公开(公告)号：US12183866B2

公开(公告)日：2024-12-31

申请号：US17623855

申请日：2019-07-19

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon Choi ,  Kyoungtae Wi

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/00

Abstract: Disclosed in the present specification is a micro LED display device, and a manufacturing method therefor, the method forming, in advance, an anisotropic conductive adhesive paste layer only on a conductive electrode part of a semiconductor light emitting element and on a peripheral part thereof, and then transferring the anisotropic conductive adhesive paste layer to a wiring substrate, thereby simultaneously performing a transfer step and a stable wiring step.

公开(公告)号：US11189767B2

公开(公告)日：2021-11-30

申请号：US16461282

申请日：2016-12-27

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon Choi ,  Kyoungtae Wi

IPC: H01L33/62 ,  H01L27/15

Abstract: The present invention relates to a display apparatus using a semiconductor light emitting device and a manufacturing method therefor and, more specifically, to a display apparatus using a semiconductor light emitting device. The display apparatus according to the present invention comprises: a wiring board which comprises a wiring electrode; a conductive adhesive layer which covers the wiring electrode; and a plurality of semiconductor light emitting devices which are coupled to the conductive adhesive layer and are electrically connected to the wiring electrode, wherein the conductive adhesive layer is applied in a patterned form on each electrode of the semiconductor light emitting devices such that a plurality of adhesive regions are provided spaced apart from each other on the wiring board.

公开(公告)号：US12107205B2

公开(公告)日：2024-10-01

申请号：US18083152

申请日：2022-12-16

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Sunghyun Moon ,  Jina Jeon

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/56 ,  H01L2933/0066

Abstract: A display device can include a wiring substrate including a first electrode, a plurality of semiconductor light-emitting elements electrically connected to the first electrode, a conductive adhesive layer on the wiring substrate and around the plurality of semiconductor light-emitting elements, an upper layer on one surface of the conductive adhesive layer and including a plurality of through holes corresponding to the plurality of semiconductor light-emitting elements, respectively, and a second electrode on the upper layer and electrically connected to the plurality of semiconductor light-emitting elements. The upper layer can include a thermosetting adhesive.

公开(公告)号：US11799063B2

公开(公告)日：2023-10-24

申请号：US17511268

申请日：2021-10-26

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon Choi ,  Kyoungtae Wi

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L2933/0066

Abstract: Discussed is a display apparatus including a wiring board having wiring electrodes; a conductive adhesive layer covering the wiring electrodes; a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to the wiring electrodes; and an insulating material disposed between the plurality of adhesive regions to fill between the plurality of semiconductor light emitting devices, wherein each electrode of the plurality of semiconductor light emitting devices includes a first conductive electrode, a first conductive semiconductor layer on the first conductive electrode, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, and a second conductive electrode on the second conductive semiconductor layer, and wherein the second conductive electrode is disposed on one surface of the second conductive semiconductor layer.

公开(公告)号：US12166154B2

公开(公告)日：2024-12-10

申请号：US17257686

申请日：2018-09-27

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Byungjoon Rhee

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/12 ,  H01L33/62 ,  G09F9/30

Abstract: Discussed is a display device, including a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light-emitting elements electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the plurality of semiconductor light-emitting elements and formed of a mixture of conductive particles and an insulating material; and a buffer portion disposed on a lower surface of a semiconductor light-emitting element of the plurality of semiconductor light-emitting elements so as to allow the wiring electrode and the semiconductor light-emitting element to be spaced apart by a predetermined distance, and provided with at least one hole, wherein the mixture of the conductive particles and the insulating material is disposed inside the at least one hole, and the wiring electrode is electrically connected to the semiconductor light-emitting element through conductive particles disposed inside the at least one hole.

公开(公告)号：US11557705B2

公开(公告)日：2023-01-17

申请号：US16965235

申请日：2018-01-29

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Sunghyun Moon ,  Jina Jeon

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/56

Abstract: The present invention relates to a method for manufacturing a display device using semiconductor light-emitting elements and a display device. The method for manufacturing a display device according to the present invention comprises the steps of: transferring semiconductor light-emitting elements provided on a growth substrate to an adhesive layer of a temporary substrate; curing the adhesive layer of the temporary substrate; aligning the temporary substrate with a wiring substrate having a wiring electrode and a conductive adhesive layer; compressing the temporary substrate to the wiring substrate so that the semiconductor light-emitting elements bond to the wiring substrate together with the adhesive layer of the temporary substrate, and then removing the temporary substrate; and removing at least a part of the adhesive layer to expose the semiconductor light-emitting elements to the outside, and depositing electrodes on the semiconductor light-emitting elements.

公开(公告)号：US09865572B2

公开(公告)日：2018-01-09

申请号：US15376888

申请日：2016-12-13

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Byungjoon Rhee ,  Bongchu Shim

IPC: H01L25/075 ,  H01L27/15 ,  H01L23/00 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56 ,  H05K3/32

CPC classification number: H01L25/0753 ,  G06F1/1652 ,  H01L24/29 ,  H01L24/32 ,  H01L24/95 ,  H01L27/156 ,  H01L33/38 ,  H01L33/385 ,  H01L33/504 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2933/0091 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/10106

Abstract: A display device including a substrate including a wiring electrode; a conductive adhesive layer including an anisotropic conductive medium, and disposed to cover the wiring electrode; and a plurality of semiconductor light emitting devices adhered to the conductive adhesive layer and electrically connected to the wiring electrode through the anisotropic conductive medium. Further, the conductive adhesive layer includes a first layer disposed on the substrate; a second layer deposited on the first layer and including the anisotropic conductive medium; and a third layer deposited on the second layer, to which the semiconductor light emitting devices are adhered. Further, at least one of the second layer and the third layer includes a white pigment configured to reflect light emitted by the semiconductor light emitting device.