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1.发明申请SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING TRAJECTORIES IN THE FORMATION OF WIRE LOOPS 审中-公开用于优化循环参数和循环轨道在形成线路中的系统和方法公开(公告)号：US20170033077A1
公开(公告)日：2017-02-02
申请号：US15290413
申请日：2016-10-11
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/40 , B23K2101/42 , H01L22/12 , H01L24/05 , H01L24/43 , H01L24/48 , H01L2224/45015 , H01L2224/45139 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/484 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01082 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2924/00011 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
摘要翻译： 提供了形成与半导体封装有关的导线回路的方法。 该方法包括以下步骤：（1）将与半导体封装相关的封装数据提供给引线接合机; （2）向所述引线接合机提供与期望的线圈相关的至少一个循环控制值，所述至少一个循环控制值至少包括与期望的线圈相关的回路高度值; （3）使用算法导出循环参数，用于形成所需的线环; （4）使用在步骤（3）中导出的循环参数在引线接合机上形成第一线环; （5）测量与所述至少一个循环控制值对应的在步骤（4）中形成的第一线圈的实际循环控制值; 和（6）将步骤（5）中测量的实际循环控制值与步骤（2）中提供的至少一个循环控制值进行比较。
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公开(公告)号：US10361168B2
公开(公告)日：2019-07-23
申请号：US15290413
申请日：2016-10-11
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
IPC分类号： H01L23/00 , B23K20/00 , H01L21/66 , B23K101/40 , B23K101/42
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
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公开(公告)号：US11495570B2
公开(公告)日：2022-11-08
申请号：US17591702
申请日：2022-02-03
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
IPC分类号： H01L23/00 , B23K20/00 , H01L21/66 , B23K101/40 , B23K101/42
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
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公开(公告)号：US10352877B2
公开(公告)日：2019-07-16
申请号：US15786669
申请日：2017-10-18
摘要： A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
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公开(公告)号：US20220157771A1
公开(公告)日：2022-05-19
申请号：US17591702
申请日：2022-02-03
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
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公开(公告)号：US11276666B2
公开(公告)日：2022-03-15
申请号：US16439923
申请日：2019-06-13
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
IPC分类号： H01L23/00 , B23K20/00 , H01L21/66 , B23K101/40 , B23K101/42
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
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7.发明申请公开(公告)号：US20190295983A1
公开(公告)日：2019-09-26
申请号：US16439923
申请日：2019-06-13
发明人： Ivy Wei Qin , Ray L. Cathcart , Cuong Huynh , Deepak Sood , Paul W. Sucro , Joseph O. DeAngelo
摘要： A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
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8.发明申请公开(公告)号：US20180038806A1
公开(公告)日：2018-02-08
申请号：US15786669
申请日：2017-10-18
CPC分类号： G01N21/9501 , G01N21/8422 , G01N21/8806 , G01N2021/8812 , G01N2021/8829 , G06T7/0006 , G06T2207/10152 , G06T2207/30148 , H01L22/12 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/16145 , H01L2224/16225 , H01L2224/2731 , H01L2224/29012 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/75901 , H01L2224/81203 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83908 , H01L2224/92125 , H01L2924/3511 , H01L2924/3512 , H01L2924/00
摘要： A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
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