MEMS-based Coriolis mass flow controller

    公开(公告)号:US11860016B2

    公开(公告)日:2024-01-02

    申请号:US17042059

    申请日:2019-03-28

    Abstract: A mass flow controller assembly includes a housing defining a cavity, a plurality of internal passages, a first inlet, a first outlet, a second inlet, and a second outlet. A valve is connected to the housing, has an inlet fluidly coupled to the second outlet of the housing and an outlet fluidly coupled to the second inlet of the housing. The valve is configured to control fluid flow from the second outlet of the housing to the second inlet of the housing. A microelectromechanical (MEMS) Coriolis flow sensor is arranged in the cavity, includes an inlet fluidly coupled by at least one of the plurality of internal passages to the first inlet of the housing and is configured to measure at least one of a mass flow rate and density of fluid flowing through the MEMS Coriolis flow sensor. An outlet of the MEMS Coriolis flow sensor is fluidly coupled by at least one of the plurality of internal passages to the second outlet of the housing. The second inlet of the housing is fluidly coupled by at least one of the plurality of internal passages to the first outlet of the housing.

    SEMICONDUCTOR EQUIPMENT MODULE FABRICATION WITH ADDITIVE MANUFACTURING

    公开(公告)号:US20220384145A1

    公开(公告)日:2022-12-01

    申请号:US17770968

    申请日:2020-10-21

    Abstract: Methods, systems, and computer programs are presented for manufacturing a showerhead for a semiconductor manufacturing system. One method includes an operation for drilling first holes on a faceplate made of a first material, where the first holes have a first diameter. Further, the method includes an operation for cladding the first holes and the faceplate with a second material to cover the first holes and the faceplate with the second material. Further yet, the method includes drilling second holes concentric with the first holes resulting in a part with holes coated with the second material. The second holes have a second diameter that is smaller than the first diameter. Additionally, the method includes an operation for creating the showerhead utilizing the part, where gas is deliverable through the second holes of the faceplate in the showerhead.

    MEMS coriolis gas flow controller

    公开(公告)号:US11662237B2

    公开(公告)日:2023-05-30

    申请号:US17043182

    申请日:2019-04-02

    Abstract: A fluid delivery system includes N first valves. Inlets of the N first valves are fluidly connected to N gas sources, respectively, where N is an integer greater than zero. N mass flow controllers include a microelectromechanical (MEMS) Coriolis flow sensor having an inlet in fluid communication with an outlet of a corresponding one of the N first valves. A second valve has an inlet in fluid communication with an outlet of the MEMS Coriolis flow sensor and an outlet supplying fluid to treat a substrate arranged in a processing chamber. A controller in communication with the MEMS Coriolis flow sensor is configured to determine at least one of a mass flow rate and a density of fluid flowing through the MEMS Coriolis flow sensor.

    Manufacture of an orifice plate for use in gas calibration

    公开(公告)号:US10737359B2

    公开(公告)日:2020-08-11

    申请号:US15948910

    申请日:2018-04-09

    Inventor: Dennis Smith

    Abstract: Methods and systems for preparing a hole having an accurately controlled area in an orifice plate for a mass flow controller are provided. Methods involve forming an initial hole in the orifice plate. The initial hole has an opening having an initial area. The orifice plate comprises a material that can react to form a coating on the orifice plate. The coating occupies a greater volume than the material consumed to form the coating. The material of the orifice plate is reacted with a reactant to produce the coating and thereby produce a reduced area hole having an opening with a reduced area that is smaller than the initial area. The reduced area hole is measured. A determined amount of the coating is removed from at least the reduced area hole to produce a final hole in the orifice plate, wherein the reduced area is smaller than an opening area of the final hole.

