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公开(公告)号：US08274145B2
公开(公告)日：2012-09-25
申请号：US11773951
申请日：2007-07-05
申请人： Leocadio M. Alabin , Librado Gatbonton , Chiu Hsieh Ong , Beng Yee Teh , Antonio B. Dimaano, Jr.
发明人： Leocadio M. Alabin , Librado Gatbonton , Chiu Hsieh Ong , Beng Yee Teh , Antonio B. Dimaano, Jr.
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L23/3735 , H01L23/49838 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2924/00014 , H01L2924/01015 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
摘要翻译： 一种半导体封装系统，包括：提供其上具有热释放的衬底; 将掩模沉积在基底和热释放物上，掩模沉积在热浮雕上并具有规则图案以部分地覆盖热释放; 并将半导体管芯贴在热浮雕上。
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公开(公告)号：US07936055B2
公开(公告)日：2011-05-03
申请号：US11466748
申请日：2006-08-23
IPC分类号： H01L23/495 , H01L21/44
CPC分类号： H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L23/49568 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a first external interconnect and a die paddle having a slot, forming an inner terminal from a peripheral region of the die paddle, connecting an integrated circuit die and the peripheral region for ground connection, and molding through the slot.
摘要翻译： 提供了一种集成电路封装系统，包括形成第一外部互连和具有槽的管芯，从管芯的外围区域形成内部端子，连接集成电路管芯和用于接地连接的外围区域，以及通过 插槽。
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公开(公告)号：US07741707B2
公开(公告)日：2010-06-22
申请号：US11307906
申请日：2006-02-27
IPC分类号： H01L23/02
CPC分类号： H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2924/01015 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/32225 , H01L2924/00
摘要： A stackable integrated circuit package system is provided placing a first integrated circuit die having an interconnect provided thereon in a substrate having a cavity, encapsulating the first integrated circuit die, having the interconnect exposed, in the cavity and along a first side of the substrate, mounting a second integrated circuit die to the first integrated circuit die, and encapsulating the second integrated circuit die along a second side of the substrate.
摘要翻译： 提供了一种可堆叠的集成电路封装系统，其将具有设置在其上的互连的第一集成电路管芯放置在具有空腔的衬底中，所述衬底具有空腔，将具有互连的第一集成电路管芯在空腔中并沿着衬底的第一侧封装， 将第二集成电路管芯安装到第一集成电路管芯上，并沿着衬底的第二侧封装第二集成电路管芯。
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公开(公告)号：US07545032B2
公开(公告)日：2009-06-09
申请号：US11456544
申请日：2006-07-10
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US08536689B2
公开(公告)日：2013-09-17
申请号：US11163035
申请日：2005-10-03
IPC分类号： H01L23/495 , H01L21/44
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/27013 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including an integrated circuit package system including an integrated circuit and a lead frame. The lead frame has a multi-surface die attach pad and the integrated circuit is mounted to the multi-surface die attach pad.
摘要翻译： 提供一种集成电路封装系统，其包括集成电路封装系统，其包括集成电路和引线框架。 引线框架具有多表面管芯连接焊盘，并且集成电路安装到多表面管芯附接焊盘。
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公开(公告)号：US08421197B2
公开(公告)日：2013-04-16
申请号：US13023244
申请日：2011-02-08
IPC分类号： H01L23/48 , H01L23/50 , H01L23/49 , H01L23/495
CPC分类号： H01L23/4951 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27436 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: a semiconductor chip; a stress-relieving layer on the semiconductor chip; an adhesion layer on the stress relieving layer; and electrical interconnects bonded to the adhesion layer.
摘要翻译： 集成电路封装系统包括：半导体芯片; 半导体芯片上的应力消除层; 应力消除层上的粘附层; 以及结合到粘合层的电互连。
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7.发明授权公开(公告)号：US07777320B2
公开(公告)日：2010-08-17
申请号：US12236437
申请日：2008-09-23
IPC分类号： H01L23/02
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/49575 , H01L24/16 , H01L24/28 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/03 , H01L25/50 , H01L2224/04042 , H01L2224/16145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/81801 , H01L2224/83192 , H01L2224/85001 , H01L2224/85005 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation; mounting an outer lead on the periphery of the base package; mounting a second integrated circuit above the base package and connected to the outer lead with the interconnects; and partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
摘要翻译： 一种集成电路封装系统，包括：提供具有第一集成电路的基底封装，其第一集成电路在其周边上具有内部引线并与其互连，并且内部引线部分地被内部封装封装; 将外引线安装在基底封装的周边上; 将第二集成电路安装在基底封装上方并与互连件连接到外引线; 并且部分地封装基部封装和外部引线，外部封装留下内部引线的底表面和暴露的外部引线的底部表面。
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8.发明授权公开(公告)号：US07556987B2
公开(公告)日：2009-07-07
申请号：US11428272
申请日：2006-06-30
IPC分类号： H01L21/00 , H01L23/495 , H01R43/00 , H05K5/02
CPC分类号： H01L23/49503 , H01L21/4828 , H01L23/3107 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/29007 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , Y10T29/49124 , Y10T29/49204 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a D-ring comprising half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.
摘要翻译： 提供一种集成电路封装系统，包括形成D形环，其包括半蚀刻桨，蚀刻环和蚀刻连接条。 连杆在桨和环之间。 该系统还包括将集成电路管芯安装在D形环的中心部分上，连接集成电路管芯和D形环，并封装集成电路管芯和D环的一部分。
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9.发明授权公开(公告)号：US07541222B2
公开(公告)日：2009-06-02
申请号：US11530802
申请日：2006-09-11
CPC分类号： H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/48992 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3862 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/85399 , H01L2224/05599
摘要： A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.
摘要翻译： 一种用于制造抗线扫描半导体封装件的方法提供附接到插入件的管芯。 管芯通过导线与插入器电连接。 在导线上的模具上施加密封剂以防止电线扫掠，并且密封剂与插入件不接触。 模具，插入件，导线和密封剂被封装在密封剂中。
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公开(公告)号：US07479692B2
公开(公告)日：2009-01-20
申请号：US11558413
申请日：2006-11-09
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
摘要翻译： 提供了一种集成电路封装系统，包括形成桨叶，在桨中形成具有凹槽的环，将器件安装在凹槽中，在环中形成槽，以及将散热器安装在器件上的槽中。
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