公开(公告)号：US08944888B2

公开(公告)日：2015-02-03

申请号：US13809694

申请日：2011-06-13

申请人： Kotaro Kubo ,  Yukio Hosaka ,  Takahiro Okamoto

发明人： Kotaro Kubo ,  Yukio Hosaka ,  Takahiro Okamoto

IPC分类号： B24B1/00 ,  B24B37/26 ,  B24B37/24 ,  H01L21/3105 ,  H01L21/321

CPC分类号： B24B37/26 ,  B24B37/24 ,  H01L21/31053 ,  H01L21/3212

摘要： A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.

摘要翻译： 化学机械抛光垫包括抛光层，在抛光层的抛光表面上形成的凹槽，所述抛光层包括至少形成凹部内侧的表面层，以及所述抛光层的比例（D1 / D2） 平均开口率D1（％）相对于平均开口率D2（％）为0.01〜0.5，平均开口率D1是当抛光层浸入水中时凹部的内侧的平均开口率为23 ℃，1小时，平均开口率D2是当横截面已经在23℃的水中浸渍1小时时，与表面层不相交的抛光层的横截面的平均开口率 。

公开(公告)号：US20130189907A1

公开(公告)日：2013-07-25

申请号：US13809694

申请日：2011-06-13

申请人： Kotaro Kubo ,  Yukio Hosaka ,  Takahiro Okamoto

发明人： Kotaro Kubo ,  Yukio Hosaka ,  Takahiro Okamoto

IPC分类号： B24B37/26 ,  B24B37/24

CPC分类号： B24B37/26 ,  B24B37/24 ,  H01L21/31053 ,  H01L21/3212

摘要： A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.

摘要翻译： 化学机械抛光垫包括抛光层，在抛光层的抛光表面上形成的凹槽，所述抛光层包括至少形成凹部内侧的表面层，以及所述抛光层的比例（D1 / D2） 平均开口率D1（％）相对于平均开口率D2（％）为0.01〜0.5，平均开口率D1是当抛光层浸入水中时凹部的内侧的平均开口率为23 ℃，1小时，平均开口率D2是当横截面已经在23℃的水中浸渍1小时时，与表面层不相交的抛光层的横截面的平均开口率 。

公开(公告)号：US20050245171A1

公开(公告)日：2005-11-03

申请号：US11115122

申请日：2005-04-27

申请人： Yukio Hosaka ,  Hiroshi Shiho ,  Hiroyuki Miyauchi ,  Takahiro Okamoto ,  Kou Hasefawa ,  Nobuo Kawahashi

发明人： Yukio Hosaka ,  Hiroshi Shiho ,  Hiroyuki Miyauchi ,  Takahiro Okamoto ,  Kou Hasefawa ,  Nobuo Kawahashi

IPC分类号： B24B37/04 ,  B24D18/00 ,  B24B49/00

CPC分类号： B24B37/04 ,  B24D18/0009

摘要： There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1. The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.

摘要翻译： 提供了一种化学机械抛光垫，其包含具有抛光表面的抛光基板和与抛光基板融合的透光部件。 当透光部件被切割成与抛光表面平行的平面时的截面形状是椭圆形的，其值通过将其长度除以其大于1的短直径而获得的值。该焊盘能够传输端点 检测光，而不降低其抛光半导体晶片的抛光效率。

公开(公告)号：US20090191795A1

公开(公告)日：2009-07-30

申请号：US12357706

申请日：2009-01-22

申请人： Rikimaru KUWABARA ,  Takahiro Okamoto ,  Yukio Hosaka ,  Takafumi Shimizu ,  Tsuyoshi Watanabe

发明人： Rikimaru KUWABARA ,  Takahiro Okamoto ,  Yukio Hosaka ,  Takafumi Shimizu ,  Tsuyoshi Watanabe

IPC分类号： B24B1/00 ,  B24D3/00 ,  C08G18/04 ,  C08G18/32 ,  B44C1/22

CPC分类号： C08G18/3206 ,  B24B37/042 ,  B24B37/24 ,  C08G18/44 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/675 ,  C08G18/69 ,  C08K5/14 ,  C08L75/16 ,  C08L75/14 ,  C08L2666/26

