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    Integrated circuit leadless package system
    1.
    发明授权
    Integrated circuit leadless package system 有权
    集成电路无引线封装系统

    公开(公告)号：US07498665B2

    公开(公告)日：2009-03-03

    申请号：US11381726

    申请日：2006-05-04

    申请人： Leocadio M. Alabin ,  Il Kwon Shim ,  Henry D. Bathan ,  Jeffrey D. Punzalan

    发明人： Leocadio M. Alabin ,  Il Kwon Shim ,  Henry D. Bathan ,  Jeffrey D. Punzalan

    IPC分类号： H01L23/495 ,  H01L21/44

    CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

    摘要： An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.

    摘要翻译： 提供了一种集成电路无引线封装系统，包括形成QFN引线框架，包括提供管芯焊盘，在管芯焊盘上形成鱼尾连接杆，在管芯焊盘周围形成一排外部接触焊盘，形成附近的外部接触焊盘 钓鱼连接杆，并且从外部接触垫形成交错位置的内部接触垫，将集成电路安装在QFN引线框架的管芯焊盘上，以及将来自集成电路的接合线附接到附加的外部接触焊盘 。

    Offset etched corner leads for semiconductor package
    2.
    发明授权
    Offset etched corner leads for semiconductor package 有权
    用于半导体封装的偏移蚀刻角引线

    公开(公告)号：US07598598B1

    公开(公告)日：2009-10-06

    申请号：US10910089

    申请日：2004-08-03

    申请人： Ludovico Bancod ,  Gregorio G. Dela Cruz ,  Fidelyn R. Canoy ,  Leocadio M. Alabin

    发明人： Ludovico Bancod ,  Gregorio G. Dela Cruz ,  Fidelyn R. Canoy ,  Leocadio M. Alabin

    IPC分类号： H01L23/495

    CPC分类号： H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.

    摘要翻译： 一种包括引线框的半导体封装。 引线框本身包括限定中心开口的外框部分。 设置在中心开口内的是一个芯片焊盘，该焊盘限定了相对的，大致平坦的顶部和底部焊盘表面以及外围边缘。 连接到外框架部分和芯片垫的周边边缘之间并且延伸的至少一个引线框架的连接杆。 引线框架还包括多个引线，其连接到外部框架部分并且至少部分地围绕芯片焊盘延伸到与其外围边缘间隔开的开口中。 每个引线包括相对的，大致平坦的顶部和底部引线表面，其中至少两个引线包括沿着连接条的相对侧延伸的角引线。 每个拐角引线还限定了一个沿连接杆延伸并且与连杆间隔开的角度偏移的远端部分。

    Offset etched corner leads for semiconductor package
    3.
    发明授权
    Offset etched corner leads for semiconductor package 有权
    用于半导体封装的偏移蚀刻角引线

    公开(公告)号：US06847099B1

    公开(公告)日：2005-01-25

    申请号：US10358621

    申请日：2003-02-05

    申请人： Ludovico Bancod ,  Gregorio G. Dela Cruz ,  Fidelyn R. Canoy ,  Leocadio M. Alabin

    发明人： Ludovico Bancod ,  Gregorio G. Dela Cruz ,  Fidelyn R. Canoy ,  Leocadio M. Alabin

    IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/495

    CPC分类号： H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.

    摘要翻译： 一种包括引线框的半导体封装。 引线框本身包括限定中心开口的外框部分。 设置在中心开口内的是一个芯片焊盘，该焊盘限定了相对的，大致平坦的顶部和底部焊盘表面以及外围边缘。 连接到外框架部分和芯片垫的周边边缘之间并且延伸的至少一个引线框架的连接杆。 引线框架还包括多个引线，其连接到外部框架部分并且至少部分地围绕芯片焊盘延伸到与其外围边缘间隔开的开口中。 每个引线包括相对的，大致平坦的顶部和底部引线表面，其中至少两个引线包括沿着连接条的相对侧延伸的角引线。 每个拐角引线还限定了一个沿连接杆延伸并且与连杆间隔开的角度偏移的远端部分。