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公开(公告)号：US09023510B2
公开(公告)日：2015-05-05
申请号：US13635288
申请日：2011-03-11
申请人： Kyotaro Goto , Naoto Hagiwara , Yuki Kawai , Katsuei Ishida
发明人： Kyotaro Goto , Naoto Hagiwara , Yuki Kawai , Katsuei Ishida
IPC分类号： H01M2/02 , H01G11/22 , H01G11/08 , H01G11/78 , H01M2/06 , H01M2/10 , H01M10/04 , H01G11/82 , H01M2/22 , H01M10/0525 , H01M10/0583 , H01M10/42
CPC分类号： H01M2/0277 , H01G11/08 , H01G11/22 , H01G11/78 , H01G11/82 , H01M2/021 , H01M2/0212 , H01M2/06 , H01M2/1094 , H01M2/22 , H01M10/0436 , H01M10/045 , H01M10/0525 , H01M10/0583 , H01M10/425 , Y02E60/13
摘要： [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card.[Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.
摘要翻译： 本发明提供允许薄封装的电化学装置，并且即使在电化学装置回流焊接到电化学装置期间在电化学装置中发生温度上升时，也可以可靠地防止内部空间中的电解质或气体泄漏到外部 电路板或封装在IC卡中。 [解决方案]在电化学装置RB1中，封装PA的主体包括依次层叠的第一盖板15，第一端子板12，框架板14，第二端子板13和第二盖板16， 表面。 蓄电元件SD被封装在通过端子板12,13的框架部分12a，13a中的通孔12a1，13a1和框架中的通孔14a之间形成在盖板15,16之间的内部空间IS中 板14。
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公开(公告)号：US20130143105A1
公开(公告)日：2013-06-06
申请号：US13635288
申请日：2011-03-11
申请人： Kyotaro Goto , Naoto Hagiwara , Yuki Kawai , Katsuei Ishida
发明人： Kyotaro Goto , Naoto Hagiwara , Yuki Kawai , Katsuei Ishida
CPC分类号： H01M2/0277 , H01G11/08 , H01G11/22 , H01G11/78 , H01G11/82 , H01M2/021 , H01M2/0212 , H01M2/06 , H01M2/1094 , H01M2/22 , H01M10/0436 , H01M10/045 , H01M10/0525 , H01M10/0583 , H01M10/425 , Y02E60/13
摘要： [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card.[Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.
摘要翻译： 本发明提供允许薄封装的电化学装置，并且即使在电化学装置回流焊接到电化学装置期间在电化学装置中发生温度上升时，也可以可靠地防止内部空间中的电解质或气体泄漏到外部 电路板或封装在IC卡中。 [解决方案]在电化学装置RB1中，封装PA的主体包括依次层叠的第一盖板15，第一端子板12，框架板14，第二端子板13和第二盖板16， 表面。 蓄电元件SD被封装在通过端子板12,13的框架部分12a，13a中的通孔12a1，13a1和框架中的通孔14a之间形成在盖板15,16之间的内部空间IS中 板14。
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公开(公告)号：US20120257357A1
公开(公告)日：2012-10-11
申请号：US13500272
申请日：2010-08-31
申请人： Kyotaro Goto , Naoto Hagiwara , Katsuei Ishida
发明人： Kyotaro Goto , Naoto Hagiwara , Katsuei Ishida
IPC分类号： H05K7/00
摘要： Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.
摘要翻译： 公开了可以回流焊接的电化学电容器，并且其中在电容器主体上使用膜封装。 电化学电容器（ECC）的容器（20）将电容器主体（10）的薄膜封装（11）存储在存储空间（SR）内，使得密封部分（11a-11c）不接触 存储空间（SR）。 覆盖密封部分（11a-11c）和胶片包装11的后边缘并粘附到存储空间（SR）的内表面的内部材料（30），将胶卷包装（11）固定在存储空间 （SR）设置在与所述密封部分（11a-11c）和后边缘相对应的容器（20）的存储空间（SR）中的区域中的矩形框架中。
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公开(公告)号：US08902594B2
公开(公告)日：2014-12-02
申请号：US13500272
申请日：2010-08-31
申请人： Kyotaro Goto , Naoto Hagiwara , Katsuei Ishida
发明人： Kyotaro Goto , Naoto Hagiwara , Katsuei Ishida
摘要： Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.
