公开(公告)号：US08309433B2

公开(公告)日：2012-11-13

申请号：US13211161

申请日：2011-08-16

申请人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

发明人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC分类号： H01L21/30

CPC分类号： H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

摘要翻译： 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120044415A1

公开(公告)日：2012-02-23

申请号：US13212935

申请日：2011-08-18

申请人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

发明人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC分类号： H04N5/225 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

摘要翻译： 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US08823872B2

公开(公告)日：2014-09-02

申请号：US13212935

申请日：2011-08-18

申请人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

发明人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

摘要翻译： 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US08790950B2

公开(公告)日：2014-07-29

申请号：US13211102

申请日：2011-08-16

申请人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

发明人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC分类号： H01L21/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

摘要翻译： 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US20120052612A1

公开(公告)日：2012-03-01

申请号：US13211161

申请日：2011-08-16

申请人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

发明人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

摘要翻译： 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120050590A1

公开(公告)日：2012-03-01

申请号：US13211102

申请日：2011-08-16

申请人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

发明人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC分类号： H04N5/335 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

摘要翻译： 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US09246981B2

公开(公告)日：2016-01-26

申请号：US13315618

申请日：2011-12-09

申请人： Masatoshi Nishizaki ,  Masato Hattori ,  Shin Hasegawa ,  Kazuhide Adachi ,  Hirofumi Tamori ,  Shin Yanai

发明人： Masatoshi Nishizaki ,  Masato Hattori ,  Shin Hasegawa ,  Kazuhide Adachi ,  Hirofumi Tamori ,  Shin Yanai

IPC分类号： G06F15/16 ,  H04L29/08 ,  H04L29/06 ,  G06F17/30 ,  H04L29/14

CPC分类号： H04L67/06 ,  G06F17/30899 ,  H04L29/06 ,  H04L29/08072 ,  H04L67/28 ,  H04L67/42 ,  H04L69/40

摘要： A technology is disclosed by which, when plural content data are successively transmitted from a server apparatus to a reproduction apparatus through a client apparatus, if the transmission is interrupted, the transmission of the content data can be resumed from the point at which the transmission is interrupted. The transfer device includes a storage section for storing a transmission object list including content identification information corresponding to plural content data to be transmitted from a server apparatus to a reproduction apparatus connected to a client apparatus through the client apparatus. A reception section successively receives the content data from the server apparatus. A transmission section successively transfers the successively received content data to the reproduction apparatus. A control section deletes, every time content data is transferred, the corresponding content identification information from the transmission object list stored in the storage section.

摘要翻译： 公开了一种技术，当通过客户端装置将多个内容数据从服务器装置连续地发送到再现装置时，如果发送被中断，则可以从发送点恢复发送内容数据， 中断了 传送装置包括存储部分，用于存储包含与要从服务器装置发送到通过客户端装置连接到客户机装置的再现装置的多个内容数据相对应的内容识别信息的传输对象列表。 接收部分从服务器装置连续接收内容数据。 传输部分将连续接收的内容数据连续地传送到再现设备。 每当内容数据被传送时，控制部分从存储在存储部分中的传输对象列表中删除相应的内容标识信息。

公开(公告)号：US09111826B2

公开(公告)日：2015-08-18

申请号：US13817755

申请日：2011-08-05

申请人： Shin Hasegawa

发明人： Shin Hasegawa

IPC分类号： H01L27/146 ,  H04N5/335 ,  H01L23/31

CPC分类号： H01L27/14618 ,  H01L23/3128 ,  H01L2924/0002 ,  H04N5/335 ,  H01L2924/00

摘要： An image pickup device includes a transparent member, an image pickup element chip including a photodiode, and a fixing member arranged around the image pickup element chip, a space being surrounded by the transparent member, the image pickup element chip, and the fixing member. The image pickup element chip includes a semiconductor substrate including a penetrating electrode penetrating through a first main face of the semiconductor substrate on a side of the transparent member and a second main face of the semiconductor substrate opposite the first main face. In an orthogonal projection with respect to the transparent member, the penetrating electrode is arranged in a fixing area corresponding to the fixing member, and a boundary with an area where the thickness of the semiconductor substrate is smaller than that of the semiconductor substrate in a first area corresponding to the space is arranged within the fixing area.

摘要翻译： 图像拾取装置包括透明构件，包括光电二极管的图像拾取元件芯片和布置在图像拾取元件芯片周围的固定构件，被透明构件，图像拾取元件芯片和固定构件包围的空间。 图像拾取元件芯片包括半导体衬底，该半导体衬底包括贯穿透明构件侧的半导体衬底的第一主面的穿透电极和与第一主面相对的半导体衬底的第二主面。 在相对于透明构件的正交投影中，穿透电极被布置在与固定构件相对应的固定区域中，并且与半导体衬底的厚度小于半导体衬底的厚度的区域的边界 对应于空间的区域被布置在固定区域内。

公开(公告)号：US08765839B2

公开(公告)日：2014-07-01

申请号：US13760374

申请日：2013-02-06

申请人： Shin Hasegawa ,  Hiroyuki Fushimi

发明人： Shin Hasegawa ,  Hiroyuki Fushimi

IPC分类号： C09D11/30

CPC分类号： C09D11/30 ,  B32B3/10 ,  B41J2/145 ,  B41J2/17503 ,  C09D11/38 ,  C09D11/40

摘要： An inkjet ink set containing a first pigment ink and a second pigment ink. The first pigment ink includes an anionic self-emulsification ether polyurethane, and the second pigment ink includes a styrene acrylic resin emulsion.

摘要翻译： 一种含有第一颜料油墨和第二颜料油墨的喷墨油墨组。 第一颜料油墨包括阴离子自乳化醚聚氨酯，第二颜料油墨包括苯乙烯丙烯酸树脂乳液。

公开(公告)号：US08732924B2

公开(公告)日：2014-05-27

申请号：US13612270

申请日：2012-09-12

申请人： Tsuyoshi Ohshima ,  Shin Hasegawa ,  Noriyuki Watanabe

发明人： Tsuyoshi Ohshima ,  Shin Hasegawa ,  Noriyuki Watanabe

IPC分类号： H03H3/02 ,  H03H9/10

CPC分类号： H03H9/17 ,  H03H3/04 ,  H03H9/02149 ,  H03H9/0552 ,  H03H9/1021 ,  H03H2003/0478 ,  Y10T29/42 ,  Y10T29/49004 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T428/2809

摘要： A method of manufacturing a piezoelectric vibrator comprises supporting a piezoelectric vibration element in a case by a conductive bonding member, the piezoelectric vibration element having a metal layer formed on a piezoelectric substrate formed of a thickness shear based piezoelectric material, and adding or reducing a thickness of the metal layer to adjust a resonant frequency of the piezoelectric vibration element to a predetermined value. The method also comprises leaving the case into an atmosphere filled with vapor of a material having a nonbonding electron pair, making the metal layer resultantly exposed to the vapor subject to chemical absorption with the material having the nonbonding electron pair, and hermetically encapsulating the case in a state substituted by an inert gas atmosphere.

摘要翻译： 一种压电振动器的制造方法，其特征在于，在导电性接合部件的壳体内支撑压电振动元件，所述压电振动元件具有形成在由厚度剪切型压电材料构成的压电基板上的金属层， 以将压电振动元件的谐振频率调整到预定值。 该方法还包括将壳体留在填充有具有非结合电子对的材料的蒸汽的气氛中，使得金属层最终暴露于具有非键接电子对的材料进行化学吸收的气体，并将壳体气密地封装 被惰性气体气体置换的状态。