公开(公告)号：US08550031B2

公开(公告)日：2013-10-08

申请号：US13524854

申请日：2012-06-15

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.

摘要翻译： 本发明的实施例通常包括机器人组件，其包括可操作以在平面内的一个或多个点处定位衬底的机器人，以及具有可操作以将机器人沿大致平行于第一方向的方向定位的电动机的运动组件。 运动组件包括机器人支撑接口，其具有耦合到其上的机器人，以及一个或多个壁，其形成电机被封闭的内部区域。 壁限定了机器人支撑接口行进的细长开口，电动机可操作以在细长的开口中横向移动机器人支撑界面。 运动组件还包括与内部区域流体连通的一个或多个风扇组件。 风扇组件可操作以在内部区域中产生低于大气压的压力，从而使气体通过细长的开口流入内部区域。

公开(公告)号：US08215262B2

公开(公告)日：2012-07-10

申请号：US12254784

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.

摘要翻译： 实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在集群工具中处理的衬底具有更可重复的晶片历史，并且还 集群工具具有更小的系统占用空间。 在一个实施例中，用于处理衬底的簇工具包括第一处理架，第一机器人组件和可操作以将衬底传送到第一处理架中的衬底处理室的第二机器人组件和水平运动组件。 水平运动组件包括形成电动机被封闭的内部区域的一个或多个壁。 所述一个或多个壁限定机器人支撑接口行进的细长开口，所述机器人支撑界面支撑水平运动组件的机器人。

公开(公告)号：US20120055916A1

公开(公告)日：2012-03-08

申请号：US13036915

申请日：2011-02-28

申请人： Leon Volfovski ,  Harald Herchen ,  Jay D. Pinson

发明人： Leon Volfovski ,  Harald Herchen ,  Jay D. Pinson

IPC分类号： H05B3/68 ,  H05B1/00

CPC分类号： H05B3/68

摘要： A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.

摘要翻译： 快速温度变化（RTC）系统包括包括散热器的烘烤板组件; 联接到散热器的加热器基板; 以及耦合到所述加热器基板的加热器层。 RTC系统还包括邻近烘烤板组件定位的被动冷却结构。 被动冷却结构可移动以与加热器层物理接触。 被动冷却结构包括冷却板和耦合到冷却板的散热垫。 RTC系统还包括邻近被动冷却结构定位的主动冷却结构。 被动冷却结构可移动以与主动冷却结构物理接触。

公开(公告)号：US20080199282A1

公开(公告)日：2008-08-21

申请号：US12106824

申请日：2008-04-21

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US20090064929A1

公开(公告)日：2009-03-12

申请号：US12254784

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

IPC分类号： B05C13/02

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20090064928A1

公开(公告)日：2009-03-12

申请号：US12254750

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US07743728B2

公开(公告)日：2010-06-29

申请号：US12106824

申请日：2008-04-21

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US20090067956A1

公开(公告)日：2009-03-12

申请号：US12254778

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： H01L21/67

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20080223293A1

公开(公告)日：2008-09-18

申请号：US12033837

申请日：2008-02-19

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05B7/06

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： A cluster tool for processing a substrate includes a cassette and a processing module including a first process chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing modules also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

摘要翻译： 用于处理衬底的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括机器人，该机器人被配置为在输入室中接纳基板，并将基板传送和定位在第一处理室和第二处理室中。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷冻转运组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。

公开(公告)号：US07357842B2

公开(公告)日：2008-04-15

申请号：US11112281

申请日：2005-04-22

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

摘要翻译： 用于处理基板的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括被配置为在输入室中接收基板并将基板传送和定位在第一处理室和第二处理室中的机器人。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷却的传送臂组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。