公开(公告)号：US11078388B2

公开(公告)日：2021-08-03

申请号：US16331117

申请日：2017-09-07

Applicant: LINTEC CORPORATION

Inventor： Kenta Nishijima ,  Tatsuki Hasegawa

IPC: C09J7/35 ,  C09J7/40 ,  H01L31/048 ,  H01L51/52 ,  C09J123/26 ,  C09J163/00 ,  C09J11/06 ,  B32B27/32 ,  H05B33/04 ,  H01L51/50 ,  B32B27/00 ,  C09J7/00 ,  G02F1/1339 ,  B32B27/38 ,  C09J11/08 ,  C09J7/30

Abstract: Provided is an adhesive composition containing component (A) (a modified polyolefin-based resin) and component (B) (a polyfunctional epoxy compound), wherein as a result of measuring a storage elastic modulus of a solid content, a storage elastic modulus at 23° C. is 0.1 to 600 MPa, and a storage elastic modulus at 80° C. is 0.1 MPa or lower. Also provided are: a sealing sheet having an adhesive layer formed using the adhesive composition, and a sealed body comprising a seal object that is sealed with the sealing sheet. The adhesive composition is easy to form into a sheet and excellent in unevenness followability. The sealing sheet has an adhesive layer which is formed of this adhesive composition and is excellent in unevenness followability, and a sealed body has a seal object sealed with the sealing sheet.

公开(公告)号：US10081741B2

公开(公告)日：2018-09-25

申请号：US14648580

申请日：2013-11-29

Applicant: LINTEC CORPORATION

Inventor： Kenta Nishijima ,  Satoshi Naganawa ,  Emi Fuchi

IPC: C09J7/00 ,  C09J7/02 ,  C09J109/00 ,  H05B33/04 ,  H01L23/29 ,  C09J7/38 ,  H01L51/52

CPC classification number: C09J7/383 ,  C09J109/00 ,  C09J2201/622 ,  C09J2409/00 ,  C09J2413/00 ,  C09J2413/003 ,  H01L23/296 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: The present invention provides: an adhesive composition comprising a diene-based rubber (A) that includes a radiation-curable functional group, a cured adhesive layer having a thickness of 60 μm that is formed by curing the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 30 g/(m2·day) or less; an adhesive sheet comprising a curable adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and sufficient cohesive strength, and exhibits adhesion and holding power in a well-balanced manner, an adhesive sheet that includes an adhesive layer that is formed using the adhesive composition, and an electronic device that includes a sealing material that is formed using the adhesive composition.

公开(公告)号：US11162003B2

公开(公告)日：2021-11-02

申请号：US15778746

申请日：2016-11-24

Applicant: LINTEC CORPORATION

Inventor： Kenta Nishijima ,  Tatsuki Hasegawa

IPC: C09J7/35 ,  C09J7/40 ,  H01L31/048 ,  H01L51/52 ,  C09J7/20 ,  C09J151/06 ,  H05B33/04 ,  C09J163/00 ,  C09J7/30 ,  H01L51/50 ,  C09J11/06 ,  C09J7/10

Abstract: Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.

公开(公告)号：US10967618B2

公开(公告)日：2021-04-06

申请号：US16085858

申请日：2017-03-16

Applicant: LINTEC CORPORATION

Inventor： Takumi Furuya ,  Satoshi Naganawa ,  Yuta Suzuki ,  Kenta Nishijima

IPC: B32B27/30 ,  B32B27/32 ,  C09D123/02 ,  C09D4/06 ,  C08J7/04 ,  C08J5/18 ,  C08L23/02 ,  C08K5/5419

Abstract: The present invention is: a curable composition for forming a primer layer of a gas barrier laminated film, comprising at least a polar group-containing polyolefin polymer and a polyfunctional acrylate compound; a gas barrier laminated film having a primer layer made of a cured product of the curable composition; and a gas barrier laminate including an organic compound-containing layer laminated on the surface of the gas barrier laminated film. The present invention provides: a curable composition that is for forming a primer layer suitably used in manufacturing a gas barrier laminate excellent in interlayer adhesion, a gas barrier laminated film having a primer layer made of the cured product of the curable composition, and a gas barrier laminate comprising an organic compound-containing layer laminated on the surface of the gas barrier laminated film.