摘要： Provided is a composition for forming a polishing layer of a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object and less scratches of the polished object.The above composition for forming a polishing layer of a chemical mechanical polishing pad comprises (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least the following components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them: (a11) an oligomer which has one or more hydroxyl groups and one or more carbon-carbon double bonds and which has a number average molecular weight of 500 to 2500, (a12) an oligomer which has two or more hydroxyl groups and either one or both of an ether bond and an ester bond and which has a number average molecular weight of 500 to 2500 and is different from the component (a11), (a13) a monomer having two hydroxyl groups and (a2) a monomer having two isocyanate groups; and (1) a value of M-1/M-OH is 0.85 to 1.10, and (2) a value of M-2/M-OH is 0.45 to 0.80, wherein M-1 is the number of isocyanate groups contained in the component (a2), M-2 is the number of hydroxyl groups contained in the component (a13) and M-OH is the total number of hydroxyl groups contained in the components (a11), (a12) and (a13).

摘要翻译： 提供一种用于形成化学机械抛光垫的抛光层的组合物，其具有抛光特性如抛光速度高，抛光对象的优良平面度和抛光对象的划痕少。 用于形成化学机械抛光垫的抛光层的上述组合物包括（A）侧链上具有碳 - 碳双键的聚氨酯和（B）交联剂。 聚氨酯（A）优选为通过以满足以下条件（1）和（2）的比例混合至少以下成分（a11）〜（a13）和成分（a2）而得到的热塑性聚氨酯（A'）， 它们：（a11）具有一个或多个羟基和一个或多个碳 - 碳双键且数均分子量为500至2500的低聚物，（a12）具有两个或更多个羟基的低聚物和 醚键和酯键中的一种或两种，并且其数均分子量为500至2500，并且不同于组分（a11），（a13）具有两个羟基的单体和（a2）具有两个羟基的单体 异氰酸酯基; 和（1）M-1 / M-OH的值为0.85〜1.10，（2）M-2 / M-OH的值为0.45〜0.80，M-1为 组分（a2），M-2是组分（a13）中包含的羟基数，M-OH是组分（a11），（a12）和（a13）中所含羟基的总数。

公开(公告)号：US08388799B2

公开(公告)日：2013-03-05

申请号：US12357706

申请日：2009-01-22

申请人： Rikimaru Kuwabara ,  Takahiro Okamoto ,  Yukio Hosaka ,  Takafumi Shimizu ,  Tsuyoshi Watanabe

发明人： Rikimaru Kuwabara ,  Takahiro Okamoto ,  Yukio Hosaka ,  Takafumi Shimizu ,  Tsuyoshi Watanabe

IPC分类号： H01L21/304 ,  C08G18/42 ,  C08G18/48 ,  C08G18/62

CPC分类号： C08G18/3206 ,  B24B37/042 ,  B24B37/24 ,  C08G18/44 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/675 ,  C08G18/69 ,  C08K5/14 ,  C08L75/16 ,  C08L75/14 ,  C08L2666/26

摘要： A composition for forming a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object, and less scratches of the polished object. The composition includes (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them.

摘要翻译： 一种用于形成化学机械抛光垫的组合物，其具有抛光特性如抛光速度高，抛光物体的平坦度优异，并且抛光对象的划痕较少。 该组合物包括（A）侧链上具有碳 - 碳双键的聚氨酯和（B）交联剂。 聚氨酯（A）优选为通过以满足以下条件（1）和（2）的比例混合至少组分（a11）至（a13）和组分（a2）而得到的热塑性聚氨酯（A'）并使其反应。

公开(公告)号：US20060075686A1

公开(公告)日：2006-04-13

申请号：US11288094

申请日：2005-11-29

申请人： Kou Hasegawa ,  Hozumi Satou ,  Osamu Ishikawa ,  Yukio Hosaka

发明人： Kou Hasegawa ,  Hozumi Satou ,  Osamu Ishikawa ,  Yukio Hosaka

IPC分类号： B24B7/30 ,  B24D18/00

CPC分类号： B24B37/245 ,  B24B37/24 ,  B24D3/28 ,  B24D11/001 ,  B24D18/0009 ,  C09K3/1454

摘要： An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH 8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.

