公开(公告)号：US20120305963A1

公开(公告)日：2012-12-06

申请号：US13414458

申请日：2012-03-07

申请人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

发明人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC分类号： H01L33/60

CPC分类号： H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

摘要翻译： 根据一个实施例，发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：US20120075836A1

公开(公告)日：2012-03-29

申请号：US13236672

申请日：2011-09-20

申请人： Kozo UEMURA ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

发明人： Kozo UEMURA ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

IPC分类号： F21V9/16 ,  F21V21/00

CPC分类号： H01L25/0753 ,  F21K9/27 ,  F21S8/031 ,  F21V23/023 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.

摘要翻译： 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。