    Mass flow controller for substrate processing

    公开(公告)号:US10591934B2

    公开(公告)日:2020-03-17

    申请号:US15917528

    申请日:2018-03-09

    Abstract: Methods and apparatuses for delivering a process gas to a processing chamber are provided. A mass flow controller includes a first flow line for introducing a process fluid and an inlet valve disposed along the first flow line for controlling a flow rate of the process fluid. The mass flow controller includes a second flow line for introducing a carrier fluid into the mass flow controller and a micro-electro-mechanical system (MEMS) Coriolis sensor for providing a density signal and a mass flow rate signal for a mixture of the process fluid and the carrier fluid. The mass flow controller provided includes an outlet valve for controlling a mass flow rate of the mixture that is output by the mass flow controller as well as a controller for operating the inlet valve based on the density signal and for operating the outlet valve based on the mass flow rate signal.

    MANUFACTURE OF AN ORIFICE PLATE FOR USE IN GAS CALIBRATION

    公开(公告)号:US20190308286A1

    公开(公告)日:2019-10-10

    申请号:US15948910

    申请日:2018-04-09

    Inventor: Dennis Smith

    Abstract: Methods and systems for preparing a hole having an accurately controlled area in an orifice plate for a mass flow controller are provided. Methods involve forming an initial hole in the orifice plate. The initial hole has an opening having an initial area. The orifice plate comprises a material that can react to form a coating on the orifice plate. The coating occupies a greater volume than the material consumed to form the coating. The material of the orifice plate is reacted with a reactant to produce the coating and thereby produce a reduced area hole having an opening with a reduced area that is smaller than the initial area. The reduced area hole is measured. A determined amount of the coating is removed from at least the reduced area hole to produce a final hole in the orifice plate, wherein the reduced area is smaller than an opening area of the final hole.

    Turbomolecular pump deposition control and particle management

    公开(公告)号:US10655638B2

    公开(公告)日:2020-05-19

    申请号:US15922857

    申请日:2018-03-15

    Abstract: A gas pump and processes for preparing the gas pump are presented. The gas pump includes a bottom Holweck stage with internal heaters for cleaning deposits resulting from exhausting gases from a semiconductor manufacturing chamber. One example gas pump includes a turbomolecular stage on a top section of the gas pump and a Holweck stage below the turbomolecular stage. The Holweck stage comprises a rotor element, a stator element with an opening in the center, and one or more heaters. The opening has a substantially cylindrical shape and an inside surface with a plurality of grooves separated by threads. Each heater is situated on a surface of one of the plurality of grooves. The heaters may be turned on to clean the deposits accumulated on the gas pump during the processing of a substrate.

    TURBOMOLECULAR PUMP DEPOSITION CONTROL AND PARTICLE MANAGEMENT

    公开(公告)号:US20190285090A1

    公开(公告)日:2019-09-19

    申请号:US15922857

    申请日:2018-03-15

    Abstract: A gas pump and processes for preparing the gas pump are presented. The gas pump includes a bottom Holweck stage with internal heaters for cleaning deposits resulting from exhausting gases from a semiconductor manufacturing chamber. One example gas pump includes a turbomolecular stage on a top section of the gas pump and a Holweck stage below the turbomolecular stage. The Holweck stage comprises a rotor element, a stator element with an opening in the center, and one or more heaters. The opening has a substantially cylindrical shape and an inside surface with a plurality of grooves separated by threads. Each heater is situated on a surface of one of the plurality of grooves. The heaters may be turned on to clean the deposits accumulated on the gas pump during the processing of a substrate.

    Mass Flow Controller for Substrate Processing

    公开(公告)号:US20190279888A1

    公开(公告)日:2019-09-12

    申请号:US15917528

    申请日:2018-03-09

    Abstract: Methods and apparatuses for delivering a process gas to a processing chamber are provided. A mass flow controller includes a first flow line for introducing a process fluid and an inlet valve disposed along the first flow line for controlling a flow rate of the process fluid. The mass flow controller includes a second flow line for introducing a carrier fluid into the mass flow controller and a micro-electro-mechanical system (MEMS) Coriolis sensor for providing a density signal and a mass flow rate signal for a mixture of the process fluid and the carrier fluid. The mass flow controller provided includes an outlet valve for controlling a mass flow rate of the mixture that is output by the mass flow controller as well as a controller for operating the inlet valve based on the density signal and for operating the outlet valve based on the mass flow rate signal.

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