OXIDE THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20180204952A1

    公开(公告)日:2018-07-19

    申请号:US15906498

    申请日:2018-02-27

    Inventor: JongUk BAE

    Abstract: The present disclosure relates to an oxide thin film transistor and a fabricating method thereof. In the oxide thin film transistor, which uses amorphous zinc oxide (ZnO) semiconductor as an active layer, damage to the oxide semiconductor due to dry etching may be minimized by forming source and drain electrodes in a multilayered structure having at least two layers, and improving stability and reliability of a device by employing a dual passivation layer structure, which includes a lower layer for overcoming a deficiency and an upper layer for minimizing external affection, on the multilayered source and drain electrodes.

    OXIDE THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME
    6.
    发明申请
    OXIDE THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME 有权
    氧化物薄膜晶体管及其制造方法

    公开(公告)号:US20140339537A1

    公开(公告)日:2014-11-20

    申请号:US14026769

    申请日:2013-09-13

    Inventor: JongUk BAE

    Abstract: The present disclosure relates to an oxide thin film transistor and a fabricating method thereof. In the oxide thin film transistor, which uses amorphous zinc oxide (ZnO) semiconductor as an active layer, damage to the oxide semiconductor due to dry etching may be minimized by forming source and drain electrodes in a multilayered structure having at least two layers, and improving stability and reliability of a device by employing a dual passivation layer structure, which includes a lower layer for overcoming a deficiency and an upper layer for minimizing external affection, on the multilayered source and drain electrodes.

    Abstract translation: 本发明涉及一种氧化物薄膜晶体管及其制造方法。 在使用无定形氧化锌(ZnO)半导体作为有源层的氧化物薄膜晶体管中,通过在具有至少两层的多层结构中形成源电极和漏电极,可以最小化由于干蚀刻而导致的氧化物半导体的损伤,并且 通过在多层源极和漏极上采用包括用于克服缺陷的下层和用于最小化外部影响的上层的双钝化层结构来提高器件的稳定性和可靠性。

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