Sampler module, sampling waveform measurement device using the sample
module, and sampling waveform measurement method
    1.
    发明授权
    Sampler module, sampling waveform measurement device using the sample module, and sampling waveform measurement method 失效
    采样模块,采样模块采样波形测量装置,采样波形测量方法

    公开(公告)号:US5801375A

    公开(公告)日:1998-09-01

    申请号:US651054

    申请日:1996-05-21

    IPC分类号: G01R13/34 H01J3/14

    CPC分类号: G01R13/347

    摘要: A sampler module is disclosed for use in a sampling waveform measurement device that samples subject signals and measures the waveform of the signals. The module is constructed by accommodating within a metal container: a laser diode driver circuit that receives laser drive sampling pulse signals from the outside and supplies pulse drive signals by a gain switching method, a laser diode that receives the drive signals from the LD driver circuit and generates optical probe pulse light, a sampling photoconductor that performs switching in accordance with irradiated light pulses and samples the subject signals, a condenser that focuses optical probe pulse light from the laser diode upon the photoconductor, and cooling temperature control means that maintains the temperature of the laser diode at a fixed temperature.

    摘要翻译: 采样器模块被公开用于采样波形测量装置中,用于采样主体信号并测量信号的波形。 该模块通过容纳在金属容器内构成:激光二极管驱动电路,其从外部接收激光驱动采样脉冲信号,并通过增益切换方法提供脉冲驱动信号;激光二极管,其从LD驱动电路接收驱动信号 并产生光探针脉冲光,采样光电导体,其根据照射的光脉冲进行切换并对目标信号进行采样,将来自激光二极管的光学探针脉冲光聚焦到感光体上的冷凝器,以及保持温度的冷却温度控制装置 的激光二极管。

    Probe card, production method thereof and repairing method of probe card
    3.
    发明申请
    Probe card, production method thereof and repairing method of probe card 审中-公开
    探针卡,探针卡的制作方法和检测方法

    公开(公告)号:US20090039904A1

    公开(公告)日:2009-02-12

    申请号:US11660525

    申请日:2006-01-30

    IPC分类号: G01R3/00 G01R1/073

    摘要: A probe card 6 is produced by forming probe pins 2, each having a thin film portion 21, three-dimensionally on a substrate 1 having a concave portion 11 formed thereon, forming bumps 3 at base end portions of the probe pins 2, moving the substrate 1 to the probe card substrate 4 side while supporting the same by a flip-chip bonder, bonding the probe pins 2 to pads 42 on said probe card substrate 4 via the bumps 3, then, moving the substrate 1 to the side separating from the probe card substrate 4 by the flip-chip bonder and rupturing the probe pins 2 at adjacent portions of the thin film portions 21 to mechanically remove the substrate 1 from the probe pins 2.

    摘要翻译: 通过在形成有凹部11的基板1上形成具有薄膜部21的探针2来形成探针卡6,在探针2的基端部形成凸起3,使探针2移动 基板1到探针卡基板4侧,同时通过倒装键合器支撑它们,通过凸块3将探针2接合到所述探针卡基板4上的焊盘42,然后将基板1移动到与 探针卡基板4通过倒装芯片连接器,并且在薄膜部分21的相邻部分处使探针2破裂,以从探针2上机械地移除基板1。