公开(公告)号：US09809728B2

公开(公告)日：2017-11-07

申请号：US14648579

申请日：2013-11-29

Applicant: LINTEC CORPORATION

Inventor： Kenta Nishijima ,  Satoshi Naganawa ,  Emi Fuchi

IPC: C09J7/02 ,  C09J123/22 ,  H05B33/04 ,  H01L51/52 ,  B32B37/12 ,  B32B37/18 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: C09J7/02 ,  B32B37/12 ,  B32B37/182 ,  B32B2307/412 ,  B32B2457/206 ,  C09J7/383 ,  C09J123/22 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2400/10 ,  C09J2409/00 ,  C09J2423/00 ,  C09J2467/005 ,  C09J2467/006 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/564 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

公开(公告)号：US20150299519A1

公开(公告)日：2015-10-22

申请号：US14648579

申请日：2013-11-29

Applicant: LINTEC CORPORATION

Inventor： Kenta Nishijima ,  Satoshi Naganawa ,  Emi Fuchi

IPC: C09J7/02 ,  B32B37/12 ,  H01L51/52 ,  B32B37/18

CPC classification number: C09J7/02 ,  B32B37/12 ,  B32B37/182 ,  B32B2307/412 ,  B32B2457/206 ,  C09J7/383 ,  C09J123/22 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2400/10 ,  C09J2409/00 ,  C09J2423/00 ,  C09J2467/005 ,  C09J2467/006 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/564 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

Abstract translation: 本发明提供：一种用于密封电子器件的粘合剂组合物，所述粘合剂组合物包含异丁烯 - 异戊二烯共聚物作为主要成分，所述异丁烯 - 异戊二烯共聚物的衍生自异戊二烯的重复单元的含量为0.1-99mol％，基于 总重复单位 包含阻气膜的粘合片和形成在阻气膜上的粘合剂层，所述阻气膜在40℃的温度和90％的相对湿度为0.1g时具有水蒸气透过率 / m 2 /天以下，总透光率为80％以上，粘合剂层含有以异丁烯 - 异戊二烯共聚物为主要成分的粘合剂组合物。 以及其中粘合剂组合物和粘合片用作有机电致发光元件等的密封剂的电子设备等。 根据本发明，提供了一种粘合剂组合物，其可用作形成粘合剂层的材料，其具有优异的阻水性和优异的粘合性; 粘合片; 和电子设备等。

公开(公告)号：US20150240133A1

公开(公告)日：2015-08-27

申请号：US14427517

申请日：2013-10-28

Applicant: LINTEC CORPORATION

Inventor： Hidekazu Nakayama ,  Kazue Uemura ,  Yoshitomo Ono ,  Kenta Nishijima

IPC: C09J125/08 ,  H01L51/00 ,  C09J7/02 ,  C09J123/22

CPC classification number: C09J125/08 ,  B32B27/06 ,  B32B27/12 ,  B32B27/302 ,  B32B2307/7242 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/202 ,  C09J7/381 ,  C09J7/387 ,  C09J123/08 ,  C09J123/22 ,  C09J153/02 ,  C09J2203/318 ,  C09J2423/00 ,  C09J2453/00 ,  H01L51/0035 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/5246 ,  H05B33/04 ,  Y10T428/31938

Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing a polyisobutylene-based resin (A) having a mass-average molecular weight of 20000 or more, a styrene-based copolymer (B), and a tackifier (C) having a softening point of 135° C. or less, wherein the component (B) is one or more selected from the group consisting of a styrene-butadiene-styrene triblock copolymer (SBS), a styrene-block-(ethylene-co-butylene)-block-styrene triblock copolymer (SEBS), a styrene-isobutylene diblock copolymer (SIB), and a styrene-isobutylene-styrene triblock copolymer (SIBS), has excellent adhesive force, excels in a suppressing effect on moisture intrusion, and has good transparency.

Abstract translation: 一种压敏粘合片，其具有由含有质均分子量为20000以上的聚异丁烯系树脂（A）的粘合剂组合物，苯乙烯系共聚物（B），苯乙烯系共聚物 和软化点为135℃以下的增粘剂（C），其中，成分（B）为选自苯乙烯 - 丁二烯 - 苯乙烯三嵌段共聚物（SBS），苯乙烯 - 嵌段 - （乙烯 - 共 - 丁烯） - 嵌段 - 苯乙烯三嵌段共聚物（SEBS），苯乙烯 - 异丁烯二嵌段共聚物（SIB）和苯乙烯 - 异丁烯 - 苯乙烯三嵌段共聚物（SIBS）具有优异的粘合力， 抑制对水分侵入的影响，具有良好的透明度。