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    Sensor module
    1.
    发明授权
    Sensor module 有权
    传感器模块

    公开(公告)号：US07323766B2

    公开(公告)日：2008-01-29

    申请号：US10982982

    申请日：2004-11-04

    申请人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    发明人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    IPC分类号： H01L23/495

    CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P1/023 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/3025 ,  H01R13/6594 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

    摘要翻译： 传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器 系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。 由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。 当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。 传感器模块可以被模制或者可以具有预成型的壳体。 盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

    Acceleration sensor system
    3.
    发明申请
    Acceleration sensor system 审中-公开
    加速度传感器系统

    公开(公告)号：US20050103105A1

    公开(公告)日：2005-05-19

    申请号：US10964291

    申请日：2004-10-13

    申请人： Harald Emmerich ,  Hansjoerg Beutel

    发明人： Harald Emmerich ,  Hansjoerg Beutel

    IPC分类号： B81B7/00 ,  G01P1/02 ,  G01P15/125

    CPC分类号： B81B7/0048 ,  B81B2201/0264 ,  G01P1/023 ,  G01P15/125 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195

    摘要： An acceleration sensor system is especially suitable for measuring low accelerations. The acceleration sensor system has at least: one premold housing made of a plastic material having a housing inner chamber, one lead frame which extends through the premold housing in the housing inner chamber, and one acceleration sensor chip, which is fastened in the housing inner chamber with the aid of an adhesive layer, and is connected to the lead frame with the aid of line bond connections. Advantageous stress decouplings are achieved in this connection by using an adhesive layer having a uniform thickness greater than 50 μm, preferably greater than 100 μm, in particular, the adhesive material of the adhesive layer being softer than the chip material of the acceleration sensor chip.

    摘要翻译： 加速度传感器系统特别适用于测量低加速度。 加速度传感器系统至少具有：一个由塑料材料制成的预制外壳，其具有壳体内腔，一个引线框架，其延伸穿过壳体内腔中的预制外壳，以及一个加速度传感器芯片，其紧固在壳体内部 借助于粘合剂层连接到引线框架上。 通过使用具有大于50μm，优选大于100μm的均匀厚度的粘合剂层，特别地，粘合剂层的粘合剂材料比加速度传感器芯片的芯片材料柔软，从而实现了有益的应力解耦。