摘要:
Some embodiments include apparatuses having a first path in a phase locked loop, the first path including a phase frequency detector to receive a first signal having a first frequency and a first node to provide a voltage; an oscillator coupled to a second node and the first node to provide a second signal having a second frequency at the second node; a second path including a frequency divider coupled to the second node and the phase frequency detector; and a circuit to generate digital information having a value based on a value of the voltage at the second node.
摘要:
Described is an apparatus to lower power of a charge pump. The apparatus comprises: a first delay unit to receive a reference clock, the first delay unit to provide a delayed reference clock to a first sequential unit; a second delay unit to receive a feedback clock, the second delay unit to provide a delayed feedback clock to a second sequential unit; a first logic unit to receive the reference and feedback clocks, the logic unit to perform a logical OR operation on the received reference and feedback clocks, and to generate a trigger signal for a third sequential unit; and a second logic unit to receive outputs of first and second sequential units, and to generate an output coupled to the third sequential unit.
摘要:
A channel strained multi-gate transistor with low parasitic resistance and method of manufacturing the same. A gate stack may be formed over a semiconductor fin having a gate-coupled sidewall height (Hsi), an etch rate controlling dopant may be implanted into a source/drain region of the semiconductor fin adjacent to the gate stack and into a source/drain extension region of the semiconductor fin. The doped fin region may be etched to remove a thickness of the semiconductor fin equal to at least Hsi proximate a channel region and form a source/drain extension undercut. A material may be grown on the exposed semiconductor substrate to form a regrown source/drain fin region filling the source/drain extension undercut region.
摘要:
A channel strained multi-gate transistor with low parasitic resistance and method of manufacturing the same. A gate stack may be formed over a semiconductor fin having a gate-coupled sidewall height (Hsi), an etch rate controlling dopant may be implanted into a source/drain region of the semiconductor fin adjacent to the gate stack and into a source/drain extension region of the semiconductor fin. The doped fin region may be etched to remove a thickness of the semiconductor fin equal to at least Hsi proximate a channel region and form a source/drain extension undercut. A material may be grown on the exposed semiconductor substrate to form a regrown source/drain fin region filling the source/drain extension undercut region.