公开(公告)号：US11760907B2

公开(公告)日：2023-09-19

申请号：US17404062

申请日：2021-08-17

Applicant: LG CHEM, LTD.

Inventor： Jong Min Jang ,  Kwang Joo Lee ,  Yu Lin Sun

IPC: C09J133/04 ,  C09J11/04 ,  C09J7/20 ,  C08K5/13 ,  C09J163/00 ,  C09J133/06 ,  H01L21/683 ,  C08K5/00 ,  C08K3/04 ,  C08K3/22

CPC classification number: C09J133/068 ,  C08K3/042 ,  C08K5/0025 ,  C08K5/13 ,  C09J7/20 ,  C09J11/04 ,  C09J163/00 ,  H01L21/6836 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2262 ,  C08K2003/2265 ,  C08K2201/01 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/208 ,  C09J2301/408 ,  C09J2400/10 ,  C09J2433/00 ,  C09J2463/00 ,  H01L2221/68327

Abstract: The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

公开(公告)号：US20220098455A1

公开(公告)日：2022-03-31

申请号：US17404053

申请日：2021-08-17

Applicant: LG CHEM, LTD.

Inventor： Jong Min Jang ,  Byoung Ju Choi ,  Kwang Joo Lee ,  Yu Lin Sun

IPC: C09J163/00 ,  C09J133/08

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

公开(公告)号：US11939494B2

公开(公告)日：2024-03-26

申请号：US17404053

申请日：2021-08-17

Applicant: LG CHEM, LTD.

Inventor： Jong Min Jang ,  Byoung Ju Choi ,  Kwang Joo Lee ,  Yu Lin Sun

IPC: C09J163/00 ,  C09J133/08

CPC classification number: C09J163/00 ,  C09J133/08

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.