摘要翻译： 公开了可以回流焊接的电化学电容器，并且其中在电容器主体上使用膜封装。 电化学电容器（ECC）的容器（20）将电容器主体（10）的薄膜封装（11）存储在存储空间（SR）内，使得密封部分（11a-11c）不接触 存储空间（SR）。 覆盖密封部分（11a-11c）和胶片包装11的后边缘并粘附到存储空间（SR）的内表面的内部材料（30），将胶卷包装（11）固定在存储空间 （SR）设置在与所述密封部分（11a-11c）和后边缘相对应的容器（20）的存储空间（SR）中的区域中的矩形框架中。
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公开(公告)号：US20130183575A1
公开(公告)日：2013-07-18
申请号：US13810887
申请日：2011-06-24
申请人： Kyotaro Goto , Yuki Kawai
发明人： Kyotaro Goto , Yuki Kawai
CPC分类号： H01M2/0202 , H01G2/10 , H01G11/80 , H01G11/82 , H01L2224/32225 , H01M2/0212 , H01M2/0217 , H01M2/0426 , H01M2/0473 , H01M2/10 , H01M2/30 , Y02E60/13
摘要： An electrochemical device which can keep a conductive lid properly joined to a rigid case is provided. A conductive lid 12 has a reinforcement part RP inside of a ring-shaped welded part PP. The welded part PP of the conductive lid 12 and the welded frame member 11d of a rigid case 11 are joined to each other by welding. Even if stress of risen internal pressure due to reflow soldering or the like concentrates at the interface between the rigid case 11 and the conductive lid 12, the reinforcement part RP relieves the stress.
摘要翻译： 提供一种能够将导电盖保持正确连接到刚性壳体的电化学装置。 导电盖12在环形焊接部PP内部具有加强部RP。 导电盖12的焊接部分PP和刚性壳体11的焊接框架部件11d通过焊接彼此接合。 即使由于回流焊等引起的内部压力上升的压力集中在刚性壳体11与导电盖12之间的界面处，则加强部分RP减轻了应力。
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公开(公告)号：US20130202951A1
公开(公告)日：2013-08-08
申请号：US13810889
申请日：2011-06-24
申请人： Yuki Kawai , Kyotaro Goto
发明人： Yuki Kawai , Kyotaro Goto
CPC分类号： H01G11/02 , H01G11/04 , H01G11/06 , H01G11/78 , H01G11/82 , H01M2/0212 , H01M2/0217 , H01M2/0287 , H01M2/0426 , H01M2/0473 , H01M2/0486 , H01M2/0491 , H01M2/06 , H01M2/26 , H01M2/30 , Y02E60/13
摘要： An electrochemical device which is free from deterioration of properties due to a process of joining a rigid case and a conductive lid is provided. A welded part PP of a conductive lid 12 and a welded frame member 11d are joined each other by laser welding. A weld bead for joining the welded part PP and the welded frame member 11d is not exposed to an internal space of a rigid package 10; therefore, fused material, the coagulum thereof, or the like created during laser welding are prevented from entering into the internal space of the rigid package 10.
摘要翻译： 提供了一种电化学装置，其不会由于刚性壳体和导电盖子的接合过程而导致的性能劣化。 导电盖12的焊接部分PP和焊接框架部件11d通过激光焊接彼此接合。 用于接合焊接部分PP和焊接框架部件11d的焊道不暴露于刚性包装10的内部空间; 因此，防止在激光焊接期间产生的熔融材料，其凝固物等进入刚性封装10的内部空间。
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