公开(公告)号：US4320574A

公开(公告)日：1982-03-23

申请号：US122864

申请日：1980-02-20

申请人： Kotaro Harigane ,  Tetsuro Ito

发明人： Kotaro Harigane ,  Tetsuro Ito

IPC分类号： B23P21/00 ,  H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0417 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/5142 ,  Y10T29/53183

摘要： Apparatus for automatically inserting parallel leads of electronic components into openings in a printed circuit board having an improved lead holding and guiding assembly. The improved lead holding and guiding assembly is associated with the frame of the apparatus and includes a guiding member mounted for rotation about an axis of rotation which extends in the x-direction, i.e., in the direction of a line which is orthogonal to both of the parallel leads, and for longitudinal movement in the z-direction, i.e., in the direction which is perpendicular to the orthogonal plane which contains the orthogonally extending line. The holding and guiding assembly further includes a pair of holding members disposed at respective sides of the guiding members such that the side surfaces of the end portion of the guiding member and the respective inner side surfaces of the holding members constitute lead holding and guiding portions. The holding members are mounted for rotation relative to the guiding member about respective axes of rotation so that the lead holding and guiding portions can be opened and closed as the holding members are rotated.

摘要翻译： 用于将电子部件的平行引线自动插入具有改进的引线保持和引导组件的印刷电路板中的开口中的装置。 改进的引线保持和引导组件与设备的框架相关联，并且包括引导构件，其安装成围绕围绕在x方向上延伸的旋转轴线旋转，即沿与X方向正交的线的方向 平行的引线，以及在z方向上的纵向运动，即垂直于包含正交延伸线的正交平面的方向。 保持引导组件还包括一对保持构件，其设置在引导构件的相应侧，使得引导构件的端部的侧表面和保持构件的相应内侧表面构成引线保持和引导部分。 保持构件相对于引导构件围绕各自的旋转轴线安装成旋转，使得当保持构件旋转时，引线保持和引导部分可以打开和关闭。

公开(公告)号：US4165557A

公开(公告)日：1979-08-28

申请号：US860415

申请日：1977-12-13

申请人： Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito

发明人： Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito

IPC分类号： H05K13/04 ,  B23P23/00 ,  B21F1/00 ,  B23Q41/00

CPC分类号： H05K13/0473 ,  Y10T29/515 ,  Y10T29/53065

摘要： An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.

摘要翻译： 提供了一种用于修整和固定插入印刷电路基板中的平行引线电子部件的装置。 该装置包括可选择地旋转的驱动组件，其可选择性地朝向插入印刷电路基板的电子部件移位，安装在驱动组件上用于弯曲引线的引线弯曲组件以及安装在弯曲组件上用于切割引线的切割组件， 弯曲和切割组件由驱动组件的位移致动。 该设备可以包括用于处理在切割期间从引线移除的芯片的子组件和用于检测插入的电子部件的存在的检测子组件。

公开(公告)号：US4294000A

公开(公告)日：1981-10-13

申请号：US34014

申请日：1979-04-27

申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

IPC分类号： H05K13/02 ,  B23P21/00 ,  B65G1/00 ,  H05K13/00 ,  H05K13/04 ,  H05K3/32

CPC分类号： B65G1/00 ,  H05K13/0417 ,  Y10T29/5142 ,  Y10T29/5149 ,  Y10T29/515 ,  Y10T29/53183

摘要： An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.

摘要翻译： 一种用于处理并将平行的铅电子部件从电子元件幅材载体插入到印刷电路板中的引线接收开口的机器的插入装置的插入子组件包括可滑动地安装在框架上的第一滑块装置。 安装在框架上的驱动器驱动第一滑块装置。 可滑动地安装在框架上的第二滑动装置与第一滑块装置的运动协调，并且包括用于保持和引导电子部件的引线保持和引导装置和用于将部件从预定位置移动到下面的插入位置的推杆 控制引线保持和引导装置。 安装在框架上的进给装置通过间歇驱动来驱动，以间歇地间歇地供给电子部件腹板载体。 切割器将一个电子元件与由馈送装置馈送的电子元件幅材载体分开。 传送装置包括：往复运动单元，用于在切割器和引线保持引导装置之间产生往复运动;以及电子部件保持装置，用于保持要由切割器分离的电子部件的引线并将部件传送到引线保持件， 在这种部件已经被切割器分离之后的引导装置。

公开(公告)号：US5029384A

公开(公告)日：1991-07-09

申请号：US402320

申请日：1989-09-01

申请人： Kotaro Harigane ,  Tetsuro Ito ,  Atsushi Shindo

发明人： Kotaro Harigane ,  Tetsuro Ito ,  Atsushi Shindo

IPC分类号： B23P21/00 ,  H05K3/30 ,  H05K13/04

CPC分类号： H05K13/0421 ,  H05K3/306 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10863 ,  H05K2203/0195 ,  Y10T29/53183 ,  Y10T29/53261 ,  Y10T29/53265

