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    Machine for inserting electronic components
    1.
    发明授权
    Machine for inserting electronic components 失效
    电子元器件插入机

    公开(公告)号：US4294000A

    公开(公告)日：1981-10-13

    申请号：US34014

    申请日：1979-04-27

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

    IPC分类号： H05K13/02 ,  B23P21/00 ,  B65G1/00 ,  H05K13/00 ,  H05K13/04 ,  H05K3/32

    CPC分类号： B65G1/00 ,  H05K13/0417 ,  Y10T29/5142 ,  Y10T29/5149 ,  Y10T29/515 ,  Y10T29/53183

    摘要： An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.

    摘要翻译： 一种用于处理并将平行的铅电子部件从电子元件幅材载体插入到印刷电路板中的引线接收开口的机器的插入装置的插入子组件包括可滑动地安装在框架上的第一滑块装置。 安装在框架上的驱动器驱动第一滑块装置。 可滑动地安装在框架上的第二滑动装置与第一滑块装置的运动协调，并且包括用于保持和引导电子部件的引线保持和引导装置和用于将部件从预定位置移动到下面的插入位置的推杆 控制引线保持和引导装置。 安装在框架上的进给装置通过间歇驱动来驱动，以间歇地间歇地供给电子部件腹板载体。 切割器将一个电子元件与由馈送装置馈送的电子元件幅材载体分开。 传送装置包括：往复运动单元，用于在切割器和引线保持引导装置之间产生往复运动;以及电子部件保持装置，用于保持要由切割器分离的电子部件的引线并将部件传送到引线保持件， 在这种部件已经被切割器分离之后的引导装置。

    Machine for automatically inserting parallel lead electronic components into a printed circuit board
    2.
    发明授权
    Machine for automatically inserting parallel lead electronic components into a printed circuit board 失效
    将铅笔电子元件自动插入印刷电路板的机器

    公开(公告)号：US4263708A

    公开(公告)日：1981-04-28

    申请号：US43750

    申请日：1979-05-30

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

    IPC分类号： H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0452 ,  Y10T29/5137 ,  Y10T29/5142 ,  Y10T29/53183

    摘要： A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.

    摘要翻译： 用于将平行的铅电子部件从电子元件幅材载体处理和插入印刷电路板中的引线接收开口的机器具有改进的供应装置，用于在第一位置选择性地接收电子部件并将电子部件供应到第二预定位置。 供给装置包括具有用于以预定间隔支撑多个电子元件幅材载体的电子元件幅材载体装置的供应子组件。 由电子元件腹板载体支撑装置支撑的每个电子元件幅材载体由间歇进给装置间歇地供给。 位于由间歇进给装置供给的电子部件腹板载体的前端的一个电子部件通过电子部件夹持装置在第一位置处被夹持并夹持。 由电子部件抓握装置接收和夹住的电子部件通过切割装置与电子部件幅材载体分离。 夹持由切割装置分离的电子部件的电子抓地装置通过传送装置移动到第二规定位置。

    Apparatus for automatically mounting chip type circuit elements on printed circuit boards
    3.
    发明授权
    Apparatus for automatically mounting chip type circuit elements on printed circuit boards 失效
    芯片型电路元件自动安装在印刷电路板上的装置

    公开(公告)号：US4606117A

    公开(公告)日：1986-08-19

    申请号：US585284

    申请日：1984-03-01

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Tatsuo Umeya

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Tatsuo Umeya

    IPC分类号： H05K13/04 ,  B23P19/00

    CPC分类号： H05K13/0417 ,  H05K13/0408 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53261

    摘要： Apparatus for automatically mounting chip type circuit elements on printed circuit boards is constructed in a manner to mount a feed wheel for carrying out the delivery of a chip tape on a lower frame. A lever is mounted with respect to the feed wheel through a one way clutch, so as to allow the lever to be pressed by a cam provided on a reciprocating upper frame which supports a mounting head. The feed wheel is thus rotated in the actuating direction of the one-way clutch to intermittently feed the chip tape and permit another chip type circuit element to be disposed at a chip type circuit element removing position, each time when the mounting head is returned to its original position.

