Strength enhancing additive for certain portland cements
    7.
    发明授权
    Strength enhancing additive for certain portland cements 失效
    某些波特兰水泥的强度增强添加剂

    公开(公告)号:US5084103A

    公开(公告)日:1992-01-28

    申请号:US561754

    申请日:1990-08-02

    IPC分类号: C04B24/12 C04B28/04

    摘要: This invention relates to a method of producing enhanced strength portland cements. Under the process of this invention, certain portland cements, in particular those containing at least 4% C.sub.4 AF and up to 0.2% of a strength enhancing additive comprising triisopropanolamine, exhibit a marked increase in 7 and 28 day compressive strength. The triisopropanolamine strength enhancing additive may be admixed with cement powder or may be interground as a grinding aid with cement clinker during finish milling.

    摘要翻译: 本发明涉及生产增强型强力硅酸盐水泥的方法。 在本发明的过程中,某些波特兰水泥,特别是含有至少4%C 4 AF和至多0.2%的包含三异丙醇胺的强度增强添加剂的波特兰水泥表现出7和28天压缩强度的显着增加。 三异丙醇胺强度增强添加剂可以与水泥粉末混合,或者可以在研磨过程中作为研磨助剂与水泥熟料进行相互作用。

    Strength enhancing additive for certain portland cements
    8.
    发明授权
    Strength enhancing additive for certain portland cements 失效
    某些波特兰水泥的强度增强添加剂

    公开(公告)号:US4990190A

    公开(公告)日:1991-02-05

    申请号:US418071

    申请日:1989-10-06

    IPC分类号: C04B24/12 C04B28/04

    摘要: This invention relates to a method of producing enhanced strength portland cements. Under the process of this invention, certain portland cements, in particular those containing at least 4% C.sub.4 AF and up to 0.2% of a strength enhancing additive comprising triisopropanolamine, exhibit a marked increase in 7 and 28 day compressive strength. The triisopropanolamine strength enhancing additive may be admixed with cement powder or may be interground as a grinding aid with cement clinkder during finish milling.

    摘要翻译: 本发明涉及一种生产增强型强力硅酸盐水泥的方法。 在本发明的过程中,某些波特兰水泥,特别是含有至少4%C 4 AF和至多0.2%的包含三异丙醇胺的强度增强添加剂的波特兰水泥表现出7和28天压缩强度的显着增加。 三异丙醇胺强度增强添加剂可以与水泥粉混合,或者可以在研磨过程中作为研磨助剂与水泥熟料进行相互作用。

    Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor
    9.
    发明申请
    Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor 失效
    通过具有带状通孔信号导体的通孔基板

    公开(公告)号:US20130009322A1

    公开(公告)日:2013-01-10

    申请号:US13535377

    申请日:2012-06-28

    IPC分类号: H01L23/48 H01L21/768

    摘要: A TSV structure suitable for high speed signal transmission includes a metal strip portion that extends through a long and small diameter hole in a substrate. In one example, the metal strip portion is formed by laser ablating away portions of a metal sheath that lines a cylindrical sidewall of the hole, thereby leaving a longitudinal section of metal that is the metal strip portion. A second metal strip portion, that extends in a direction perpendicular to the hole axis, is contiguous with the metal strip portion that extends through the hole such that the two metal strip portions together form a single metal strip. Throughout its length, the single metal strip has a uniform width and thickness and therefore can have a controlled and uniform impedance. In some embodiments, multiple metal strips pass through the same TSV hole. In some embodiments, the structure is a coaxial TSV.

    摘要翻译: 适用于高速信号传输的TSV结构包括延伸穿过衬底中长而小直径的孔的金属条部分。 在一个实例中,金属带部分通过激光烧蚀来形成,该金属护套的一部分沿着孔的圆柱形侧壁排列,从而留下作为金属条部分的金属的纵向截面。 沿与孔轴垂直的方向延伸的第二金属带部分与延伸穿过孔的金属条部分邻接,使得两个金属带部分一起形成单个金属带。 在其整个长度上,单个金属条具有均匀的宽度和厚度,因此可以具有受控且均匀的阻抗。 在一些实施例中,多个金属条通过相同的TSV孔。 在一些实施例中,该结构是同轴TSV。