摘要： An apparatus for automatically mounting an electronic device having a plurality of leads on a printed circuit board, by inserting the leads into mount holes of the printed circuit board. A plurality of extension pins are connected straight to the leads to hold the leads of the electronic device. The extension pins are inserted into the mount holes, while the connection between the extension pins and the leads is maintained. The extension pins are then removed from an opposite side of the printed circuit board, thus guiding and inserting the tips of the leads into the mount holes.

公开(公告)号：US4578010A

公开(公告)日：1986-03-25

申请号：US437329

申请日：1982-10-28

申请人： Kotaro Harigane ,  Keiichi Ihara ,  Tetsuro Ito ,  Hirokazu Shudo

发明人： Kotaro Harigane ,  Keiichi Ihara ,  Tetsuro Ito ,  Hirokazu Shudo

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0452 ,  H05K13/0434 ,  Y10T29/53183

摘要： An electronic component selection and supply apparatus for use in an automatic electronic component inserting machine for automatically inserting electronic components of irregular shapes which are unsuitable for taping, such as electrolytic capacitors, power transistors and variable resistors, into a printed circuit board includes selection and supply apparatus for selecting an electronic component at a first position and supplying the selected component to a second position, the apparatus including electronic component sequence apparatus for selecting a predetermined electronic component which includes a device for vertically holding a plurality of electronic component magazines accommodating the electronic components at predetermined positions in a stacked state, and chuck apparatus for receiving the predetermined electronic component selected by the electronic component sequence apparatus and for supplying the electronic component to the second position.

摘要翻译： 一种用于自动电子部件插入机的电子部件选择和供给装置，用于将不适合于诸如电解电容器，功率晶体管和可变电阻器的胶带的不规则形状的电子部件自动插入到印刷电路板中，包括选择和供应 用于在第一位置选择电子部件并将所选择的部件供应到第二位置的装置，所述装置包括用于选择预定电子部件的电子部件顺序装置，所述电子部件顺序装置包括用于垂直保持容纳电子部件的多个电子部件箱的装置 在堆叠状态的预定位置处，以及用于接收由电子部件顺序设备选择的预定电子部件并用于将电子部件供应到第二位置的卡盘装置。

公开(公告)号：US4196513A

公开(公告)日：1980-04-08

申请号：US890151

申请日：1978-03-27

申请人： Kotaro Harigane ,  Hiroyuki Ohira

发明人： Kotaro Harigane ,  Hiroyuki Ohira

IPC分类号： H05K13/04 ,  H05K3/32 ,  H05K13/02

CPC分类号： H05K13/0452 ,  Y10T29/49139 ,  Y10T29/53183

摘要： A machine for processing and securing parallel lead electronic components into lead receiving openings formed in a printed circuit board having an improved insert assembly is provided. The machine includes a supply assembly for selectively supplying a parallel lead electronic component to be inserted. A transfer assembly including a plurality of chuck assemblies disposed around a rotary disc for supplying the selected electronic component and displacing the supplied electronic component to a release position. An insert assembly including a holding and guiding sub-assembly for receiving the selected electronic component from the chuck at the release position and a push bar sub-assembly adapted to engage the electronic component at the release position and displace the electronic component to an inserted position in the printed circuit board. A table assembly for positioning the receiving openings in the board into alignment with the parallel leads of the electronic component in the insert position such that each electronic component is received in the appropriate receiving openings.

摘要翻译： 提供了一种用于将平行的铅电子部件处理和固定到形成在具有改进的插入组件的印刷电路板中的引线接收开口中的机器。 该机器包括用于选择性地供应待插入的并联引线电子部件的供给组件。 一种传送组件，包括设置在旋转盘周围的多个卡盘组件，用于提供所选择的电子部件并将所提供的电子部件移动到释放位置。 一种插入组件，其包括用于在释放位置处从卡盘接收所选择的电子部件的保持和引导子组件，以及适于在释放位置处接合电子部件并将电子部件移位到插入位置的推杆子组件 在印刷电路板上。 一种桌子组件，用于将板中的接收开口定位成与插入位置中的电子部件的平行引线对准，使得每个电子部件被容纳在适当的接收开口中。

