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    LED device and LED lamp using the same
    1.
    发明授权
    LED device and LED lamp using the same 有权
    LED设备和LED灯使用相同

    公开(公告)号：US09245877B2

    公开(公告)日：2016-01-26

    申请号：US14305071

    申请日：2014-06-16

    Applicant: Lextar Electronics Corporation

    Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

    IPC: H01L33/62 ,  H01L25/16

    CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

    Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。

    LED package structure
    3.
    发明授权
    LED package structure 有权

    公开(公告)号：US10270020B2

    公开(公告)日：2019-04-23

    申请号：US15628627

    申请日：2017-06-20

    Applicant: Lextar Electronics Corporation

    Inventor： Dao-Wei Chen ,  Kun-Jung Wu ,  Bo-Yu Ko

    IPC: H01L23/043 ,  H01L33/62 ,  H01L33/52 ,  H01L33/22 ,  H01L21/48 ,  H01L23/31

    Abstract: An LED package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate has at least one first protrusion portion. The second metal plate has at least one second protrusion portion. The mold is disposed on the first metal plate and the second metal plate, in which the mold has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface. The first and second protrusion portion protrude respectively from the first side surface and the second side surface, and the first metal plate and the second metal plate are covered by the third side surface and the fourth side surface, in which a portion of the first side surface between the first edge and the first protrusion portion is a fracture surface.

    LED DEVICE AND LED LAMP USING THE SAME
    6.
    发明申请
    LED DEVICE AND LED LAMP USING THE SAME 有权
    LED装置和使用其的LED灯

    公开(公告)号：US20150207049A1

    公开(公告)日：2015-07-23

    申请号：US14305071

    申请日：2014-06-16

    Applicant: Lextar Electronics Corporation

    Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

    IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50 ,  H01L27/15

    CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

    Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。

    PACKAGE STRUCTURE OF LIGHT EMITTING DEVICE
    7.
    发明申请
    PACKAGE STRUCTURE OF LIGHT EMITTING DEVICE 审中-公开
    发光装置的包装结构

    公开(公告)号：US20130277706A1

    公开(公告)日：2013-10-24

    申请号：US13854163

    申请日：2013-04-01

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Chun-Wei Wang

    IPC: H01L33/64 ,  H01L33/62

    CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A package structure of a light emitting device is disclosed. The package structure includes a light emitting device, a leadframe and a cup structure. The leadframe is used for supporting the light emitting device. The leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface. The side surface has a dimension in the thickness direction of the leadframe. The cup structure made of thermosetting resin is disposed on the leadframe. A sidewall of the cup structure covers the side surface of the leadframe, and has a connecting profile length in the thickness direction with respect to the side surface. The connecting profile length is larger than the dimension of the side surface in the thickness direction.

    Abstract translation: 公开了一种发光器件的封装结构。 封装结构包括发光器件，引线框和杯结构。 引线框用于支撑发光器件。 引线框架具有顶表面，底表面和位于顶表面和底表面之间的侧表面。 侧面在引线框的厚度方向上具有尺寸。 由热固性树脂制成的杯结构设置在引线框架上。 杯结构的侧壁覆盖引线框架的侧表面，并且在相对于侧表面的厚度方向上具有连接轮廓长度。 连接轮廓长度大于侧面在厚度方向上的尺寸。

    Mold for Manufacturing LED Mounting Substrate
    8.
    发明申请
    Mold for Manufacturing LED Mounting Substrate 审中-公开
    用于制造LED安装基板的模具

    公开(公告)号：US20160082631A1

    公开(公告)日：2016-03-24

    申请号：US14956490

    申请日：2015-12-02

    Applicant: Lextar Electronics Corporation

    Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Hsiu-Hsiang Lin

    IPC: B29C45/02 ,  H01L33/00 ,  B29C45/14

    CPC classification number: B29C45/02 ,  B29C45/14655 ,  B29K2101/10 ,  B29L2031/3406 ,  H01L33/00 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014

    Abstract: A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.

    Abstract translation: 用于制造LED安装基板的模具包括第一模塑模具和第二模塑模具。第二模塑模具覆盖第一模塑模具。 第二成型模具包括材料容纳槽，按压部和材料入口通道。 按压部分在材料容纳槽上突出。 按压部沿着从第一成型模具向第二成型模具的方向扩展。 材料入口通道连接在第二模具的外壁和材料容纳槽之间。 材料入口通道沿着从第一模塑模具到第二模塑模具的方向收缩。

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