摘要翻译： 本发明的目的是提供一种抛光体，其中抛光体中的磨料非常分散，在抛光过程中提供稳定的抛光性能，并且即使在大的情况下也能有效地减少划痕的发生 含有磨料的数量。 通过在高压釜中加载预定量的丁二烯，苯乙烯，甲基丙烯酸甲酯，衣康酸，丙烯酸，α-甲基苯乙炔二酮和叔十二烷基硫醇，制得本发明中构成抛光体的抛光部分，使混合物反应16小时 在75℃下得到其中分散共聚物的乳液，将该乳液调节至pH8.5，并加入平均一次粒径为0.3μm的二氧化铈粉末并搅拌，得到水分散液，通过涂布干燥该水性分散体 薄膜穿过薄膜，并模压所获得的干燥产品。 上述抛光部分可以具有交联结构。 本发明的研磨体可以在抛光垫等中有利地使用，用于研磨半导体晶片等的表面。

公开(公告)号：US20050239380A1

公开(公告)日：2005-10-27

申请号：US11110728

申请日：2005-04-21

申请人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

发明人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

IPC分类号： B24B37/04 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B37/042

摘要： A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.

摘要翻译： 一种化学机械抛光垫，其抛光表面的算术平均粗糙度（Ra）为0.1〜15μm，10点高（Rz）为40〜150μm，芯粗糙度深度（Rk）为12〜50μm， 降低的峰值高度（Rpk）为7至40μm，其制造方法和化学机械抛光方法。 即使通过该垫进行作为被研磨物的大直径晶片的化学机械研磨，也可以形成具有优异的面内均匀性，平坦性的研磨面。

公开(公告)号：US06442486B1

公开(公告)日：2002-08-27

申请号：US09385094

申请日：1999-08-30

申请人： Satoru Satake ,  Yukio Hosaka ,  Hideharu Maruyama ,  Nobuhiko Nakamura

发明人： Satoru Satake ,  Yukio Hosaka ,  Hideharu Maruyama ,  Nobuhiko Nakamura

IPC分类号： G06F1760

CPC分类号： G06Q10/04 ,  A01C21/007

摘要： A method and an apparatus for determining an amount of fertilizer to be applied to grain crops are disclosed. A fertilizer application related formula for obtaining the necessary amount of fertilizer to be applied is established by analyzing growth information including leaf blade information, fertilizer application information and quality information, all the above information being obtained in advance from a number of grains or grain crops. The formula thus established is stored in the memory. The necessary amount of fertilizer to be applied for each specific period for grain crops which are presently under growth is calculated by applying to the above formula, growth information of the grain crops presently under growth and target quality information. The growth information includes leaf blade information in relation to a specific period. The results of the calculation are displayed or printed out. A method and an apparatus for estimating a quality or yield of grains prior to the harvesting is also disclosed. In this case, a quality or yield related formula is established in advance and stored in the memory.

摘要翻译： 公开了一种用于确定施用于粮食作物的肥料的量的方法和装置。 通过分析包括叶片信息，肥料施用信息和质量信息在内的增长信息，建立了获得所需施肥量的肥料施用相关配方，所有这些信息预先从许多谷物或谷类作物获得。 这样建立的公式存储在内存中。 根据目前正在成长的粮食作物的增长信息和目标质量信息，计算了目前正在生长的粮食作物每个特定时期适用的肥料所需量。 生长信息包括与特定时段有关的叶片信息。 计算结果显示或打印出来。 还公开了一种用于在收获之前估计谷物质量或产量的方法和装置。 在这种情况下，预先建立质量或产量相关公式并存储在存储器中。

公开(公告)号：US6089172A

公开(公告)日：2000-07-18

申请号：US374672

申请日：1999-08-16

申请人： Hideaki Takenoya ,  Yoshikazu Ebata ,  Akira Orii ,  Yoshitaka Takahashi ,  Eiji Murakami ,  Eiichi Shomura ,  Tsutomu Takagi ,  Yukio Hosaka

发明人： Hideaki Takenoya ,  Yoshikazu Ebata ,  Akira Orii ,  Yoshitaka Takahashi ,  Eiji Murakami ,  Eiichi Shomura ,  Tsutomu Takagi ,  Yukio Hosaka

