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    Laser material processing system
    1.
    发明授权
    Laser material processing system 有权
    激光材料加工系统

    公开(公告)号：US08563893B2

    公开(公告)日：2013-10-22

    申请号：US12096940

    申请日：2006-12-12

    申请人： Koji Kuno ,  Kenichi Muramatsu ,  Kazuhiro Atsumi ,  Tetsuya Osajima

    发明人： Koji Kuno ,  Kenichi Muramatsu ,  Kazuhiro Atsumi ,  Tetsuya Osajima

    IPC分类号： H01L21/78 ,  H01S3/13 ,  B23K26/00 ,  B23K26/06

    CPC分类号： B23K26/048 ,  B23K26/046 ,  B23K26/0617 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

    摘要： A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

    摘要翻译： 激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2，用于致动透镜31的致动器，用于对测距激光的反射光L3增加散光的整形光学系统49， 用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42，以及用于调节致动器的控制器，并将测距激光L2的会聚点P2定位在透镜的焦点P0和 透镜31，从而能够在比正面3更深的位置形成改质区域，由此抑制由反射光L3引起的不利影响。 控制基于经过除以电压值之和的算术值，以防止算术值被反射光量改变。

    Laser Material Processing System
    2.
    发明申请
    Laser Material Processing System 有权
    激光材料加工系统

    公开(公告)号：US20090166342A1

    公开(公告)日：2009-07-02

    申请号：US12096940

    申请日：2006-12-12

    申请人： Koji Kuno ,  Kenichi Muramatsu ,  Kazuhiro Atsumi ,  Tetsuya Osajima

    发明人： Koji Kuno ,  Kenichi Muramatsu ,  Kazuhiro Atsumi ,  Tetsuya Osajima

    IPC分类号： B23K26/38

    CPC分类号： B23K26/048 ,  B23K26/046 ,  B23K26/0617 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

    摘要： A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

    摘要翻译： 激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2，用于致动透镜31的致动器，用于对测距激光的反射光L3增加散光的整形光学系统49， 用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42，以及用于调节致动器的控制器，并将测距激光L2的会聚点P2定位在透镜的焦点P0和 透镜31，从而能够在比正面3更深的位置形成改质区域，由此抑制由反射光L3引起的不利影响。 控制基于经过除以电压值之和的算术值，以防止算术值被反射光量改变。

    Laser beam machining method
    4.
    发明授权
    Laser beam machining method 有权
    激光束加工方法

    公开(公告)号：US08247734B2

    公开(公告)日：2012-08-21

    申请号：US10547976

    申请日：2003-03-12

    申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    IPC分类号： H01L21/301 ,  H01L21/322 ,  H01L21/78

    CPC分类号： B23K26/18 ,  A61M5/3272 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B28D1/221 ,  B28D5/0011

    摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

    摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着要切割物体的线5在待处理物体1内形成切割开始区域8。 此后，对象物1照射通过物体1的未修改区域可透射的激光L2，以便从作为起始点的切割起始区域8产生裂缝24，从而物体1能够沿着线 5，对象意图被切割。 扩大具有固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着目标1切割对象1的线5切割物体1的可靠性。