公开(公告)号：US20210114348A1

公开(公告)日：2021-04-22

申请号：US16606652

申请日：2018-12-11

Applicant: LG CHEM, LTD.

Inventor： Minhyuk YUN ,  Young Chan KIM ,  Hyunsung MIN ,  Changbo SHIM ,  Hee Yong SHIM

IPC: B32B15/08 ,  B32B15/06 ,  B05D7/14 ,  C09D179/08 ,  C09D163/00 ,  C09D167/00 ,  C09D7/61 ,  C09D7/65

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

公开(公告)号：US20200332056A1

公开(公告)日：2020-10-22

申请号：US16957345

申请日：2019-04-09

Applicant: LG CHEM, LTD.

Inventor： Changbo SHIM ,  Seunghyun SONG ,  Hwayeon MOON ,  Hyunsung MIN ,  Hee Yong SHIM

IPC: C08G59/56 ,  C08J5/24 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  C08K9/06 ,  C08K3/36 ,  C08K5/5419 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20 ,  B32B7/027 ,  H05K1/03 ,  H05K1/02 ,  H01L23/14 ,  H01L23/00

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

公开(公告)号：US20200231804A1

公开(公告)日：2020-07-23

申请号：US16487047

申请日：2018-04-11

Applicant: LG CHEM, LTD.

Inventor： Chang Bo SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Hwa Yeon MOON

IPC: C08L71/12 ,  C08J5/24 ,  C08L9/06 ,  C08L23/20 ,  C08L83/04

Abstract: A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.

公开(公告)号：US20200048440A1

公开(公告)日：2020-02-13

申请号：US16606108

申请日：2018-12-12

Applicant: LG CHEM, LTD.

Inventor： Minhyuk YUN ,  Hyunsung MIN ,  Young Chan KIM ,  Hee Yong SHIM ,  Changbo SHIM ,  Gilsang SON

IPC: C08L9/06 ,  C08L23/22 ,  C08L63/00 ,  C08L21/00 ,  B05D7/14

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

公开(公告)号：US20190270881A1

公开(公告)日：2019-09-05

申请号：US16333082

申请日：2018-03-08

Applicant: LG CHEM, LTD.

Inventor： Chang Bo SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Young Chan KIM ,  Seung Hyun SONG

IPC: C08L63/04 ,  C08K3/013 ,  C08K5/17 ,  C08J5/24 ,  H01L23/498 ,  C08K9/06 ,  C08L79/08 ,  C08G59/50

Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

公开(公告)号：US20190276661A1

公开(公告)日：2019-09-12

申请号：US16334201

申请日：2018-03-08

Applicant: LG CHEM, LTD.

Inventor： Chang Bo SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Young Chan KIM ,  Seung Hyun SONG

IPC: C08L63/00 ,  C08J5/24 ,  H01L23/14 ,  H01L23/00 ,  H01L23/498 ,  B32B15/14

Abstract: The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

公开(公告)号：US20160369099A1

公开(公告)日：2016-12-22

申请号：US14901895

申请日：2014-09-25

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Jung Jin SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM

IPC: C08L79/04 ,  H05K3/02 ,  H05K1/03 ,  H01L21/48 ,  C08J5/24 ,  H01L23/498

CPC classification number: C08L79/04 ,  C08J5/24 ,  C08J2379/04 ,  C08J2379/08 ,  C08J2463/00 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K7/18 ,  C08K9/06 ,  C08L61/04 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract translation: 提供了一种用于半导体封装的热固性树脂组合物和预浸料和使用其的金属覆层层压板。 更具体地，提供了一种半导体封装用热固性树脂组合物，其能够通过使用基于环氧树脂的热固性树脂组合物中的氰酸酯类酯树脂和苯并恶嗪树脂来改善去污特性，并且通过使用浆料型填料提高耐化学性 具有高的耐热性和可靠性，以及使用其的预浸料坯和覆金属层压板。

公开(公告)号：US20210171768A1

公开(公告)日：2021-06-10

申请号：US17052488

申请日：2020-01-17

Applicant: LG CHEM, LTD.

Inventor： Changbo SHIM ,  Yongseon HWANG ,  Hwayeon MOON ,  Hee Yong SHIM ,  Hyunsung MIN

IPC: C08L71/12 ,  C08J5/24 ,  B32B15/20 ,  B32B15/14 ,  B32B5/02 ,  H01L23/14 ,  H01L23/498

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

公开(公告)号：US20180148555A1

公开(公告)日：2018-05-31

申请号：US15572390

申请日：2016-12-28

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Yong Seon HWANG ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM ,  Young Chan KIM ,  Seung Hyun SONG ,  Won Ki KIM

IPC: C08J5/24 ,  C08L65/02 ,  H01L23/14 ,  H01L23/00

CPC classification number: C08J5/24 ,  C08G2261/135 ,  C08G2261/1414 ,  C08G2261/142 ,  C08G2261/143 ,  C08G2261/3424 ,  C08G2261/76 ,  C08J2365/02 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2479/08 ,  C08K9/06 ,  C08L33/08 ,  C08L33/24 ,  C08L61/14 ,  C08L63/00 ,  C08L65/02 ,  H01L23/145 ,  H01L23/29 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/562 ,  C08L61/34 ,  C08L79/085

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.