公开(公告)号：US20140004371A1

公开(公告)日：2014-01-02

申请号：US13981791

申请日：2012-01-26

申请人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Nam Jung Kim ,  Insook Yi ,  Jung Ah Choi ,  Su Phil Kim

发明人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Nam Jung Kim ,  Insook Yi ,  Jung Ah Choi ,  Su Phil Kim

IPC分类号： H01B13/00 ,  H01B1/02

CPC分类号： H01B13/0036 ,  C09D11/52 ,  C23C18/08 ,  H01B1/02 ,  Y10T428/12035

摘要： The present invention relates to a method of manufacturing a transparent conductive layer and a transparent conductive layer manufactured by the method. The method of manufacturing the transparent conductive layer includes: a) a step of forming a conductive nanowire layer on a base material; b) a step of thermally treating the conductive nanowire layer; c) a step of applying a conductive metal ink on the conductive nanowire layer; and d) a step of thermally treating the base material coated with the conductive metal ink to electrically bridge the conductive nanowires with each other by conductive metal particles of the conductive metal ink.

摘要翻译： 本发明涉及通过该方法制造透明导电层和透明导电层的方法。 制造透明导电层的方法包括：a）在基材上形成导电纳米线层的步骤; b）对导电纳米线层进行热处理的步骤; c）在导电纳米线层上施加导电金属油墨的步骤; 以及d）对涂覆有导电金属油墨的基材进行热处理以使导电金属墨水的导电金属颗粒彼此电导电导电纳米线的步骤。

公开(公告)号：US09396843B2

公开(公告)日：2016-07-19

申请号：US13981791

申请日：2012-01-26

申请人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Nam Jung Kim ,  Insook Yi ,  Jung Ah Choi ,  Su Phil Kim

发明人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Nam Jung Kim ,  Insook Yi ,  Jung Ah Choi ,  Su Phil Kim

IPC分类号： H01B13/00 ,  C23C18/08 ,  C09D11/52 ,  H01B1/02

CPC分类号： H01B13/0036 ,  C09D11/52 ,  C23C18/08 ,  H01B1/02 ,  Y10T428/12035

摘要： The present invention relates to a method of manufacturing a transparent conductive layer and a transparent conductive layer manufactured by the method. The method of manufacturing the transparent conductive layer includes: a) a step of forming a conductive nanowire layer on a base material; b) a step of thermally treating the conductive nanowire layer; c) a step of applying a conductive metal ink on the conductive nanowire layer; and d) a step of thermally treating the base material coated with the conductive metal ink to electrically bridge the conductive nanowires with each other by conductive metal particles of the conductive metal ink.

摘要翻译： 本发明涉及通过该方法制造透明导电层和透明导电层的方法。 制造透明导电层的方法包括：a）在基材上形成导电纳米线层的步骤; b）对导电纳米线层进行热处理的步骤; c）在导电纳米线层上施加导电金属油墨的步骤; 以及d）对涂覆有导电金属油墨的基材进行热处理以使导电金属墨水的导电金属颗粒彼此电导电导电纳米线的步骤。

公开(公告)号：US08557951B2

公开(公告)日：2013-10-15

申请号：US13130629

申请日：2009-11-20

申请人： Myoung Ruoul Lee ,  Jong Ryang Kim ,  Nam Jung Kim

发明人： Myoung Ruoul Lee ,  Jong Ryang Kim ,  Nam Jung Kim

IPC分类号： C08G63/00

CPC分类号： C08G63/199

摘要： The present invention relates to a copolymer polyester resin and a molded product using the same and more specifically to a copolymer polyester resin that contains 10˜80 mol % of 1,4-cyclohexane dimethanol, 0.1˜30 mol % of a cyclohexane dimethanol compound expressed as HOH2C—[C6H12]m—[C6H12]—CH2OH (where m is an integer from 1˜10), and ethylene glycol as the remainder so that the sum of the entire diol composition may be 100 mol % based on an aromatic dicarboxylic acid. The copolymer polyester of the present invention enables superior products to be provided that reduce cycle time and enhance product processability during mold processing using a heat-shrinking label by complementing low temperature shrinkage properties that may be exhibited by the polyester resin of the prior art copolymerized with 1,4-cyclohexane dimethanol.

