公开(公告)号：US20140036477A1

公开(公告)日：2014-02-06

申请号：US14043886

申请日：2013-10-02

Applicant: LG Innotek Co., Ltd.

Inventor： Ji Won JANG ,  Sung Yong PARK ,  Se Jin KO ,  Sung Ho KIM

IPC: F21V7/00 ,  F21V13/04

CPC classification number: F21V7/00 ,  F21V13/04 ,  F21V13/12 ,  G02B6/0068 ,  G02F1/133615 ,  G02F2201/34

Abstract: A backlight unit and a display apparatus using the same are disclosed. The backlight unit includes a first reflector, a second reflector partially having an inclined surface, a plurality of light sources disposed between the first reflector and the second reflector, and a third reflector disposed between adjacent light sources.

公开(公告)号：US20210305475A1

公开(公告)日：2021-09-30

申请号：US17261935

申请日：2019-06-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Min KONG ,  Sung Ho KIM ,  Taek Kyun KIM

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/38 ,  H01L33/46

Abstract: A light emitting device package according to an embodiment comprises: first and second frames disposed spaced apart from each other; a body disposed surrounding the first and second frames and having first and second openings spaced apart from each other; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive parts disposed in the first and second openings respectively, wherein the first and second openings perpendicularly overlap the first and second frames respectively, the first and second conductive parts are electrically connected to the first and second frames respectively, the first and second bonding parts are disposed in the first and second openings respectively, and are electrically connected to the first and second conductive parts, and the light emitting device includes a support region disposed on the body outside the first and second openings. In addition, a light source module, according to an embodiment, comprises a circuit board and at least one light emitting device package disposed on the circuit board.

公开(公告)号：US20170222109A1

公开(公告)日：2017-08-03

申请号：US15413549

申请日：2017-01-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Ho KIM

IPC: H01L33/62 ,  H01L25/13

CPC classification number: H01L33/62 ,  H01L25/13 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: A light emitting device package is provided. The light emitting device package may include a body having first to sixth side surfaces and a cavity on the first side surface, first and second lead frames on a bottom of the cavity, and a light emitting chip on at least one of the first and second lead frames. The first and second lead frames may have first and second bonding portions on first and second outer side areas of the body and a first heat and second radiating portions bent from the first and second bonding portions. The first and second recesses may include an upper area inclined at a first angle and a lower areas inclined at a second angle from the upper area. The second angle may be smaller than the first angle, and the first and second heat radiating portions of the first and second lead frames may be provided on the lower areas.

公开(公告)号：US20140268640A1

公开(公告)日：2014-09-18

申请号：US14285417

申请日：2014-05-22

Applicant: LG Innotek Co., Ltd.

Inventor： Tae Young CHOI ,  Won Jin SON ,  Dong Nyung LIM ,  Jung Ha HWANG ,  Seung Yeon LEE ,  Cheon Joo KIM ,  Sung Ho KIM

IPC: F21V29/00 ,  F21V23/00

CPC classification number: F21V29/74 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V19/0055 ,  F21V23/005 ,  F21V23/006 ,  F21V29/773 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/00 ,  F21Y2113/13 ,  F21Y2115/10

Abstract: A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

Abstract translation: 照明装置包括：散热器，其包括一个表面和接收凹部; 发光模块，其设置在所述散热器的一个表面上，并且包括基板和设置在所述基板上的多个光源，其中，所述基板具有设置在所述散热板中心的第一孔和第二孔; 电源控制器，其通过所述基板的所述第二孔与所述发光模块电连接并且设置在所述散热器的所述接收凹部中，其中所述发光模块包括第一发光模块，所述第一发光模块包括第一基板和第一光 源和包括第二基板和第二光源的第二发光模块，其中所述第一基板和所述第二基板彼此相邻设置。