是印刷在电介质膜基板的顶侧和底面上的导电图案，顶部和底部天线图案部分通过一个或多个相互连接 穿过电介质膜基底的通孔，以及形成在电介质膜基底上以覆盖顶部和底部天线图形部分的顶部和底部钝化层; 以及印刷在天线模块的顶部和底部钝化层之一上的无线电波吸收体。

    Method for fabricating printed circuit board
    4.
    发明授权
    Method for fabricating printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08474135B2

    公开(公告)日：2013-07-02

    申请号：US12504339

    申请日：2009-07-16

    申请人： Ki-Hyun Kim ,  Se Ho Park ,  Seok-Myong Kang ,  Young-Min Lee

    发明人： Ki-Hyun Kim ,  Se Ho Park ,  Seok-Myong Kang ,  Young-Min Lee

    IPC分类号： H01K3/10

    CPC分类号： H05K3/4069 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09981 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.

    摘要翻译： 提供一种制造印刷电路板的方法。 该方法包括制造包括第一侧和与第一侧相对的第二侧的基膜; 用粘度为5000至300,000厘泊（CPS）的高粘度导电材料在第一侧印刷第一布线; 形成穿过基膜的两侧的通孔，并通过第一布线; 以及使用粘度为100-5,000CPS的低粘度导电材料在第二侧上印刷第二布线。 将低粘度导电材料施加到通孔的内壁，以将第一布线导电连接到第二布线。

    Printed circuit board reinforcement structure and integrated circuit package using the same
    6.
    发明授权
    Printed circuit board reinforcement structure and integrated circuit package using the same 有权
    印刷电路板加固结构和集成电路封装采用相同

    公开(公告)号：US08059384B2

    公开(公告)日：2011-11-15

    申请号：US12183463

    申请日：2008-07-31

    申请人： Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    发明人： Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    IPC分类号： H05K1/03 ,  H05K1/16

    CPC分类号： H05K1/0271 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/0133 ,  H05K2203/063

    摘要： A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

    摘要翻译： 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。

    PRINTED CIRCUIT BOARD REINFORCEMENT STRUCTURE AND INTEGRATED CIRCUIT PACKAGE USING THE SAME
    7.
    发明申请
    PRINTED CIRCUIT BOARD REINFORCEMENT STRUCTURE AND INTEGRATED CIRCUIT PACKAGE USING THE SAME 有权
    印刷电路板加固结构和使用其的集成电路封装

    公开(公告)号：US20090032292A1

    公开(公告)日：2009-02-05

    申请号：US12183463

    申请日：2008-07-31

    申请人： Se Ho PARK ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    发明人： Se Ho PARK ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0271 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/0133 ,  H05K2203/063

    摘要： A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

    摘要翻译： 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。

    Wireless power transmission and reception apparatus having resonance frequency stabilization circuit and method thereof
    8.
    发明授权
    Wireless power transmission and reception apparatus having resonance frequency stabilization circuit and method thereof 有权
    具有谐振频率稳定电路的无线电力传送和接收装置及其方法

    公开(公告)号：US08823215B2

    公开(公告)日：2014-09-02

    申请号：US13029807

    申请日：2011-02-17

    申请人： Se-Ho Park ,  Sung-Kweon Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Woo-Ram Lee

    发明人： Se-Ho Park ,  Sung-Kweon Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Woo-Ram Lee

    IPC分类号： H01F27/42

    CPC分类号： H02J50/12 ,  H02J7/025 ,  H02J17/00

    摘要： A wireless power transmission apparatus and method for wirelessly transmitting power to a wireless power reception apparatus electromagnetically coupled to the wireless power reception apparatus and supplying power for loads of the wireless power reception apparatus is provided. The apparatus includes a power generator for generating power having a fixed oscillation frequency; a power transmission resonator, which has a resonance frequency identical to the oscillation frequency, for wirelessly transmitting the power generated by the power generator to the wireless power reception apparatus; and a power transmission resonance frequency controller for controlling the resonance frequency of the power transmission resonator in response to a change of the resonance frequency of the power transmission resonator.

