公开(公告)号：US20200048440A1

公开(公告)日：2020-02-13

申请号：US16606108

申请日：2018-12-12

Applicant: LG CHEM, LTD.

Inventor： Minhyuk YUN ,  Hyunsung MIN ,  Young Chan KIM ,  Hee Yong SHIM ,  Changbo SHIM ,  Gilsang SON

IPC: C08L9/06 ,  C08L23/22 ,  C08L63/00 ,  C08L21/00 ,  B05D7/14

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

公开(公告)号：US20190270881A1

公开(公告)日：2019-09-05

申请号：US16333082

申请日：2018-03-08

Applicant: LG CHEM, LTD.

Inventor： Chang Bo SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Young Chan KIM ,  Seung Hyun SONG

IPC: C08L63/04 ,  C08K3/013 ,  C08K5/17 ,  C08J5/24 ,  H01L23/498 ,  C08K9/06 ,  C08L79/08 ,  C08G59/50

Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

公开(公告)号：US20180148555A1

公开(公告)日：2018-05-31

申请号：US15572390

申请日：2016-12-28

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Yong Seon HWANG ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM ,  Young Chan KIM ,  Seung Hyun SONG ,  Won Ki KIM

IPC: C08J5/24 ,  C08L65/02 ,  H01L23/14 ,  H01L23/00

CPC classification number: C08J5/24 ,  C08G2261/135 ,  C08G2261/1414 ,  C08G2261/142 ,  C08G2261/143 ,  C08G2261/3424 ,  C08G2261/76 ,  C08J2365/02 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2479/08 ,  C08K9/06 ,  C08L33/08 ,  C08L33/24 ,  C08L61/14 ,  C08L63/00 ,  C08L65/02 ,  H01L23/145 ,  H01L23/29 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/562 ,  C08L61/34 ,  C08L79/085

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

公开(公告)号：US20190276661A1

公开(公告)日：2019-09-12

申请号：US16334201

申请日：2018-03-08

Applicant: LG CHEM, LTD.

Inventor： Chang Bo SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Young Chan KIM ,  Seung Hyun SONG

IPC: C08L63/00 ,  C08J5/24 ,  H01L23/14 ,  H01L23/00 ,  H01L23/498 ,  B32B15/14

Abstract: The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

公开(公告)号：US20210114348A1

公开(公告)日：2021-04-22

申请号：US16606652

申请日：2018-12-11

Applicant: LG CHEM, LTD.

Inventor： Minhyuk YUN ,  Young Chan KIM ,  Hyunsung MIN ,  Changbo SHIM ,  Hee Yong SHIM

IPC: B32B15/08 ,  B32B15/06 ,  B05D7/14 ,  C09D179/08 ,  C09D163/00 ,  C09D167/00 ,  C09D7/61 ,  C09D7/65

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.