公开(公告)号：US09562179B2

公开(公告)日：2017-02-07

申请号：US14868421

申请日：2015-09-29

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC: C09J133/08 ,  C09J163/10 ,  C08L33/08 ,  C08L63/10 ,  C08L63/00 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08K5/00 ,  H01L21/683 ,  H01L23/495 ,  H01L23/00

CPC classification number: C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract translation: 描述了一种粘合剂组合物，其包括丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 粘合剂组合物在即使暴露于严格的回流条件下也安装了厚度减小的半导体芯片的封装中实现了高可靠性。 还描述了具有包括上述粘合剂组合物的粘合剂层的粘合片。

公开(公告)号：US20160017188A1

公开(公告)日：2016-01-21

申请号：US14868421

申请日：2015-09-29

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC: C09J133/08

CPC classification number: C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent.The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract translation: 描述了一种粘合剂组合物，其包括丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 粘合剂组合物在即使暴露于严格的回流条件下也安装了厚度减小的半导体芯片的封装中实现了高可靠性。 还描述了具有包括上述粘合剂组合物的粘合剂层的粘合片。