摘要翻译： 本发明涉及一种共聚物聚酯树脂和使用该共聚物聚酯树脂的成型产品，更具体地涉及含有10〜80摩尔％的1,4-环己烷二甲醇，0.1〜30摩尔％的环己烷二甲醇化合物的共聚物聚酯树脂 作为HOH 2 C - [C 6 H 12] m - [C 6 H 12] -CH 2 OH（其中m是1〜10的整数）和作为余量的乙二醇，使得二元醇组合物的总和相​​对于芳族二羧酸为100摩尔％ 酸。 本发明的共聚物聚酯能够提供优异的产品，通过补充与现有技术共聚的聚酯树脂可以显现的低温收缩性能，缩短循环时间并提高使用热收缩标签的模具加工时的产品加工性能 1,4-环己烷二甲醇。

公开(公告)号：US20110230634A1

公开(公告)日：2011-09-22

申请号：US13130629

申请日：2009-11-20

申请人： Myoung Ruoul Lee ,  Jong Ryang Kim ,  Nam Jung Kim

发明人： Myoung Ruoul Lee ,  Jong Ryang Kim ,  Nam Jung Kim

IPC分类号： C08G63/199 ,  B29C45/00

CPC分类号： C08G63/199

摘要： The present invention relates to a copolymer polyester resin and a molded product using the same and more specifically to a copolymer polyester resin that contains 10˜80 mol % of 1,4-cyclohexane dimethanol, 0.1˜30 mol % of a cyclohexane dimethanol compound expressed as HOH2C—[C6H12]m—[C6H12]—CH2OH (where m is an integer from 1˜10), and ethylene glycol as the remainder so that the sum of the entire diol composition may be 100 mol % based on an aromatic dicarboxylic acid. The copolymer polyester of the present invention enables superior products to be provided that reduce cycle time and enhance product processability during mold processing using a heat-shrinking label by complementing low temperature shrinkage properties that may be exhibited by the polyester resin of the prior art copolymerized with 1,4-cyclohexane dimethanol.

摘要翻译： 本发明涉及一种共聚物聚酯树脂和使用该共聚物聚酯树脂的成型产品，更具体地涉及含有10〜80摩尔％的1,4-环己烷二甲醇，0.1〜30摩尔％的环己烷二甲醇化合物的共聚物聚酯树脂 作为HOH 2 C - [C 6 H 12] m - [C 6 H 12] -CH 2 OH（其中m是1〜10的整数）和作为余量的乙二醇，使得二醇组合物的总和相​​对于芳族二羧酸为100摩尔％ 酸。 本发明的共聚物聚酯使得能够提供优异的产品，其通过补充现有技术的聚酯树脂可以显现的低温收缩性能来缩短循环时间并提高使用热收缩标签的模具加工中的产品加工性， 1,4-环己烷二甲醇。

公开(公告)号：US08808843B2

公开(公告)日：2014-08-19

申请号：US12810323

申请日：2008-12-22

申请人： Hwa Yong Lee ,  Tae Woong Lee ,  Dong Sik Kim ,  Nam Jung Kim ,  Young Woo Kim

发明人： Hwa Yong Lee ,  Tae Woong Lee ,  Dong Sik Kim ,  Nam Jung Kim ,  Young Woo Kim

IPC分类号： B32B7/02

CPC分类号： C08G18/0895 ,  B32B27/08 ,  B32B27/40 ,  C08G18/4833 ,  C08G18/6674 ,  C08G18/73 ,  C08G18/7671 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/31551 ,  Y10T428/31725

摘要： Disclosed is a transparent multilayer sheet that is excellent in antistatic properties, as well as transparency. The transparent multilayer sheet includes a surface layer comprising a conductive thermoplastic polyurethane or polyurea resin containing ethylene oxide; and a back layer attached to the surface layer and comprising a transparent non-conductive polymer resin. Preferably, the polyurethane or polyurea resin is a polymerization product of (a) a polyether-based polymer containing ethylene oxide and reacting with an isocyanate group; (b) an aromatic or aliphatic diisocyanate compound; and (c) a chain extender C2 to C10 containing a primary hydroxyl group or an amine group, and the transparent non-conductive polymer resin is selected from the group consisting of polyethylene terephthalate, glycol modified polyethylene tereph-thalate, glycol modified polycyclohexaneterephthalate, polymethylmethacrylate, polycarbonate, transparent acrylonitrile-butadiene-styrene (ABS), and mixtures thereof.

