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12 条记录 (耗时 0.015 秒)

    MEMS apparatus disposed on assembly lid
    2.
    发明授权
    MEMS apparatus disposed on assembly lid 有权
    MEMS装置设置在组装盖上

    公开(公告)号：US09491539B2

    公开(公告)日：2016-11-08

    申请号：US13953175

    申请日：2013-07-29

    申请人： Knowles Electronics, LLC

    发明人： Sandra F. Vos ,  John B. Szczech

    IPC分类号： H04R25/00 ,  H04R3/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H01L29/84

    CPC分类号： H04R3/00 ,  H01L2224/48137 ,  H01L2224/49171 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    摘要： A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

    摘要翻译： 微机电系统（MEMS）组件包括基板，盖，MEMS装置和至少一个壁。 衬底具有电连接焊盘，并且电连接焊盘耦合到延伸穿过衬底的电导体。 MEMS器件连接到盖子上。 所述至少一个壁联接到所述盖和所述基底并且与所述盖分开形成并且具有设置在其中的电导管。 电导体电耦合到基底上的电导体。 电导管和电导体在MEMS器件和电连接焊盘之间形成电路径。

    Embedded Circuit In A MEMS Device
    3.
    发明申请
    Embedded Circuit In A MEMS Device 有权
    MEMS器件中的嵌入式电路

    公开(公告)号：US20150251898A1

    公开(公告)日：2015-09-10

    申请号：US14665745

    申请日：2015-03-23

    申请人： Knowles Electronics, LLC

    发明人： Sandra F. Vos ,  Daniel Giesecke

    IPC分类号： B81B7/00 ,  B81B3/00

    CPC分类号： H04R1/04 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H01L2924/00014

    摘要： A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.

    摘要翻译： 微机电系统（MEMS）麦克风包括基板印刷电路板（PCB），基板PCB具有用户焊盘; 耦合到所述基座的至少一个壁; 耦合到所述至少壁的盖PCB，所述盖具有在其延伸的端口; 导电通孔，其延伸穿过所述壁将所述盖PCB电连接到所述基底PCB; 集成电路，嵌入在盖中并耦合到导电通孔通孔; 以及耦合到盖中的集成电路并设置在端口上的微机电系统（MEMS）装置。 声能被MEMS器件转换成电信号并传输到集成电路。 集成电路处理信号，并通过导电通孔通孔将经处理的信号发送到用户焊盘。

    Embedded circuit in a MEMS device
    5.
    发明授权
    Embedded circuit in a MEMS device 有权
    MEMS器件中的嵌入式电路

    公开(公告)号：US09485560B2

    公开(公告)日：2016-11-01

    申请号：US14665745

    申请日：2015-03-23

    申请人： Knowles Electronics, LLC

    发明人： Sandra F. Vos ,  Daniel Giesecke

    IPC分类号： H04R25/00 ,  H04R1/04 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00 ,  H01L29/84 ,  H04R19/04

    CPC分类号： H04R1/04 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H01L2924/00014

    摘要： A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.

    摘要翻译： 微机电系统（MEMS）麦克风包括基板印刷电路板（PCB），基板PCB具有用户焊盘; 耦合到所述基座的至少一个壁; 耦合到所述至少壁的盖PCB，所述盖具有在其延伸的端口; 导电通孔，其延伸穿过所述壁将所述盖PCB电连接到所述基底PCB; 集成电路，嵌入在盖中并耦合到导电通孔通孔; 以及耦合到盖中的集成电路并设置在端口上的微机电系统（MEMS）装置。 声能被MEMS器件转换成电信号并传输到集成电路。 集成电路处理信号，并通过导电通孔通孔将经处理的信号发送到用户焊盘。

    Microphone Assembly
    7.
    发明申请
    Microphone Assembly 审中-公开
    麦克风装配

    公开(公告)号：US20140037120A1

    公开(公告)日：2014-02-06

    申请号：US13953209

    申请日：2013-07-29

    申请人： Knowles Electronics, LLC

    发明人： Tony K. Lim ,  Qing Wang ,  Sandra F. Vos

    IPC分类号： H04R23/00

    CPC分类号： H04R23/00 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005

    摘要： A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.

    摘要翻译： 微机电系统（MEMS）组件包括盖，衬底，布置在盖子和衬底之间并附接到盖子和衬底之间的至少一个壁，设置在盖子处的MEMS器件和设置在衬底处的集成电路。 集成电路和MEMS器件彼此重叠地设置并且至少部分地通过延伸穿过壁的导管电连接在一起。 或者，MEMS器件可以设置在基板上，并且集成电路设置在基座上。

    EMBEDDED CIRCUIT IN A MEMS DEVICE
    8.
    发明申请
    EMBEDDED CIRCUIT IN A MEMS DEVICE 有权
    MEMS器件中的嵌入式电路

    公开(公告)号：US20130193533A1

    公开(公告)日：2013-08-01

    申请号：US13755417

    申请日：2013-01-31

    申请人： Knowles Electronics, LLC

    发明人： Sandra F. Vos ,  Daniel Giesecke

    IPC分类号： B81B3/00

    CPC分类号： B81B3/0064 ,  B81C1/0023 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/181 ,  H04R19/005 ,  Y10T29/49005 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.

    摘要翻译： 微机电系统（MEMS）麦克风包括印刷电路板，MEMS管芯和集成电路。 MEMS管芯设置在印刷电路板的顶表面上。 集成电路至少部分地布置在印刷电路板内并产生至少一个输出信号。 集成电路的输出信号被直接路由到至少一个导体中以访问印刷电路板上的焊盘，并且存取焊盘设置在印刷电路板的与顶表面相对的底表面上。

    RAISED SHOULDER MICRO ELECTRO MECHANICAL SYSTEM (MEMS) MICROPHONE
    9.
    发明申请
    RAISED SHOULDER MICRO ELECTRO MECHANICAL SYSTEM (MEMS) MICROPHONE 审中-公开
    升降式微电子机械系统（MEMS）麦克风

    公开(公告)号：US20160353212A1

    公开(公告)日：2016-12-01

    申请号：US15163586

    申请日：2016-05-24

    申请人： Knowles Electronics, LLC

    发明人： Eric J. Lautenschlager ,  Sandra F. Vos

    IPC分类号： H04R19/04 ,  H03H11/04 ,  H04R19/00

    CPC分类号： H03H11/04 ,  H04R1/04 ,  H04R19/005 ,  H04R2201/029

    摘要： Microphone devices are disclosed. The microphone device includes a base, a lid, a side wall between the base and the lid, and a MEMS die. The side wall includes a first portion with a first width and a second portion with a second width disposed under the first portion. The first width is less than the second width such that a shoulder is formed on the second portion. The MEMS die is supported on the shoulder. The MEMS die includes a diaphragm and a back plate.

    摘要翻译： 公开了麦克风装置。 麦克风装置包括底座，盖子，基座和盖子之间的侧壁以及MEMS模具。 侧壁包括具有第一宽度的第一部分和设置在第一部分下方的具有第二宽度的第二部分。 第一宽度小于第二宽度，使得在第二部分上形成肩部。 MEMS模具支撑在肩上。 MEMS管芯包括隔膜和背板。