    摘要翻译： 用于在印刷电路板上自动安装芯片型电路元件的装置以安装用于在下框架上执行芯片带的传送的馈送轮的方式构造。 杠杆通过单向离合器相对于进给轮安装，以便允许杠杆由设置在支撑安装头的往复运动的上框架上的凸轮按压。 因此，馈送轮在单向离合器的致动方向上旋转以间歇地馈送芯片带，并且允许另一芯片型电路元件设置在芯片型电路元件去除位置，每当安装头返回到 其原来的位置。

    Machine for processing and securing parallel lead electronic circuit elements to a printed circuit board
    5.
    发明授权
    Machine for processing and securing parallel lead electronic circuit elements to a printed circuit board 失效
    将平行的铅电子电路元件加工和固定到印刷电路板的机器

    公开(公告)号：US4054988A

    公开(公告)日：1977-10-25

    申请号：US672944

    申请日：1976-04-02

    申请人： Sho Masuzima ,  Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Hisashi Fujita

    发明人： Sho Masuzima ,  Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Hisashi Fujita

    IPC分类号： B23P21/00 ,  H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0452 ,  Y10T29/5142 ,  Y10T29/53183

    摘要： A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position. A board handling assembly disposes the receiving openings in the printed board in alignment with the circuit elements so that the parallel leads each circuit element are received in the appropriate receiving openings when same are displaced to the inserted position.

    摘要翻译： 提供了一种用于将平行的引线电子电路元件处理和固定到形成在印刷电路板中的引线接收开口中的机器。 所述机器包括用于选择性地供应一组平行的引线电子电路元件的多个不同组的供电组件，所述供电组件包括用于从要供应的所选组电路元件中选择一个电路元件的选择子组件。 传送组件包括用于接收所提供的电路元件并将其移位到释放位置的卡盘。 插入组件适于当卡盘移位到释放位置时实现电路元件的释放，并且包括用于接收由释放位置处的卡盘释放的每个电路元件的保持子组件和适于接合的柱塞子组件 电路元件处于释放位置，并将电路元件从释放位置移位到插入位置。 板处理组件将印刷板中的接收开口布置成与电路元件对齐，使得当相同的位移到插入位置时，每个电路元件的平行引线接收在适当的接收开口中。

    Apparatus and method for mounting chip type electronic parts
    6.
    发明授权
    Apparatus and method for mounting chip type electronic parts 失效
    安装芯片型电子零件的装置和方法

    公开(公告)号：US4619043A

    公开(公告)日：1986-10-28

    申请号：US591190

    申请日：1984-03-19

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kenichi Saito

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kenichi Saito

    IPC分类号： H05K13/04 ,  H05K3/34 ,  B23P19/00 ,  B65G29/00

    CPC分类号： H05K13/0408 ,  Y10S269/903 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： An apparatus and method for mounting chip type electronic parts, in which the parts can be smoothly, reliably and accurately mounted on, for example, a printed circuit board. The apparatus for mounting the chip type parts comprises means for conveying the part to be mounted, means for supplying the part onto the conveying means, means for receiving the part from the conveying means and for mounting the same onto a printed circuit board for example, and also means for positioning the part upon the conveying means before transfer of the part to the receiving and mounting means. The method for mounting a chip type part according to the present invention comprises the steps of supplying the part onto means for conveying the same to be mounted, positioning of the part on the conveying means, and then removing the part off the conveying means and mounting the same.