摘要翻译： 公开了抗静电性能以及透明性优异的透明多层片材。 透明多层片材包括含有导电性热塑性聚氨酯或含有环氧乙烷的聚脲树脂的表面层; 以及附着到表面层并包含透明非导电聚合物树脂的背层。 优选地，聚氨酯或聚脲树脂是（a）含有环氧乙烷并与异氰酸酯基反应的聚醚类聚合物的聚合产物; （b）芳族或脂族二异氰酸酯化合物; 和（c）含有伯羟基或胺基的扩链剂C2至C10，透明非导电聚合物树脂选自聚对苯二甲酸乙二醇酯，二醇改性聚对苯二甲酸乙二醇酯，二醇改性聚环己烷对苯二甲酸酯，聚甲基丙烯酸甲酯 ，聚碳酸酯，透明丙烯腈 - 丁二烯 - 苯乙烯（ABS）及其混合物。

公开(公告)号：US20120021198A1

公开(公告)日：2012-01-26

申请号：US12810323

申请日：2008-12-22

申请人： Hwa Yong Lee ,  Tae Woong Lee ,  Dong Sik Kim ,  Nam Jung Kim ,  Young Woo Kim

发明人： Hwa Yong Lee ,  Tae Woong Lee ,  Dong Sik Kim ,  Nam Jung Kim ,  Young Woo Kim

IPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/40

CPC分类号： C08G18/0895 ,  B32B27/08 ,  B32B27/40 ,  C08G18/4833 ,  C08G18/6674 ,  C08G18/73 ,  C08G18/7671 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/31551 ,  Y10T428/31725

摘要： Disclosed is a transparent multilayer sheet that is excellent in antistatic properties, as well as transparency. The transparent multilayer sheet includes a surface layer comprising a conductive thermoplastic polyurethane or polyurea resin containing ethylene oxide; and a back layer attached to the surface layer and comprising a transparent non-conductive polymer resin. Preferably, the polyurethane or polyurea resin is a polymerization product of (a) a polyether-based polymer containing ethylene oxide and reacting with an isocyanate group; (b) an aromatic or aliphatic diisocyanate compound; and (c) a chain extender C2 to C10 containing a primary hydroxyl group or an amine group, and the transparent non-conductive polymer resin is selected from the group consisting of polyethylene terephthalate, glycol modified polyethylene terephthalate, glycol modified polycyclohexaneterephthalate, polymethylmethacrylate, polycarbonate, transparent acrylonitrile-butadiene-styrene (ABS), and mixtures thereof.

摘要翻译： 公开了抗静电性能以及透明性优异的透明多层片材。 透明多层片材包括含有导电性热塑性聚氨酯或含有环氧乙烷的聚脲树脂的表面层; 以及附着到表面层并包含透明非导电聚合物树脂的背层。 优选地，聚氨酯或聚脲树脂是（a）含有环氧乙烷并与异氰酸酯基反应的聚醚类聚合物的聚合产物; （b）芳族或脂族二异氰酸酯化合物; 和（c）含有伯羟基或胺基的扩链剂C2至C10，透明非导电聚合物树脂选自聚对苯二甲酸乙二醇酯，二醇改性聚对苯二甲酸乙二醇酯，二醇改性聚环己烷对苯二甲酸酯，聚甲基丙烯酸甲酯，聚碳酸酯 ，透明丙烯腈 - 丁二烯 - 苯乙烯（ABS）及其混合物。

公开(公告)号：US20110248408A1

公开(公告)日：2011-10-13

申请号：US13064437

申请日：2011-03-24

申请人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

发明人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

IPC分类号： H01L23/488 ,  H01L21/441

CPC分类号： H01L21/50 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19015 ,  H01L2924/19041 ,  Y10T436/170769 ,  H01L2224/13099

摘要： There are provided a package substrate and a method fabricating thereof. The package substrate includes: a wafer having a cavity formed in an upper surface thereof, the cavity including a chip mounting region; a first wiring layer and a second wiring layer formed to be spaced apart from the first wiring layer, which are formed to be extended in the cavity; a chip positioned in the chip mounting region to be connected to the first wiring layer and the second wiring layer; a through-hole penetrating through the wafer and a via filled in the through-hole; and at least one electronic device connected to the via. Accordingly, a package substrate capable of having a passive device having a predetermined capacity embedded therein, while reducing a pattern size and increasing a component mounting density, and a method fabricating thereof may be provided.

摘要翻译： 提供了封装基板及其制造方法。 封装基板包括：具有形成在其上表面中的空腔的晶片，所述空腔包括芯片安装区域; 形成为与所述第一布线层间隔开的第一布线层和第二布线层，所述第一布线层和第二布线层形成为在所述空腔中延伸; 位于所述芯片安装区域中以连接到所述第一布线层和所述第二布线层的芯片; 穿透晶片的通孔和填充在通孔中的通孔; 以及连接到通孔的至少一个电子设备。 因此，可以提供能够具有嵌入其中的预定容量的无源器件的封装基板，同时减少图案尺寸和增加部件安装密度，以及其制造方法。