公开(公告)号：US12288768B2

公开(公告)日：2025-04-29

申请号：US17636309

申请日：2020-08-20

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa ,  Hidekazu Nakayama ,  Yosuke Sato

IPC: H01L23/00 ,  B22F7/08 ,  B32B7/06 ,  B32B7/12 ,  B32B15/04

Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.

公开(公告)号：US09296925B2

公开(公告)日：2016-03-29

申请号：US14418661

申请日：2013-08-02

Applicant: LINTEC Corporation

Inventor： Yoji Wakayama ,  Isao Ichikawa ,  Takashi Akutsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C09J7/02 ,  C09J163/00 ,  C08F220/18 ,  C08G18/75 ,  C08G18/80 ,  C08G18/10 ,  C09J133/06 ,  C09J175/16 ,  C09J133/14 ,  C09J133/00 ,  H01L21/78 ,  H01L23/00 ,  H01L21/683

CPC classification number: C09J7/0235 ,  C08F220/18 ,  C08G18/10 ,  C08G18/755 ,  C08G18/8029 ,  C08K5/5419 ,  C08L33/068 ,  C08L61/00 ,  C08L63/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/405 ,  C09J133/00 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/1405 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/463 ,  H01L2221/68381 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F2220/325 ,  C08F220/20 ,  C08F220/14 ,  C08G18/672 ,  C08G18/4825 ,  C08F2220/1858

Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.

Abstract translation: 通过形成含有可聚合硅氧烷化合物的能量射线固化性组合物和在25℃下的粘度为100-5,000,000mPa·S的能量射线固化性树脂的膜而得到膜。

公开(公告)号：US11707787B2

公开(公告)日：2023-07-25

申请号：US16605373

申请日：2018-02-13

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa

IPC: B22F7/04 ,  B22F5/00 ,  C09J1/00 ,  C09J133/08 ,  H01L21/683 ,  H01L23/00 ,  B22F1/10 ,  C08K3/08

CPC classification number: B22F7/04 ,  B22F1/10 ,  B22F5/006 ,  C09J1/00 ,  C09J133/08 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  C08K2003/0806 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384

Abstract: This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.

公开(公告)号：US11285536B2

公开(公告)日：2022-03-29

申请号：US16608288

申请日：2018-03-15

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa ,  Hidekazu Nakayama

IPC: B22F3/10 ,  B22F5/00 ,  B22F7/04 ,  H01L23/00

Abstract: A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1

公开(公告)号：US11267992B2

公开(公告)日：2022-03-08

申请号：US16646546

申请日：2018-09-04

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa ,  Hidekazu Nakayama ,  Akinori Sato

IPC: C09J7/10 ,  C09J11/04 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

公开(公告)号：US09562179B2

公开(公告)日：2017-02-07

申请号：US14868421

申请日：2015-09-29

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC: C09J133/08 ,  C09J163/10 ,  C08L33/08 ,  C08L63/10 ,  C08L63/00 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08K5/00 ,  H01L21/683 ,  H01L23/495 ,  H01L23/00

CPC classification number: C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract translation: 描述了一种粘合剂组合物，其包括丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 粘合剂组合物在即使暴露于严格的回流条件下也安装了厚度减小的半导体芯片的封装中实现了高可靠性。 还描述了具有包括上述粘合剂组合物的粘合剂层的粘合片。

公开(公告)号：US09382455B2

公开(公告)日：2016-07-05

申请号：US13832210

申请日：2013-03-15

Applicant: LINTEC Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: B32B27/30 ,  B32B27/38 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  H01L21/784 ,  H01L23/14 ,  C09J133/00 ,  H01L21/78 ,  H01L21/683 ,  B32B17/10 ,  C09J163/00 ,  C09J133/06 ,  H01L23/00 ,  H01L23/29

CPC classification number: C09J133/00 ,  B32B17/10697 ,  B32B17/10733 ,  B32B17/10743 ,  C09J133/066 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和表面具有反应性双键的填料（C）。

公开(公告)号：US20160017188A1

公开(公告)日：2016-01-21

申请号：US14868421

申请日：2015-09-29

Applicant: Lintec Corporation

Inventor： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC: C09J133/08

CPC classification number: C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent.The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract translation: 描述了一种粘合剂组合物，其包括丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 粘合剂组合物在即使暴露于严格的回流条件下也安装了厚度减小的半导体芯片的封装中实现了高可靠性。 还描述了具有包括上述粘合剂组合物的粘合剂层的粘合片。

公开(公告)号：US20130244401A1

公开(公告)日：2013-09-19

申请号：US13832170

申请日：2013-03-15

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: C09J133/00 ,  C09J5/00 ,  C09J7/35 ,  C09J133/06 ,  C09J133/066 ,  C09J133/14 ,  C09J133/24 ,  C09J143/04 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和具有双键基团的反应性的偶联剂（C）。

公开(公告)号：US11948865B2

公开(公告)日：2024-04-02

申请号：US16970484

申请日：2019-02-08

Applicant: LINTEC CORPORATION

Inventor： Takeshi Mori ,  Isao Ichikawa ,  Hidekazu Nakayama

IPC: H01L23/495 ,  B22F1/052 ,  B22F1/054 ,  B22F1/10 ,  B22F1/17 ,  B22F5/00 ,  B22F7/04 ,  C09J7/38

CPC classification number: H01L23/49513 ,  B22F1/052 ,  B22F1/054 ,  B22F1/056 ,  B22F1/10 ,  B22F5/006 ,  B22F7/04 ,  B22F1/17 ,  C09J7/38

Abstract: A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.