摘要:
A three-dimensional (3D) semiconductor memory device may include a substrate including a cell array region and a connection region, an electrode structure including pluralities of first and second electrodes that are vertically and alternately stacked on a surface of the substrate, extending in a first direction that is parallel to the surface of the substrate, and may include a stair step structure on the connection region, first and second string selection electrodes that extend in the first direction on the electrode structure and spaced apart from each other in a second direction that is parallel to the surface of the substrate and perpendicular to the first direction. The first and second string selection electrodes may each include an electrode portion on the cell array region and a pad portion that extends from the electrode portion in the first direction and on the connection region. Widths in the second direction of the pad portions may be different from widths in the second direction of the respective electrode portions.
摘要:
A semiconductor memory device may include an electrode structure including a selection line on a substrate and word lines between the substrate and the selection line, vertical pillars penetrating the electrode structure and being connected to the substrate, sub-interconnections and bit lines sequentially stacked on and electrically connected to the vertical pillars, and lower contacts connecting the vertical pillars to the sub-interconnections. The selection line may include a plurality of selection lines separated from each other in a first direction by an insulating separation layer, and central axes of the lower contacts connected in common to one of the sub-interconnections may be shifted, in a second direction across the first direction and parallel to a top surface of the substrate, from central axes of the vertical pillars thereunder.
摘要:
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate doped with a first conductive type dopant, a plurality of stacked structures arranged side by side on the substrate and extending in a first direction, each of the stacked structures including gate electrodes spaced apart from each other, the plurality of stacked structures including a pair of stacked structures spaced apart from each other at a first interval in a second direction perpendicular to the first direction, and a pick-up region extending in the first direction in the substrate between the pair of stacked structures and doped with the first conductive type dopant.
摘要:
Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.
摘要:
A method and system for transmitting a short message to a called party's Internet phone use an Internet phone according to the H.323 multimedia communication protocol. The invention provides a message transmission system between a short message transmission server and a gatekeeper. The gatekeeper controls setup of a call and user registration or cancellation in the Internet phone. The Internet phone is optionally connected to the gatekeeper, and has a short message transmission module for transmitting, via a predetermined port, the short message including information corresponding to a telephone number of the called party's Internet phone. The short message transmission server serves as an H.323 terminal registered in the gatekeeper, and is constructed to transmit, to the gatekeeper, the information relating to the called party's Internet phone incorporated in the corresponding short message so as to obtain an Internet protocol (IP) address of the called party's Internet phone, and to transmit the short message to the IP address of the called party's Internet phone. The invention allows a user of the Internet phone to transmit the SMS message to the called party's Internet phone using the registration admission and status (RAS) protocol of the H.323 multimedia communication protocol.