IPC分类号： D05B19/12 ,  D05B47/04 ,  D05B47/06

CPC分类号： D05B19/12 ,  D05B47/04

摘要： A lock stitch sewing machine with an automatic thread tension adjusting device is disclosed, wherein the sewing machine has a plurality of thread tension adjusting mechanisms 7, each of which including a pair of thread tension disks 12, 13, one of which is normally pressed by a spring toward the other. A sensor 4 is responsive to the operation of a thread tension releasing lever 20 made by a user with a slight touch applied thereto to give a signal. A CPU1 is responsive to the signal to compare the value of the existing thread tension of the thread tension adjusting mechanisms 7 with a predetermined one. If the value of the existing thread tension is higher than the predetermined one, the CPU1 is operated reduce the value of the existing thread tension to a predetermined one. Thus the tension releasing operation ability is increased.

摘要翻译： 公开了一种具有自动线张力调节装置的缝纫缝纫机，其中缝纫机具有多个线张力调节机构7，每个线张力调节机构7包括一对线张力盘12,13，其中一个线张力盘12通常被 朝向另一个的春天。 传感器4响应于由使用者施加的轻微触摸而产生的线张力释放杆20的操作以产生信号。 CPU1响应该信号以将线张力调节机构7的现有线张力的值与预定线张力调节机构7的值进行比较。 如果现有线张力的值高于预定线张力，则CPU1被操作将现有线张力的值减小到预定线张力。 因此，张力释放操作能力增加。

公开(公告)号：US5976882A

公开(公告)日：1999-11-02

申请号：US249167

申请日：1999-02-12

申请人： Satoru Satake ,  Takaharu Kameoka ,  Yukio Hosaka ,  Takeshi Imai ,  Shinji Saito

发明人： Satoru Satake ,  Takaharu Kameoka ,  Yukio Hosaka ,  Takeshi Imai ,  Shinji Saito

IPC分类号： G01N21/27 ,  G01N21/33 ,  G01N21/35 ,  G01N21/3563 ,  G01N21/359 ,  G01N33/02

CPC分类号： G01N21/33 ,  G01N21/274 ,  G01N21/3563 ,  G01N21/359 ,  G01N33/02 ,  Y10T436/10

摘要： A method for measuring ash content of food stuff is carried out by 1) preparing, with respect to food stuff samples whose ash content values are known, a calibration curve by a non-linear analysis of absorbance values and the known ash content of each sample, the absorbance values being obtained by irradiating light having particular wavelengths containing at least an ultraviolet ray band wavelength, the particular wavelength being specific to organic ingredients well coupled to inorganic ingredients which result in the ash content, and 2) deriving, with respect to a sample whose ash content value is unknown, an ash content value of the sample from absorbance values obtained by irradiating, on the sample, light having the particular wavelengths containing at least the ultraviolet ray band wavelength and from the calibration curve prepared in advance by the non-linear analysis. An apparatus for carrying out the method includes a light source section, a photo detecting section, a storing section for storing the calibration curve, and a calculation section for calculating, with respect to a sample whose ash content value is unknown, the ash content value based on the absorbance values and the calibration curve stored in the storing section. It is possible to speed up the measuring operation and to improve the measuring precision.

摘要翻译： 通过以下方式进行食品灰分含量测定的方法：1）对于灰分含量已知的食品样品，通过吸光度值的非线性分析和每个样品的已知灰分含量制备校准曲线 通过照射具有至少具有紫外线波长的特定波长的光获得的吸光度值，该特定波长特异于有机成分，其与无机成分良好耦合，导致灰分含量，以及2）相对于 灰分含量未知的样品，样品的灰分含量值，其通过在样品上照射具有至少包含紫外线波段波长的特定波长的光和由非预定制备的校准曲线获得的吸光度值， 线性分析。 用于执行该方法的装置包括光源部分，光检测部分，用于存储校准曲线的存储部分，以及计算部分，用于相对于灰分含量值未知的样本计算灰分含量值 基于存储部分中存储的吸光度值和校准曲线。 可以加快测量操作，提高测量精度。