    摘要翻译： 一种用于安装芯片型电子部件的装置和方法，其中部件可以平滑，可靠和准确地安装在例如印刷电路板上。 用于安装芯片型部件的装置包括用于输送待安装部件的装置，用于将部件供应到传送装置上的装置，用于从传送装置接收部件并将其安装到例如印刷电路板上的装置， 以及用于在将部件转移到接收和安装装置之前将部件定位在输送装置上的装置。 根据本发明的用于安装芯片型部件的方法包括以下步骤：将部件供给到用于输送要安装的部件的装置，将部件定位在输送装置上，然后将部件从输送装置移除并安装 一样。

    Semiconductor device and method for fabricating the same
    8.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US08994141B2

    公开(公告)日：2015-03-31

    申请号：US12685180

    申请日：2010-01-11

    申请人： Tetsuo Takahashi ,  Takami Otsuki

    发明人： Tetsuo Takahashi ,  Takami Otsuki

    IPC分类号： H01L29/66 ,  H01L29/40 ,  H01L29/739 ,  H01L29/78 ,  H01L29/06

    CPC分类号： H01L29/063 ,  H01L29/0615 ,  H01L29/0638 ,  H01L29/404 ,  H01L29/407 ,  H01L29/66333 ,  H01L29/7395 ,  H01L29/7811

    摘要： A semiconductor includes an N-type impurity region provided in a substrate. A P-type RESURF layer is provided at a top face of the substrate in the N-type impurity region. A P-well has an impurity concentration higher than that of the P-type RESURF layer, and makes contact with the P-type RESURF layer at the top face of the substrate in the N-type impurity region. A first high-voltage-side plate is electrically connected to the N-type impurity region, and a low-voltage-side plate is electrically connected to a P-type impurity region. A lower field plate is capable of generating a lower capacitive coupling with the substrate. An upper field plate is located at a position farther from the substrate than the lower field plate, and is capable of generating an upper capacitive coupling with the lower field plate whose capacitance is greater than the capacitance of the lower capacitive coupling.

    摘要翻译： 半导体包括设置在基板中的N型杂质区。 P型RESURF层设置在N型杂质区的衬底顶面。 P阱的杂质浓度比P型RESURF层高，与N型杂质区的衬底顶面的P型RESURF层接触。 第一高电压侧板与N型杂质区电连接，低压侧板与P型杂质区电连接。 下场板能够产生与衬底的较低的电容耦合。 上场板位于比下场板更远离衬底的位置处，并且能够产生与电容大于低容性耦合的电容的下场板的上电容耦合。

    6,12-dinaphthylchrysene derivative and organic light-emitting device using the derivative
    9.
    发明授权
    6,12-dinaphthylchrysene derivative and organic light-emitting device using the derivative 有权
    6,12-二萘基衍生物和使用该衍生物的有机发光装置

    公开(公告)号：US08790795B2

    公开(公告)日：2014-07-29

    申请号：US13480608

    申请日：2012-05-25

    申请人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    发明人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    IPC分类号： H01L51/54 ,  C07D235/18 ,  C07D498/04

    CPC分类号： H01L51/0054 ,  H01L51/0058 ,  H01L51/0072 ,  H01L51/5072 ,  H01L51/5096

    摘要： Provided are an organic compound having high heat stability suitable for use in an organic light-emitting device, and an organic light-emitting device using the organic compound. The organic light-emitting device is an organic light-emitting device, including: an anode; a cathode; and an organic compound layer disposed between the anode and the cathode, in which at least one layer of the organic compound layer has a 6,12-dinaphthylchrysene derivative represented by one of the following general formulae (1) and (2): in the formulae (1) and (2), Z represents a naphthyl group, and Q represents an electron-withdrawing substituent selected from the group consisting of the following general formulae (3) to (5): in the formula (5), R1 represents a hydrogen atom or a methyl group.

    摘要翻译： 提供了适用于有机发光装置的具有高热稳定性的有机化合物和使用该有机化合物的有机发光装置。 有机发光器件是有机发光器件，包括：阳极; 阴极 和设置在阳极和阴极之间的有机化合物层，其中至少一层有机化合物层具有由以下通式（1）和（2）之一表示的6,12-二萘基衍生物：在 式（1）和（2）中，Z表示萘基，Q表示选自下述通式（3）〜（5）的吸电子取代基：式（5）中，R 1表示 氢原子或甲基。