公开(公告)号：US20180148555A1

公开(公告)日：2018-05-31

申请号：US15572390

申请日：2016-12-28

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Yong Seon HWANG ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM ,  Young Chan KIM ,  Seung Hyun SONG ,  Won Ki KIM

IPC: C08J5/24 ,  C08L65/02 ,  H01L23/14 ,  H01L23/00

CPC classification number: C08J5/24 ,  C08G2261/135 ,  C08G2261/1414 ,  C08G2261/142 ,  C08G2261/143 ,  C08G2261/3424 ,  C08G2261/76 ,  C08J2365/02 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2479/08 ,  C08K9/06 ,  C08L33/08 ,  C08L33/24 ,  C08L61/14 ,  C08L63/00 ,  C08L65/02 ,  H01L23/145 ,  H01L23/29 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/562 ,  C08L61/34 ,  C08L79/085

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.