公开(公告)号：US11990565B2

公开(公告)日：2024-05-21

申请号：US17266406

申请日：2018-08-29

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub Kim ,  Sunghyun Moon ,  Younghak Chang ,  Jina Jeon

IPC: H01L21/78 ,  H01L25/075 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44

CPC classification number: H01L33/38 ,  H01L21/7806 ,  H01L25/0753 ,  H01L33/40 ,  H01L33/44 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: Discussed is a display device having a plurality of semiconductor light-emitting diodes. At least one of the semiconductor light-emitting diodes has a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer on which the first conductive electrode is disposed; a second conductive semiconductor layer that overlaps with the first conductive semiconductor layer, and the second conductive electrode being disposed on the second conductive semiconductor layer; an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; an undoped semiconductor layer disposed on the second conductive semiconductor layer; and protrusions formed of a porous material allowing electropolishing, and on the undoped semiconductor layer.

公开(公告)号：US11557705B2

公开(公告)日：2023-01-17

申请号：US16965235

申请日：2018-01-29

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Sunghyun Moon ,  Jina Jeon

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/56

Abstract: The present invention relates to a method for manufacturing a display device using semiconductor light-emitting elements and a display device. The method for manufacturing a display device according to the present invention comprises the steps of: transferring semiconductor light-emitting elements provided on a growth substrate to an adhesive layer of a temporary substrate; curing the adhesive layer of the temporary substrate; aligning the temporary substrate with a wiring substrate having a wiring electrode and a conductive adhesive layer; compressing the temporary substrate to the wiring substrate so that the semiconductor light-emitting elements bond to the wiring substrate together with the adhesive layer of the temporary substrate, and then removing the temporary substrate; and removing at least a part of the adhesive layer to expose the semiconductor light-emitting elements to the outside, and depositing electrodes on the semiconductor light-emitting elements.

公开(公告)号：US12148862B2

公开(公告)日：2024-11-19

申请号：US17763050

申请日：2019-09-25

Applicant: LG ELECTRONICS INC.

Inventor： Jina Jeon ,  Yongdae Kim ,  Myoungsoo Kim ,  Yoonchul Kim ,  Jungsub Kim ,  Sunghyun Moon ,  Yeonhong Jung

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed is a manufacturing method of a display apparatus, and the display apparatus. The display includes a substrate, an adhesive layer located on the substrate and including protruding portions, semiconductor light-emitting diodes located on the adhesive layer, an insulating layer located on the semiconductor light-emitting diodes and the adhesive layer, and wiring electrodes electrically connected to the semiconductor light-emitting diodes, wherein the protruding portions of the adhesive layer are positioned at regular intervals to correspond to the shapes of the contact surfaces of the semiconductor light-emitting diodes in contact with the adhesive layer.

公开(公告)号：US12107205B2

公开(公告)日：2024-10-01

申请号：US18083152

申请日：2022-12-16

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Sunghyun Moon ,  Jina Jeon

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/56 ,  H01L2933/0066

Abstract: A display device can include a wiring substrate including a first electrode, a plurality of semiconductor light-emitting elements electrically connected to the first electrode, a conductive adhesive layer on the wiring substrate and around the plurality of semiconductor light-emitting elements, an upper layer on one surface of the conductive adhesive layer and including a plurality of through holes corresponding to the plurality of semiconductor light-emitting elements, respectively, and a second electrode on the upper layer and electrically connected to the plurality of semiconductor light-emitting elements. The upper layer can include a thermosetting adhesive.

公开(公告)号：US10950583B2

公开(公告)日：2021-03-16

申请号：US15754900

申请日：2016-08-26

Applicant: LG ELECTRONICS INC.

Inventor： Sunghyun Moon ,  Younghak Chang ,  Jina Jeon ,  Seonhoo Kim ,  Youngjoo Yee ,  Hwankuk Yuh

IPC: H01L25/075 ,  H01L21/677 ,  H01L21/683 ,  H01L33/22 ,  H01L33/00 ,  H01L33/62

Abstract: The present invention relates to a display device and, more particularly, to a transfer head for a semiconductor light-emitting device applied to the display device and a method for transferring a semiconductor light-emitting device. The transfer head for a semiconductor light-emitting device, according to the present invention, comprises: a base substrate; and an electrode unit disposed on the base substrate to generate an electrostatic force by charging an un-doped semiconductor layer of the semiconductor light-emitting device with electric charges, wherein the base substrate and the electrode unit are formed of light-transmitting materials so that at least a part of the semiconductor light-emitting device is viewable through the base substrate and the electrode unit in sequence.