公开(公告)号：US20170228071A1

公开(公告)日：2017-08-10

申请号：US15503472

申请日：2015-08-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Yeo Eun YOON ,  Ho Min LEE ,  Jun Phill EOM ,  Joon Ki HONG ,  Dong Mug SEONG ,  Dong Keon LEE

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F3/0416 ,  G06F2203/04112

Abstract: A touch window includes a substrate including an available area and an unavailable area; and an electrode layer formed on the substrate, wherein the electrode layer includes a conductive layer and a protective layer formed on the conductive layer, the protective layer is in direct contact with the conductive layer, the protective layer has a thickness different from that of the conductive layer, and the protective layer includes a black-based color.

公开(公告)号：US20150305152A1

公开(公告)日：2015-10-22

申请号：US14647721

申请日：2013-11-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Geon Young KIL ,  Myeong Jeong KIM ,  Jae Man PARK ,  Jong Heum YOON ,  Jeung Ook PARK ,  Sung Jin YUN ,  Jong Sik LEE ,  Sang A. JU ,  Yeo Eun YOON

IPC: H05K1/03 ,  C08G59/22 ,  C09K5/14 ,  C08G59/56 ,  C08L63/00 ,  H05K1/05 ,  C08K3/22 ,  C08G59/50

CPC classification number: H05K1/0373 ,  C08G59/226 ,  C08G59/245 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/56 ,  C08G2250/00 ,  C08K3/013 ,  C08K3/22 ,  C08K5/41 ,  C08K2003/2227 ,  C08L63/00 ,  C08L2203/20 ,  C09K5/14 ,  H01B3/40 ,  H05K1/056 ,  H05K2201/0209

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract translation: 根据本发明实施方案的环氧树脂组合物包括环氧化合物，包括二氨基二苯砜和无机填料的固化剂。

公开(公告)号：US20210029818A1

公开(公告)日：2021-01-28

申请号：US16982157

申请日：2019-03-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Yeo Eun YOON ,  Seok BAE

IPC: H05K1/02 ,  H05K7/20 ,  C08K3/38

Abstract: The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 μm, a D10 of 10 to 25 μm, and a D90 of 75 to 85 μm, and the θ50 of the flat boron nitride is arranged to form an angle of 40° or less with horizontal components of the sheet layer.

公开(公告)号：US20150319855A1

公开(公告)日：2015-11-05

申请号：US14651771

申请日：2013-12-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Yeo Eun YOON ,  Myeong Jeong KIM ,  Sungjin YUN ,  Sanga JU

IPC: H05K1/03 ,  C08K3/22

CPC classification number: H05K1/0373 ,  C08G59/22 ,  C08G59/245 ,  C08G59/4064 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08L63/00 ,  H05K1/053 ,  H05K2201/0209

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.

Abstract translation: 根据本发明的一个实施方案，环氧树脂组合物包括：包含环氧化合物，三亚乙基二胺，二苯基膦和/或四苯基硼酸盐的树脂; 包括二氨基二苯砜，乙二胺，二氨基丙烷，甲二胺，苯二胺和/或三乙醇胺的固化剂; 和无机填料，其中所述无机填料包括至少两个按粒径分级的氧化铝（Al2O3）。