公开(公告)号：US11894503B2

公开(公告)日：2024-02-06

申请号：US18058765

申请日：2022-11-24

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Ching-Huai Ni ,  Kuo-Wei Huang ,  Jia-Jhang Kuo

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/02 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2933/005

Abstract: A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.

公开(公告)号：US11538970B2

公开(公告)日：2022-12-27

申请号：US17027731

申请日：2020-09-22

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Ching-Huai Ni ,  Kuo-Wei Huang ,  Jia-Jhang Kuo

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/02 ,  H01L33/58

Abstract: A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.

公开(公告)号：USD782425S1

公开(公告)日：2017-03-28

申请号：US29497491

申请日：2014-07-24

Applicant: LEXTAR ELECTRONICS CORPORATION

Designer： Bo-Yu Ko ,  Kuo-Wei Huang ,  Chun-Wei Wang