公开(公告)号：US4372802A

公开(公告)日：1983-02-08

申请号：US266109

申请日：1981-05-21

申请人： Kotaro Harigane ,  Kenichi Takahashi ,  Hirokazu Shudo ,  Shuichi Tando

发明人： Kotaro Harigane ,  Kenichi Takahashi ,  Hirokazu Shudo ,  Shuichi Tando

IPC分类号： H05K13/04 ,  B32B31/04

CPC分类号： H05K13/0413 ,  H05K13/0408 ,  Y10S156/942 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1744 ,  Y10T156/1768 ,  Y10T156/1771 ,  Y10T156/1978 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53435

摘要： Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

摘要翻译： 用于将芯片型电路元件安装在印刷电路板上的装置包括用于提供芯片型电路元件的供应单元，适于沿纵向间歇连接的多个托盘，适于将电路元件移动到托盘上的顺序头， 适于接收和支撑印刷电路板的XY台，具有适于将芯片型电路元件安装在由XY工作台承载的印刷电路板上的安装头的安装机构和用于将芯片型电路元件从 托盘到安装机构的安装头。 安装机构构成多个安装头位于其上的可旋转的分度盘，顺序头，变速头和安装头各自利用吸引销，芯片型电路元件在从供给单元移动到其中时固定到 印刷电路板。

公开(公告)号：US4461610A

公开(公告)日：1984-07-24

申请号：US396491

申请日：1982-07-08

申请人： Kotaro Harigane ,  Kenichi Takahashi ,  Hirokazu Shudo ,  Shuichi Tando

发明人： Kotaro Harigane ,  Kenichi Takahashi ,  Hirokazu Shudo ,  Shuichi Tando

IPC分类号： H05K13/04 ,  B65H3/08

CPC分类号： H05K13/0408 ,  H05K13/0413

摘要： Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be conveyed intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

摘要翻译： 用于将芯片型电路元件安装在印刷电路板上的装置包括用于供应芯片型电路元件的供应单元，适于沿纵向间歇地输送的多个托盘，适于将电路元件移动到托盘上的顺序头， 适于接收和支撑印刷电路板的XY台，具有适于将芯片型电路元件安装在由XY工作台承载的印刷电路板上的安装头的安装机构和用于将芯片型电路元件从 托盘到安装机构的安装头。 安装机构构成多个安装头位于其上的可旋转的分度盘，顺序头，变速头和安装头各自利用吸引销，芯片型电路元件在从供给单元移动到其中时固定到 印刷电路板。

公开(公告)号：US4263708A

公开(公告)日：1981-04-28

申请号：US43750

申请日：1979-05-30

申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0452 ,  Y10T29/5137 ,  Y10T29/5142 ,  Y10T29/53183

摘要： A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.

摘要翻译： 用于将平行的铅电子部件从电子元件幅材载体处理和插入印刷电路板中的引线接收开口的机器具有改进的供应装置，用于在第一位置选择性地接收电子部件并将电子部件供应到第二预定位置。 供给装置包括具有用于以预定间隔支撑多个电子元件幅材载体的电子元件幅材载体装置的供应子组件。 由电子元件腹板载体支撑装置支撑的每个电子元件幅材载体由间歇进给装置间歇地供给。 位于由间歇进给装置供给的电子部件腹板载体的前端的一个电子部件通过电子部件夹持装置在第一位置处被夹持并夹持。 由电子部件抓握装置接收和夹住的电子部件通过切割装置与电子部件幅材载体分离。 夹持由切割装置分离的电子部件的电子抓地装置通过传送装置移动到第二规定位置。

公开(公告)号：US5035047A

公开(公告)日：1991-07-30

申请号：US367254

申请日：1989-06-16

申请人： Kotaro Harigane ,  Kenichi Takahashi ,  Hiroaki Honda

发明人： Kotaro Harigane ,  Kenichi Takahashi ,  Hiroaki Honda

IPC分类号： H05K13/04

CPC分类号： H05K13/0413 ,  H05K13/021 ,  Y10T29/49137 ,  Y10T29/53178

摘要： An electronic component or chip mounting apparatus capable of carrying out a chip mounting operation at a high speed and with high accuracy. The apparatus includes two transition stations, a chip extracting head reciprocating between a chip feed section and the transition stations and two chip depositing heads arranged for reciprocating between the transition stations and a substrate on which a chip is to be mounted, so that a chip mounting operation may be carried out according to a reciprocating relay system and an operation of depositing the chip on the substrate may take place with high efficiency.

摘要翻译： 一种电子部件或芯片安装装置，其能够高速且高精度地进行芯片安装动作。 该装置包括两个过渡站，在芯片馈送部分和过渡站之间往复运动的芯片提取头和布置成用于在转换站之间往复运动的芯片沉积头和要安装芯片的衬底之间，以便安装芯片 可以根据往复式继电器系统进行操作，并且可以以高效率进行在基板上沉积芯片的操作。