    摘要翻译： 提供一种无线电力传输装置和方法，用于向与无线电力接收装置电磁耦合并为无线电力接收装置的负载供电的无线电力接收装置无线地发送电力。 该装置包括用于产生具有固定振荡频率的功率的发电机; 具有与振荡频率相同的谐振频率的功率传输谐振器，用于将由发电机产生的电力无线发送到无线电力接收装置; 以及功率传输谐振频率控制器，用于响应于功率传输谐振器的谐振频率的变化来控制功率传输谐振器的谐振频率。

    WIRELESS CHARGER USING INDUCTIVE COUPLING
    9.
    发明申请
    WIRELESS CHARGER USING INDUCTIVE COUPLING 审中-公开
    无线充电器使用电感耦合

    公开(公告)号：US20110074344A1

    公开(公告)日：2011-03-31

    申请号：US12893619

    申请日：2010-09-29

    申请人： Se-Ho PARK ,  Young-Min Lee ,  Sung-Kweon Park ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Woo-Ram Lee

    发明人： Se-Ho PARK ,  Young-Min Lee ,  Sung-Kweon Park ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Woo-Ram Lee

    IPC分类号： H02J7/00

    CPC分类号： H02J50/90 ,  H01F38/14 ,  H02J7/025 ,  H02J50/10

    摘要： A wireless charger of an inductive coupling type for charging a portable device provided with a rechargeable built-in battery having a second coil, includes a housing provided with a touch pad on one surface; a first coil retained within the housing; and a driving means for horizontally moving the first coil in a plane parallel to the one surface on which the touch pad is installed, wherein when the portable device is placed on the touch pad, the touch pad senses the position of the portable device to activate the driving means and displaces the first coil to a position facing the second coil.

    摘要翻译： 一种用于对设置有具有第二线圈的可再充电内置电池的便携式设备进行充电的感应耦合型无线充电器，包括在一个表面上设置有触摸板的外壳; 保持在壳体内的第一线圈; 以及用于在平行于安装有触摸板的一个表面的平面中水平移动第一线圈的驱动装置，其中当便携式装置放置在触摸板上时，触摸板感测便携式装置的位置激活 所述驱动装置将所述第一线圈移位到面向所述第二线圈的位置。

    System and method for efficient wireless charging of a mobile terminal
    10.
    发明授权
    System and method for efficient wireless charging of a mobile terminal 有权
    移动终端高效无线充电的系统和方法

    公开(公告)号：US08541975B2

    公开(公告)日：2013-09-24

    申请号：US12884065

    申请日：2010-09-16

    申请人： Sung-Kweon Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Se-Ho Park ,  Woo-Ram Lee

    发明人： Sung-Kweon Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Hong-Kweun Kim ,  Se-Ho Park ,  Woo-Ram Lee

    IPC分类号： H02J7/00

    CPC分类号： H02J50/10 ,  H02J7/025 ,  H02J50/40 ,  H02J50/80 ,  H02J50/90

    摘要： Disclosed is a method and apparatus for efficient wireless charging of a mobile terminal. The method includes detecting the mobile terminal by a charging apparatus, receiving a unique identifier of the mobile terminal from the mobile terminal and determining if the mobile terminal is a rechargeable device, when the mobile terminal is a rechargeable device, applying a direct voltage to a first coil of the charging apparatus and arranging the charging apparatus and the mobile terminal, and terminating an application of the direct voltage and then applying an alternating voltage, to supply charging power required for the mobile terminal.

    摘要翻译： 公开了一种用于移动终端的有效无线充电的方法和装置。 该方法包括：通过计费装置检测移动终端，从移动终端接收移动终端的唯一标识符，并确定移动终端是否是可再充电设备，当移动终端是可再充电设备时，将直接电压施加到 充电装置的第一线圈，并且布置充电装置和移动终端，并终止直流电压的施加，然后施加交流电压，以提供移动终端所需的充电功率。