公开(公告)号：US20220154043A1

公开(公告)日：2022-05-19

申请号：US17496917

申请日：2021-10-08

Applicant: LG CHEM, LTD.

Inventor： Ji Ho HAN ,  Da Ae KIM ,  Kwang Joo LEE ,  Mi JANG ,  Bo Ra YEON ,  Kwang Su SEO ,  Mi Seon KIM

IPC: C09J4/06 ,  C09J7/25 ,  C08F2/50 ,  C08F220/28 ,  C08F220/18 ,  C08F220/20

Abstract: The present disclosure provides an adhesive composition for a dicing film, a dicing film, and a dicing die-bonding film, which have excellent pickup performance.

公开(公告)号：US20180148555A1

公开(公告)日：2018-05-31

申请号：US15572390

申请日：2016-12-28

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Yong Seon HWANG ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM ,  Young Chan KIM ,  Seung Hyun SONG ,  Won Ki KIM

IPC: C08J5/24 ,  C08L65/02 ,  H01L23/14 ,  H01L23/00

CPC classification number: C08J5/24 ,  C08G2261/135 ,  C08G2261/1414 ,  C08G2261/142 ,  C08G2261/143 ,  C08G2261/3424 ,  C08G2261/76 ,  C08J2365/02 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2479/08 ,  C08K9/06 ,  C08L33/08 ,  C08L33/24 ,  C08L61/14 ,  C08L63/00 ,  C08L65/02 ,  H01L23/145 ,  H01L23/29 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/562 ,  C08L61/34 ,  C08L79/085

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

公开(公告)号：US20160369099A1

公开(公告)日：2016-12-22

申请号：US14901895

申请日：2014-09-25

Applicant: LG CHEM, LTD.

Inventor： Hwa Yeon MOON ,  Jung Jin SHIM ,  Hee Yong SHIM ,  Hyun Sung MIN ,  Mi Seon KIM ,  Chang Bo SHIM

IPC: C08L79/04 ,  H05K3/02 ,  H05K1/03 ,  H01L21/48 ,  C08J5/24 ,  H01L23/498

CPC classification number: C08L79/04 ,  C08J5/24 ,  C08J2379/04 ,  C08J2379/08 ,  C08J2463/00 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K7/18 ,  C08K9/06 ,  C08L61/04 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract translation: 提供了一种用于半导体封装的热固性树脂组合物和预浸料和使用其的金属覆层层压板。 更具体地，提供了一种半导体封装用热固性树脂组合物，其能够通过使用基于环氧树脂的热固性树脂组合物中的氰酸酯类酯树脂和苯并恶嗪树脂来改善去污特性，并且通过使用浆料型填料提高耐化学性 具有高的耐热性和可靠性，以及使用其的预浸料坯和覆金属层压板。