摘要:
A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
摘要:
A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
摘要:
An acceleration sensor system is especially suitable for measuring low accelerations. The acceleration sensor system has at least: one premold housing made of a plastic material having a housing inner chamber, one lead frame which extends through the premold housing in the housing inner chamber, and one acceleration sensor chip, which is fastened in the housing inner chamber with the aid of an adhesive layer, and is connected to the lead frame with the aid of line bond connections. Advantageous stress decouplings are achieved in this connection by using an adhesive layer having a uniform thickness greater than 50 μm, preferably greater than 100 μm, in particular, the adhesive material of the adhesive layer being softer than the chip material of the acceleration sensor chip.
摘要:
A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
摘要:
A sensor, a sensor component and a method for manufacturing a sensor are provided, in which sensors for measuring absolute values are inserted into cost-effective and technically simple plastic housings of the usual construction type, without having negative effects on the long-term stability of the absolute measuring values supplied by such sensors. In particular, parameter drifts and offsets in the parameters are induced by arranging a sensor element above an application-specific semiconductor element which evaluates the sensor's signals, and is connected to it via a flip-chip connection. Mechanical, thermal and moisture stresses are prevented and compensated for by introducing a suitable quantity of gel into the plastic housing.
摘要:
A micromechanical cap structure and a corresponding manufacturing method are described, the cap structure having a substrate, in particular in the form of a wafer, having a cavity made therein. The cavity includes a bottom surface and two pairs of opposite parallel side wall sections. The cavity has at least one stabilizing wall section, which connects two side wall sections. This considerably increases the stability of the cap structure.
摘要:
An acceleration sensor includes a housing, a first seismic mass which is formed as a first asymmetrical rocker and is disposed in the housing via at least one first spring, a second seismic mass which is formed as a second asymmetrical rocker and is disposed in the housing via at least one second spring, and a sensor and evaluation unit which is designed to ascertain information regarding corresponding rotational movements of the first seismic mass and the second seismic mass in relation to the housing and to determine acceleration information with respect to an acceleration of the acceleration sensor, taking the ascertained information into account. In addition, a method for operating an acceleration sensor is disclosed. The rockers execute opposite rotational movements in response to the presence of an acceleration. A differential evaluation of the signals makes it possible to free the measuring signal of any existing interference signals.
摘要:
An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.
摘要:
A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
摘要:
A method for the electrical zero balancing of a micro mechanical component including a first capacitor electrode rigidly suspended over a substrate, a second capacitor electrode rigidly suspended over the substrate, and a third capacitor electrode disposed there between, resiliently and deflectably suspended over the substrate, as well as a differential-capacitance detector for measuring a differential capacitance of the capacitances of the variable capacitors configured in this manner. In this context, a first electric potential is applied to the first capacitor electrode; a second electric potential is applied to the second capacitor electrode; a third electric potential is applied to the third capacitor electrode; and a fourth electric potential is applied to the substrate. The fourth electrical potential applied to the substrate for the electrical zero-point balancing is changed for the operation of the differential-capacitance detector.